{"id":3763508,"url":"https://alion.io/job/intel-die-prep-module-engineer-contract","title":"Die Prep Module Engineer (Contract)","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":101,"ghost_share":0.03,"stale_share":0.535,"repost_share":0.059,"time_to_fill_p50_days":30,"computed_at":"2026-11-06T05:58:05Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":null,"employment_type":"contractor","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Kulim, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"FMEA","optional":false},{"name":"Statistical Process Control","optional":false}],"status":"live","first_seen_at":"2026-11-02T00:00:00Z","employer_posted_date":"2026-11-02","last_verified_at":"2026-11-06T15:53:26Z","board_verified":true,"closed_at":null,"days_open":5,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":5},"description":"Job Details:\nJob Description:\nThe Role and ImpactAs a Die Prep Module Engineer specializing in Advanced Metrology, you will own the performance, capability, and reliability of critical metrology and inspection tools in Intel's manufacturing environment. You will drive equipment optimization, troubleshooting, and technology deployment to improve measurement accuracy, process control, and operational efficiency. Working closely with Process Engineering, Manufacturing, Automation, and suppliers, you will solve complex technical challenges and enable high-volume manufacturing success. Your work will directly support product quality, factory productivity, and Intel's advanced packaging roadmap.\nBusiness Group\nAs part of Intel's Wafer Packaging Manufacturing (WPM) organization, you will join a team focused on advancing semiconductor packaging technologies and manufacturing excellence. The Die Prep Module Engineering team develops and sustains metrology and inspection solutions that enable process control, product quality, and efficient manufacturing. In this collaborative environment, you will work with cross-functional teams to deploy new technologies, improve equipment performance, and support factory operations and future technology ramps.\nKey Responsibilities\nOwn the performance, reliability, and capability of advanced metrology and inspection equipment within the Die Prep module.\nDrive equipment troubleshooting, root cause analysis, and resolution of hardware, software, and automation-related issues.\nImprove tool uptime, productivity, and reliability through preventive maintenance and continuous improvement initiatives.\nUtilize SPC, DOE, FMEA, and data analysis to identify trends, improve measurement capability, and prevent process excursions.\nPartner with Process Engineering, Manufacturing, Automation, and suppliers to support technology transfers, NPI, and manufacturing ramps.\nDevelop and optimize metrology recipes to meet process control and manufacturing requirements.\nLead equipment installation, qualification, upgrades, and capacity expansion projects.\nDevelop and maintain operating procedures, maintenance standards, and troubleshooting documentation.\nIdentify and implement innovative metrology and automation solutions to improve yield, quality, and factory performance.Qualifications:\nMinimum Qualifications\nBachelor's degree in Electrical, Electronics, Mechanical, Mechatronics, Materials Engineering, or a related field.\nKnowledge of semiconductor manufacturing processes, preferably in Die Prep, metrology, or advanced packaging.\nExperience with statistical and problem-solving methodologies such as SPC, DOE, and FMEA.\nStrong troubleshooting and analytical skills with the ability to diagnose equipment and process issues using data-driven approaches.\nPreferred Qualifications\nExperience supporting metrology, inspection, or semiconductor manufacturing equipment in a high-volume production environment.\nDemonstrated success in equipment performance improvement, process optimization, or yield enhancement initiatives.\nKnowledge of Root Cause Analysis (RCA), process control, and manufacturing data analytics.\nStrong communication and collaboration skills with the ability to work effectively across cross-functional teams and external suppliers.\nSelf-motivated with a passion for innovation, continuous improvement, and manufacturing excellence.\nWe are seeking motivated engineers who are passionate about solving complex technical challenges and driving manufacturing innovation. Join Intel's Die Prep Module Engineering team and play a key role in advancing next-generation packaging technologies, enabling operational excellence, and shaping the future of semiconductor manufacturing.\nJob Type:\nIntel Contract EmployeeShift:\nShift 1 (Malaysia)Primary Location:\nMalaysia, KulimAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/AWork Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. 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