{"id":3937658,"url":"https://alion.io/job/intel-nm-wafer-packaging-manufacturing-advanced-packaging-module-engineer","title":"NM Wafer Packaging Manufacturing: Advanced Packaging Module Engineer","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":105,"ghost_share":0.029,"stale_share":0.543,"repost_share":0.048,"time_to_fill_p50_days":30,"computed_at":"2026-11-09T06:03:00Z"}},"role":"Hardware","role_family":"Hardware","seniority":"junior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Rio de Janeiro, Brazil"],"countries":["BR"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Design of Experiments","optional":true},{"name":"FMEA","optional":true},{"name":"Statistical Process Control","optional":true}],"status":"live","first_seen_at":"2026-11-05T00:00:00Z","employer_posted_date":"2026-11-05","last_verified_at":"2026-11-09T23:33:25Z","board_verified":true,"closed_at":null,"days_open":5,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":5},"description":"Job Details:\nJob Description:\nThe Role and Impact\nNote: This position requires regular onsite presence to perform essential job responsibilities.\nNew Mexico Wafer Packaging Manufacturing (NMWPM) is expanding, and we are seeking Module Engineers specializing in Wafer-Level Assembly, Die Preparation, and Metrology. These roles will support both high-volume manufacturing (HVM) and technology development activities, including process transfers and product start-ups for Foveros, Embedded Bridge, and Intel Foundry Services (IFS) technologies.\nKey Responsibilities\nResponsibilities include, but are not limited to:\nDrive sustained operational excellence by proactively identifying and implementing safety and ergonomic improvements, excursion prevention measures, and initiatives that enhance equipment availability, utilization, and cost efficiency.\nCollaborate with partner factories to transfer new processes, maintain Copy Exactly standards, share best practices, and drive continuous improvements in processes and equipment performance.\nDevelop and execute technology roadmaps to achieve process requirements, business objectives, and key milestones.\nInstall, qualify, and ramp equipment and manufacturing processes to support new product introductions and production start-up milestones.\nLead efforts to resolve complex technical challenges and implement robust systems that prevent recurrence.\nSupport and sustain development and pilot production lines during early test vehicle and production phases.\nPartner closely with engineers, technicians, integration teams, shift leadership, and management to deliver development and manufacturing commitments.\nEvaluate, qualify, and implement new hardware, software, and equipment upgrades.\nLead critical task forces and cross-functional initiatives related to areas of ownership and adjacent manufacturing processes.\nDesired Behavioral Traits\nThe successful candidate will demonstrate:\nA strong commitment to safety and a proactive approach to promoting a safe work environment.\nThe ability to thrive in a dynamic environment with evolving priorities and technical challenges.\nA results-oriented mindset with strong organizational skills, initiative, resourcefulness, and accountability.\nExcellent analytical and problem-solving skills, with a strong sense of urgency and commitment to achieving business objectives.\nThe ability to distill complex technical concepts into clear, actionable communication for stakeholders at all organizational levels.\nProven success working within high-performing teams, including demonstrated leadership, collaboration, prioritization, and problem-solving capabilities.\nA continuous improvement mindset, with experience applying Lean principles and methodologies to drive operational and manufacturing excellence.\n\nQualifications:\nMinimum Qualifications\nBachelor's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related technical field.\nCompleted academic coursework, laboratory work, or technical projects in semiconductor technologies, electronics, or mechanical engineering.\nPreferred Qualifications\n2+ years of relevant experience with a Bachelor's degree, or no prior experience required with a Master's degree.\nFamiliarity with semiconductor manufacturing process flows, with an emphasis on advanced packaging technologies.\nHands-on experience with semiconductor manufacturing equipment, including tool matching, calibration, and performance optimization.\nDemonstrated success in tool installation, qualification, and production readiness activities.\nWorking knowledge of Design of Experiments (DOE) methodologies and their application to tool matching, process qualification, and continuous improvement.\nProficiency in data-driven problem solving and root cause analysis using methodologies such as Model-Based Problem Solving (MBPS), DOE, Statistical Process Control (SPC), and Failure Mode and Effects Analysis (FMEA).\nJob Type:\nExperienced HireShift:\nShift 1 (United States of America)Primary Location:\nUS, New Mexico, AlbuquerqueAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $76,390.00-146,440.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","description_format":"text","description_chars":5964,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-11-08T09:37:55Z"}],"visa":[{"country":"US","licensed_sponsor":true,"adverts_offering_sponsorship_24m":0,"sanctioned_now":false,"evidence":"H-1B filings in 12 months: 2,029 · green card filings: 490","filings_12m":2029,"filings_prev_12m":3014,"green_card_filings_12m":490,"median_offered_wage_usd":134832,"route":null,"cap_exempt":false,"checked_at":"2026-11-09T07:32:21+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":728}],"liveness":{"score":60,"band":"ok","label":"Likely open","p_open":1,"p_active":0.602,"p_room":1,"age_days":4,"expected_fill_days":30,"reasons":["conf:2","stale_co","win:early","comp:junior,brand"],"computed_at":"2026-11-09T06:03:00Z"},"pay":null,"html_url":"https://alion.io/job/intel-nm-wafer-packaging-manufacturing-advanced-packaging-module-engineer","json_url":"https://alion.io/job/intel-nm-wafer-packaging-manufacturing-advanced-packaging-module-engineer.json","meta":{"generated_at":"2026-11-10T04:27:24Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"assistant_verified","counted_by":"address","units_charged":1,"used_today":1331,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-11T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.1,"usd":0.01,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":35},"rest":"https://alion.io/mcp/rest/get_company?id=35"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fintel-nm-wafer-packaging-manufacturing-advanced-packaging-module-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":2,"usd":0.2},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fintel-nm-wafer-packaging-manufacturing-advanced-packaging-module-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.1,"usd":0.01},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fintel-nm-wafer-packaging-manufacturing-advanced-packaging-module-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/intel-nm-wafer-packaging-manufacturing-advanced-packaging-module-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fintel-nm-wafer-packaging-manufacturing-advanced-packaging-module-engineer"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3937658}},{"tool":"search_jobs","arguments":{"company":"intel.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3937658},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. Docs: https://alion.io/developers"}}