{"id":1203006,"url":"https://alion.io/job/intel-corporation-td-media-and-collaterals-development-engineer","title":"TD Media and Collaterals Development Engineer","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":124,"ghost_share":0.024,"stale_share":0.556,"repost_share":0.04,"time_to_fill_p50_days":24,"computed_at":"2026-10-22T06:10:10Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"junior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Chandler, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":68000,"max_usd":123000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":4038},"experience_years_min":1,"visa_sponsorship":true,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Design of Experiments","optional":false},{"name":"Statistical Process Control","optional":false},{"name":"AutoCAD","optional":true},{"name":"SolidWorks","optional":true}],"status":"live","first_seen_at":"2026-09-24T22:14:46Z","employer_posted_date":"2026-09-24","last_verified_at":"2026-10-22T00:12:41Z","board_verified":true,"closed_at":null,"days_open":27,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":27},"description":"Job Details:\nJob Description:\nAs a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals. Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency. Your contributions will directly support Intel's cutting-edge assembly packaging technology roadmap, driving advancements in semiconductor manufacturing processes.\nBusiness Group\nYou will be part of Intel Corporation's Media Development organization, a team dedicated to advancing packaging technologies and manufacturing processes. This group operates at the forefront of innovation, enabling high-performance products and driving Intel's leadership in the semiconductor industry. By joining this collaborative environment, you will contribute to Intel's broader goals of delivering transformative technology solutions.\nKey Responsibilities\nDevelop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets.\nDesign and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC).\nConduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces.\nLead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods.\nProvide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones.\nDocument technical improvements and innovations through research papers and presentations.\nQualifications:\nMinimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. This position is not eligible for Intel immigration sponsorship\nKnowledge and/or experience listed below would be obtained through a combination of your school/work and/or classes and/or research and/or relevant previous job and/or internship experiences.\nMinimum Qualifications\nBachelor's degree in mechanical engineering or a related field with 6 months of hands-on experience.\nExperience mentioned above should be in:Equipment Engineering, Mechanical Desing and/ or Process Engineering.\n\nPreferred Qualifications\nExperience with mechanical design software such as SolidWorks or AutoCAD.\nPortfolio showcasing self-completed projects from concept to fabrication.\nFamiliarity with semiconductor packaging processes and technology.\nStrong technical and analytical skills, with a proven ability to deliver results on complex, time-critical projects.\nJoin us to contribute to groundbreaking technology innovation while growing your career in a dynamic and inclusive environment.\nJob Type:\nExperienced HireShift:\nShift 1 (United States of America)Primary Location:\nUS, Arizona, PhoenixAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $85,200.00-120,280.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","description_format":"text","description_chars":4924,"description_truncated":false,"requirements":{"experience_years_min":1,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-09-24T22:14:46Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 2,014 · green card filings: 487","filings_12m":2014,"filings_prev_12m":3001,"green_card_filings_12m":487,"median_offered_wage_usd":134579,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":21,"band":"cold","label":"Long shot","p_open":1,"p_active":0.473,"p_room":0.44,"age_days":27,"expected_fill_days":24,"reasons":["conf:5","stale_co","velocity","win:tail","crowd:junior,brand"],"computed_at":"2026-10-22T06:10:10Z"},"pay":null,"html_url":"https://alion.io/job/intel-corporation-td-media-and-collaterals-development-engineer","json_url":"https://alion.io/job/intel-corporation-td-media-and-collaterals-development-engineer.json","meta":{"generated_at":"2026-10-22T07:23:54Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":2987,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-23T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":35},"rest":"https://alion.io/mcp/rest/get_company?id=35"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fintel-corporation-td-media-and-collaterals-development-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fintel-corporation-td-media-and-collaterals-development-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fintel-corporation-td-media-and-collaterals-development-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/intel-corporation-td-media-and-collaterals-development-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fintel-corporation-td-media-and-collaterals-development-engineer"}]}