{"id":1263166,"url":"https://alion.io/job/intel-corporation-sort-interface-pathfinding-and-development-engineer","title":"Sort Interface Pathfinding and Development Engineer","company":{"id":35,"name":"Intel Corporation","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":60,"ghost_share":0,"stale_share":0.617,"repost_share":0.017,"time_to_fill_p50_days":29,"computed_at":"2026-09-29T05:45:00Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hillsboro, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":114000,"max_usd":219000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":2941},"experience_years_min":6,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-09-25T21:22:20Z","employer_posted_date":"2026-09-25","last_verified_at":"2026-09-29T18:18:51Z","board_verified":true,"closed_at":null,"days_open":4,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":4},"description":"Job Details:\nJob Description:\nIntel Corporation is one of the world's leading semiconductor companies, driving innovation across computing, connectivity, and artificial intelligence. With a bold vision to shape the future of technology, Intel is transforming how the world processes, stores, and communicates data. Our Advanced Packaging ,Test and Manufacturing (APTM) organization is at the forefront of this transformation, delivering industry-leading packaging and test technologies that power products across Client, Data Center, AI, Networking, and External Foundry markets. At Intel, we believe the next big thing starts with you.\nWe are seeking a talented and driven Sort Interface Pathfinding and Development Engineer to join our Sort Interface Development team in Oregon. In this high-impact role, you will pioneer breakthrough silicon interface probing & test solutions that enable best-in-class die and wafer sort capabilities across leading-edge process nodes and advanced heterogeneous packaging platforms - including EMIB, EMIB-T, Foveros, and Foveros Direct.\nAs Intel scales its Open System Foundry and OSAT (Outsourced Semiconductor Assembly and Test) business model, you will play an instrumental role in establishing world-class, customer-ready sort interface capabilities. You will lead electro-mechanical pathfinding, test hardware development, customer and supplier technical co-design, and probing process qualification to support both Intel's internal product roadmap and external Foundry customers.\nKey Responsibilities:\nFormulate and execute rigorous Design of Experiments (DOE) to optimize and qualify next-generation probing technologies and contact architectures for wafer and die sort operations\nServe as the lead technical liaison for Foundry and OSAT customers, translating complex chiplet and package requirements into scalable sort interface specifications\nAuthor industry-standard sort design rules and Interface Design Kits (IDKs) to streamline ecosystem integration for external fabless customers and design partners\nCollaborate with customer design and DFT teams to architect test interface hardware, resolve technical gaps, and synchronize testability roadmaps\nPartner with global Test Solution vendors and PCB suppliers to pioneer state-of-the-art probing capabilities\nDirect supplier and pathfinding initiatives to align vendor roadmaps with internal efficiency and performance goals\nDrive supplier accountability and manufacturing readiness to guarantee on-time hardware delivery for critical New Product Introductions (NPI)\nAs a Successful Candidate, You Will Bring:\nCollaborative mindset - you thrive working across cross-functional teams, customers, and global suppliers\nStrong communicator - you can translate highly technical concepts into clear, actionable specifications for diverse audiences\nAnalytical thinker - you approach complex problems with curiosity, structure, and data-driven decision-making\nSelf-starter - you take initiative, drive projects forward, and hold yourself and others accountable\nCustomer-focused - you understand the importance of building trust and delivering value to external partners\nAdaptable - you are comfortable navigating ambiguity and evolving priorities in a fast-paced, cutting-edge environment\nContinuous learner - you stay current with emerging technologies and proactively seek opportunities to grow\nIf you are passionate about pushing the boundaries of advanced packaging and test technology, and you want to make a meaningful impact on products that power the world's most advanced computing systems, we want to hear from you.\nQualifications:\nYou must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.\nMinimum Qualifications:\nBachelor’s degree in electrical engineering, Mechanical Engineering, Materials Science, or a related STEM field with 6+ years of industry experience OR Master's degree in the same fields with 4+ years of industry experience OR Ph.D. in the same fields with 2+ year of relevant post-graduate or industry experience\nRelevant industry experience can be any of the following:Experience with wafer/die sort Technology, prober-tester cell integration, and qualification of advanced probe card technologies\nStructure and execute DOEs to evaluate probing margins, yield, and process health\nDirect experience in ATE test hardware/methodology, Sort/Class product development, or PCB/space transformer/substrate design rules and stackup architectures\n\nPreferred Qualifications:\n6+ years of experience in:Advanced probing process characterization\nDirect experience managing technical relationships with external probe card/substrate suppliers or providing test hardware application support to external foundry/OSAT customers\nKnowledge of OSAT/Foundry test operations, multi-client test cell standards, customer design collateral/PDK enablement, or turnkey test delivery models\nExperience qualifying probe technologies for fine-pitch micro-bumps, 2.5D/3D architectures (EMIB, EMIB-T, silicon bridges), or wafer-level chip-scale probing\nHands-on experience with commercial ATE platforms such as Advantest V93k or Teradyne Ultra-FLEX\n\nJob Type:\nExperienced HireShift:\nShift 1 (United States of America)Primary Location:\nUS, Oregon, HillsboroAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","description_format":"text","description_chars":7260,"description_truncated":false,"requirements":{"experience_years_min":6,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-09-25T21:22:20Z"}],"liveness":{"score":63,"band":"ok","label":"Likely open","p_open":1,"p_active":0.632,"p_room":1,"age_days":3,"expected_fill_days":29,"reasons":["conf:1","stale_co","velocity","win:early","comp:brand"],"computed_at":"2026-09-29T05:45:00Z"},"pay":null,"html_url":"https://alion.io/job/intel-corporation-sort-interface-pathfinding-and-development-engineer","json_url":"https://alion.io/job/intel-corporation-sort-interface-pathfinding-and-development-engineer.json","meta":{"generated_at":"2026-09-30T02:37:16Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","usage":{"tier":"crawler","counted_by":"address","units_charged":1,"used_today":1831,"day_limit":5000,"remaining_today":3169,"minute_limit":60,"resets_at":"2026-10-01T00:00:00Z"}}}