{"id":1573945,"url":"https://alion.io/job/intel-corporation-thermal-analysis-engineer","title":"Thermal Analysis Engineer","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":90,"ghost_share":0.033,"stale_share":0.533,"repost_share":0.044,"time_to_fill_p50_days":30,"computed_at":"2026-10-28T05:59:10Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Chandler, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":108000,"max_usd":204000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":6333},"experience_years_min":6,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Abaqus","optional":false},{"name":"ANSYS","optional":false},{"name":"Design of Experiments","optional":false},{"name":"MATLAB","optional":false},{"name":"Photolithography","optional":false},{"name":"PVD","optional":false},{"name":"Python","optional":false}],"status":"live","first_seen_at":"2026-09-30T00:00:00Z","employer_posted_date":"2026-09-30","last_verified_at":"2026-10-27T19:23:25Z","board_verified":true,"closed_at":null,"days_open":28,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":28},"description":"Job Details:\nJob Description:\nAs a Semiconductor Research Engineer, you will drive scientific innovation and research that shapes the future of semiconductor technologies. This role focuses on designing, simulating, and developing novel devices, packages, and interconnects using device physics, electromagnetics, and advanced materials science. You'll lead hands-on experiments to build prototypes that demonstrate groundbreaking concepts and collaborate across teams to establish methodologies that optimize performance, reliability, and cost. Your contributions will directly impact Intel's advancements in assembly packaging platform technologies, ensuring the company remains at the forefront of the industry.\nBusiness Group Join Intel Corporation's Thermal Core Comp organization, a team dedicated to enabling next-generation semiconductor technologies. This group leverages cutting-edge research and development efforts to ensure Intel delivers innovative assembly and packaging solutions that advance device miniaturization, high-speed signaling, and thermomechanical capabilities. As part of this team, you'll contribute to Intel's mission of transforming technology landscapes and driving industry progress.\nThe primary responsibilities for this role will include, but are not limited to:\nConduct research leveraging device physics, thermomechanical analysis, materials science, and process innovations to enable novel devices and systems.\nDesign and fabricate prototypes to demonstrate proof-of-concepts for groundbreaking packaging and interconnect technologies.\nPerform electrical testing and establish methodologies for device characterization, including DC, RF signal analysis, pulsing, and stressing.\nDevelop process solutions across production modules, such as lithography, etch, diffusion, CVD, PVD, and CMP, to address technological challenges.\nPlan and execute experiments in collaboration with device, reliability, and fabrication teams to benchmark results against industry standards.\nDevelop models and measurements to advance the understanding of device physics, packaging, and systems for future technology platforms.\nEngage with external vendors and researchers to support collaborations and Intel's research pipeline.\nQualifications:\nMinimum Qualifications:\nMinimum qualifications are required to be initially considered for this position.\nBachelor's or BS degree in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field.\n6+ years of experience with a bachelor's degree, 4+ years with a master's degree, or 2+ years with a PhD.\nAdvanced experience in semiconductor fabrication processes, such as lithography, etch, diffusion, and packaging design methodologies.\nAdvanced experience in simulation tools (e.g., Ansys, Abaqus) for finite element analysis and computational fluid dynamics.\nAdvanced experience in programming skills in Python or MATLAB for engineering applications.\nHands-on experience with experimental setups and data analysis techniques for lab testing.\nMinimum Qualifications:\nMinimum qualifications are required to be initially considered for this position.\nExperience with advanced packaging technologies, including EMIB and Foveros architectures.\nExpertise in Design of Experiments (DOE), statistical analysis methods, and model-based problem-solving techniques.\nFamiliarity with materials characterization techniques and cross-disciplinary collaboration with academia and external partners.\nProven ability to lead and influence technical teams to achieve milestones and drive performance improvements.\nStrong analytical and problem-solving abilities to address unique engineering challenges effectively.\nExcellent organizational and communication skills, with experience presenting findings and mentoring team members.\nHelp us redefine the future of technology and innovation. Apply today to join a team that thrives on collaboration, expertise, and a shared passion for driving advancements in semiconductor research.\nJob Type:\nExperienced HireShift:\nShift 1 (United States of America)Primary Location:\nUS, Arizona, PhoenixAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $164,470.00-232,190.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. 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