{"id":3935760,"url":"https://alion.io/job/intel-module-development-engineer-3","title":"Module Development Engineer","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":103,"ghost_share":0.029,"stale_share":0.553,"repost_share":0.058,"time_to_fill_p50_days":30,"computed_at":"2026-11-08T05:47:12Z"}},"role":"Hardware","role_family":"Hardware","seniority":"junior","employment_type":"full_time","work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hillsboro, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":1,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Design of Experiments","optional":false},{"name":"Statistical Process Control","optional":false},{"name":"ALD","optional":true},{"name":"Ellipsometry","optional":true},{"name":"JMP","optional":true},{"name":"MATLAB","optional":true},{"name":"Photolithography","optional":true},{"name":"Python","optional":true}],"status":"live","first_seen_at":"2026-11-06T00:00:00Z","employer_posted_date":"2026-11-06","last_verified_at":"2026-11-08T07:30:44Z","board_verified":true,"closed_at":null,"days_open":2,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":2},"description":"Job Details:\nJob Description:\nThe Role and Impact: \nAs a Module Development Engineer, you will spearhead the development and optimization of advanced semiconductor manufacturing processes crucial to delivering Intel's high-performance devices. In this role, you will design experiments, analyze data, and refine process methodologies, ensuring seamless integration and manufacturability. Your work will directly contribute to Intel's leadership in creating cutting-edge device architectures and advancing the semiconductor industry forward.\nBusiness Group:\nIntel Foundry Technology Development is dedicated to delivering world-class manufacturing solutions that power Intel's product innovation. The team focuses on advancing semiconductor process engineering and enabling the design and production of industry-leading devices. Joining this organization means collaborating in a dynamic environment that supports Intel's continued leadership in the competitive semiconductor market.\nKey Responsibilities:\nDesign, execute, and analyze experiments to optimize manufacturing processes for yield, functionality, and efficiency\nDevelop and sustain semiconductor processing techniques, including material selection, equipment optimization, and metrology system design\nConduct feasibility studies and pathfinding activities to identify innovative solutions for next-generation device architectures\nCollaborate with equipment and material suppliers to evaluate, qualify, and integrate novel technology solutions into manufacturing workflows\nPerform process characterization using Statistical Process Control (SPC), Design of Experiments (DOE), and advanced data analysis tools\nPartner with cross-functional teams to ensure seamless process integration and manufacturability\nSupport technology transfer to high-volume manufacturing through training, audits, and process consistency across sites\nQualifications:\nMinimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.\nMinimum Qualifications:\nPhD in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Physics, Chemistry, or related STEM field\n6+ months of experience in one or more of the following:\nProficiency in semiconductor manufacturing techniques such as lithography, etching, thin film deposition, or planarization\nExpertise in process characterization methods and statistical analysis tools like MATLAB, JMP, or Python\nFamiliarity with materials characterization techniques such as SEM, TEM, XPS, or ellipsometry\nPreferred Qualifications:\nExperience with advanced device architectures and process integration challenges, such as transistor scaling or selectivity control\nHands-on experience with equipment troubleshooting, maintenance, or development alongside suppliers\nKnowledge of manufacturing technologies including vacuum processes, ALD, or CVD\nStrong problem-solving skills and the ability to manage multiple tasks in a fast-paced environment\nCollaborative mindset with a proven track record of working across interdisciplinary teams to achieve shared objectives\nFor information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information\nJob Type:\nCollege GradShift:\nShift 1 (United States of America)Primary Location:\nUS, Oregon, HillsboroAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role\nThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","description_format":"text","description_chars":5561,"description_truncated":false,"requirements":{"experience_years_min":1,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"phd","optional":false},"security_clearance":false,"languages":[]},"benefits":["Hybrid work"],"hiring_locations":[{"name":"United States","iso":"US","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-11-08T07:30:44Z"}],"visa":[{"country":"US","licensed_sponsor":true,"adverts_offering_sponsorship_24m":0,"sanctioned_now":false,"evidence":"H-1B filings in 12 months: 2,029 · green card filings: 490","filings_12m":2029,"filings_prev_12m":3014,"green_card_filings_12m":490,"median_offered_wage_usd":134832,"route":null,"cap_exempt":false,"checked_at":"2026-11-07T07:57:00+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":728}],"liveness":{"score":86,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.86,"p_room":1,"age_days":2,"expected_fill_days":30,"reasons":["conf:1","win:early","comp:junior,brand"],"computed_at":"2026-11-08T08:30:48Z"},"pay":null,"html_url":"https://alion.io/job/intel-module-development-engineer-3","json_url":"https://alion.io/job/intel-module-development-engineer-3.json","meta":{"generated_at":"2026-11-08T08:30:48Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":18395,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-09T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":35},"rest":"https://alion.io/mcp/rest/get_company?id=35"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fintel-module-development-engineer-3"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fintel-module-development-engineer-3"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fintel-module-development-engineer-3"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/intel-module-development-engineer-3\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fintel-module-development-engineer-3"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3935760}},{"tool":"search_jobs","arguments":{"company":"intel.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3935760},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. Docs: https://alion.io/developers"}}