{"id":1424450,"url":"https://alion.io/job/intel-corporation-substrate-packaging-research-and-development-engineer","title":"Substrate Packaging Research and Development Engineer","company":{"id":35,"name":"Intel Corporation","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":62,"ghost_share":0,"stale_share":0.613,"repost_share":0.032,"time_to_fill_p50_days":29,"computed_at":"2026-10-04T05:45:00Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"junior","employment_type":"full_time","work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Chandler, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":71000,"max_usd":134000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":1752},"experience_years_min":1,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-09-28T23:17:24Z","employer_posted_date":"2026-09-28","last_verified_at":"2026-10-05T01:43:25Z","board_verified":true,"closed_at":null,"days_open":6,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":6},"description":"Job Details:\nJob Description:\nAs a Packaging Module Development Engineer, you will play a vital role in advancing Intel's semiconductor manufacturing capabilities by developing innovative packaging processes and equipment. Your day-to-day responsibilities will focus on optimizing assembly methods to achieve quality, reliability, and efficiency goals in high-volume manufacturing environments. By collaborating with cross-functional teams, you will help shape Intel's next-generation packaging technologies, directly contributing to the company's success in the semiconductor industry.\nBusiness group\nThis position is part of Intel Corporation's Substrate Packaging Technology Development (SPTD) organization, which drives advancements in substrate packaging to support Intel's global technology leadership. The group focuses on delivering next-generation solutions for high-performance and mobile computing applications, enabling heterogeneous integration and die disaggregation across Intel's product portfolio.\nKey Responsibilities\nDevelop and optimize advanced packaging processes, materials, and equipment to meet reliability, quality, and cost targets.\nDesign and implement process specifications, workflows, and equipment configurations for new technologies.\nConduct design of experiments (DOE) to characterize process windows and interactions between equipment, materials, and chemistry.\nDrive continuous improvement efforts to enhance process capability, stability, and productivity.\nCollaborate with cross-functional teams to resolve technical challenges and deliver impactful solutions.\nEstablish material specifications and partner with suppliers to ensure adherence to performance and quality standards.\nDocument advancements and process innovations through technical reports and white papers.\nProvide sustaining support for equipment performance and process health in high-volume manufacturing environments.\nBehavioral traits:\nTeam Collaboration: Works effectively across cross-functional teams and builds strong partnerships.\nComfort with Ambiguity: Thrives in undefined or evolving projects and takes initiative to create direction.\nPerforms Under Pressure: Manages multiple priorities, tight deadlines, and technical challenges while remaining focused on results.\nConflict Resolution: Handles disagreements professionally, using data and communication to align stakeholders and reach solutions.\nOwnership & Problem Solving: Takes accountability, proactively addresses issues, and drives innovative solutions to completion.\nQualifications:\nMinimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.\nMinimum Qualifications\nPhD degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or other similar engineering degree and 1+years of related experience.\n1+year of experience in:Combining engineering judgement and data analysis skills to draw conclusions, build models and design experiments.\nMaterials science and engineering, and in material characterization techniques.\nKnowledge and experience in design of experiments (DOE), statistical data analysis and statistical process control (SPC).\n\nPreferred Qualifications\nWorking knowledge and/or prior experience in optics and lasers, laser micro-machining and micro-fabrication.\nBecome part of Intel's cutting-edge technology development team, where your expertise and creativity will drive innovation and shape the future of semiconductor manufacturing. Apply today and join us in advancing the boundaries of what's possible.\nJob Type:\nExperienced HireShift:\nShift 1 (United States of America)Primary Location:\nUS, Arizona, PhoenixAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role\nThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","description_format":"text","description_chars":5805,"description_truncated":false,"requirements":{"experience_years_min":1,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"phd","optional":false},"security_clearance":false,"languages":[]},"benefits":["Hybrid work"],"hiring_locations":[{"name":"United States","iso":"US","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-09-28T23:17:24Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 2,014 · green card filings: 487","filings_12m":2014,"filings_prev_12m":3001,"green_card_filings_12m":487,"median_offered_wage_usd":134579,"route":null,"cap_exempt":false,"checked_at":"2026-10-03T21:08:04+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":59,"band":"ok","label":"Likely open","p_open":1,"p_active":0.593,"p_room":1,"age_days":5,"expected_fill_days":29,"reasons":["conf:1","stale_co","velocity","win:early","comp:junior,brand"],"computed_at":"2026-10-04T05:45:00Z"},"pay":null,"html_url":"https://alion.io/job/intel-corporation-substrate-packaging-research-and-development-engineer","json_url":"https://alion.io/job/intel-corporation-substrate-packaging-research-and-development-engineer.json","meta":{"generated_at":"2026-10-05T01:44:01Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","usage":{"tier":"crawler","counted_by":"address","units_charged":1,"used_today":2313,"day_limit":5000,"remaining_today":2687,"minute_limit":60,"resets_at":"2026-10-06T00:00:00Z"}}}