{"id":2985961,"url":"https://alion.io/job/intel-module-engineering-phd-intern-wet-etch","title":"Module Engineering - PhD Intern (Wet Etch)","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":124,"ghost_share":0.024,"stale_share":0.556,"repost_share":0.04,"time_to_fill_p50_days":24,"computed_at":"2026-10-23T05:54:15Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"intern","employment_type":"internship","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hillsboro, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":47000,"max_usd":89000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":18},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"JMP","optional":true},{"name":"Python","optional":true}],"status":"live","first_seen_at":"2026-10-19T00:00:00Z","employer_posted_date":"2026-10-19","last_verified_at":"2026-10-22T00:12:41Z","board_verified":true,"closed_at":null,"days_open":4,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":4},"description":"Job Details:\nJob Description:\nThe Role and Impact\nJoin us as a Module Engineering PhD Intern, where you will work hands-on to support the development, optimization, and implementation of cutting-edge semiconductor manufacturing processes. In this role, you will contribute directly to advancing Intel's technology by collaborating on experiments, analyzing data, and identifying innovative solutions to engineering challenges. Your daily work will play a key role in driving efficiency, quality, and innovation for Intel's manufacturing operations. \nBusiness group\nThe Intel Foundry team is dedicated to delivering groundbreaking semiconductor solutions that empower innovation across industries and enable a smarter, more connected future. As part of the Wet Etch group, you will work within a team focused on process engineering for advanced manufacturing technologies. The team's mission is to ensure Intel's leadership in semiconductor fabrication by driving excellence in process design, execution, and continuous improvement to support Intel's broader technology goals. \nKey Responsibilities \nCollaborate with engineering teams to design, execute, and analyze process experiments to optimize Wet Etch module performance. \nUtilize statistical analysis and data interpretation methods to identify opportunities for process improvements. \nContribute to the evaluation and implementation of novel manufacturing techniques and technologies. \nSupport ongoing process documentation, ensuring accuracy and compliance with industry standards. \nTroubleshoot engineering issues and provide innovative recommendations to enhance module performance. \nWork cross-functionally with technical teams to ensure alignment with broader manufacturing objectives.\nQualifications:\nMinimum Qualifications \nCurrently pursuing a PhD degree in a relevant STEM discipline (e.g. Physics, Applied Chemistry, Chemical Engineering, Electronic Engineering, Mechanical Engineering, Computer Science, Data Science, etc.). \nStrong analytical and problem-solving skills.\nExperience writing software code for application in above majors \nExcellent communication skills - both written and verbal.\nAbility to work independently and as part of a diverse, high-performing team.\nWillingness to work in a cleanroom environment.\nStrong attention to detail and disciplined approach to procedures.\nData analysis skills with demonstrated ability to construct clear data-based problem statements, design of experiment.\nPreferred Qualifications\nExperience with data analysis tools and software (e.g. JMP, Python, Excel). \nAbility to summarize data for technical and non-technical audiences. \nGPA 3.5 or higher preferred.\nExperience working in a Semiconductor fabrication and or Wet Etch environment\nBring your passion for engineering excellence and innovation to Intel and contribute to shaping the future of technology. Join us on this exciting journey and accelerate your career development while making an impact.\nJob Type:\nStudent / InternShift:\nShift 1 (United States of America)Primary Location:\nUS, Oregon, HillsboroAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.Work Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","description_format":"text","description_chars":4858,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"phd","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-21T08:25:14Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 2,014 · green card filings: 487","filings_12m":2014,"filings_prev_12m":3001,"green_card_filings_12m":487,"median_offered_wage_usd":134579,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":63,"band":"ok","label":"Likely open","p_open":1,"p_active":0.631,"p_room":1,"age_days":4,"expected_fill_days":24,"reasons":["conf:29","stale_co","velocity","win:early","comp:junior,brand"],"computed_at":"2026-10-23T05:54:15Z"},"pay":null,"html_url":"https://alion.io/job/intel-module-engineering-phd-intern-wet-etch","json_url":"https://alion.io/job/intel-module-engineering-phd-intern-wet-etch.json","meta":{"generated_at":"2026-10-23T13:30:50Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":20168,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-24T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":35},"rest":"https://alion.io/mcp/rest/get_company?id=35"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fintel-module-engineering-phd-intern-wet-etch"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fintel-module-engineering-phd-intern-wet-etch"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fintel-module-engineering-phd-intern-wet-etch"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/intel-module-engineering-phd-intern-wet-etch\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fintel-module-engineering-phd-intern-wet-etch"}]}