{"id":3390705,"url":"https://alion.io/job/intel-oregon-advanced-packaging-module-engineer","title":"Oregon Advanced Packaging Module Engineer","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"A","score":85,"open_postings":91,"ghost_share":0.033,"stale_share":0.505,"repost_share":0.044,"time_to_fill_p50_days":30,"computed_at":"2026-10-29T05:49:05Z"}},"role":"Hardware","role_family":"Hardware","seniority":"junior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hillsboro, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":89000,"max_usd":178000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":578},"experience_years_min":1,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Design of Experiments","optional":true},{"name":"JMP","optional":true},{"name":"MATLAB","optional":true},{"name":"Statistical Process Control","optional":true}],"status":"live","first_seen_at":"2026-10-27T00:00:00Z","employer_posted_date":"2026-10-27","last_verified_at":"2026-10-29T13:07:32Z","board_verified":true,"closed_at":null,"days_open":2,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":2},"description":"Job Details:\nJob Description:\nAt Intel, we create world-changing technology that improves the life of every person on the planet. By joining the Oregon Advanced Packaging (ORAP) team-supporting both our Aloha and Ronler factories-you will become part of the Wafer Packaging Manufacturing (WPM) organization. Our mission is to deliver world-class manufacturing solutions through advanced wafer-level processes and packaging technologies, enabling high-volume production, supporting global technology transfer, and driving the innovations that shape the future of computing.\nWe are seeking an Oregon Advanced Packaging Module Engineer to join our advanced manufacturing operations in Hillsboro, Oregon. In this role, you will play a critical part in driving Intel’s advanced semiconductor manufacturing processes. You will own high-volume packaging equipment and processes that enable the miniaturization and mass production of integrated circuits. This position offers an exceptional career path to design process controls, execute continuous improvement initiatives, and work directly on cutting-edge systems that impact Intel's global production roadmap.\nKey Responsibilities:\nEquipment & Process Ownership: Manage high-volume manufacturing equipment and processes to support device miniaturization and the production of next-generation integrated circuits.\nProcess Control & Metrology: Conduct technical tests and measurements to maintain critical process control for dimensions and inline defectivity.\nExcursion Prevention: Develop, implement, and monitor systems for excursion prevention and discrepant material detection within the equipment modules.\nTechnology Transfer: Partner with global Intel manufacturing sites to transfer process qualification outcomes, coordinate training, and align performance metrics.\nContinuous Improvement: Lead engineering initiatives focused on safety, quality, productivity, cost reduction, and systematic defect reduction.\nFactory Ramp Management: Coordinate equipment installations, conversions, and qualifications during factory ramps to ensure tooling is brought online safely and on schedule.\nSupplier Collaboration: Partner directly with equipment and material suppliers to optimize tool configurations and materials for high-volume manufacturing.\nAs a Successful Candidate, You Will Bring:\nTechnical Leadership & Collaboration: Natural leadership skills to guide cross-functional teams, influence global partners, and work effectively across organizational boundaries.\nProblem-Solving & Innovation: Highly analytical mindset with a passion for diagnosing complex electromechanical and process issues using structured data.\nAdaptability & Tolerance for Ambiguity: Comfortable operating in a rapidly changing, fast-paced high-volume manufacturing environment.\nMeticulous Attention to Detail: Commitment to precision, safety, and strict compliance with design-to-target standards.\nApply today to join Intel Oregon's Advanced Packaging team. Take ownership of industry-leading technology, drive manufacturing innovation, and grow your career alongside global pioneers.\nQualifications:\nQualifications:\nYou must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.\nMinimum Qualifications:\nAn applicant must meet one of the following criteria:\nA Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related STEM field and 1+ years of hands-on experience in semiconductor manufacturing or high-tech process equipment.\n OR a Master's degree in a matching STEM discipline.\nRelevant experience can be any of the following:6+ months of experience applying statistical methods (e.g., Statistical Process Control, design of experiments) to manufacturing processes.\nAcademic or professional experience acquired through internships, academic projects, coursework, or hands-on technical training.\n\nPreferred Qualifications:\n6+ months of experience:Troubleshooting equipment or analytical instruments in a semiconductor environment.\nUtilizing statistical analysis tools (such as MATLAB, JMP, or Excel) for process optimization.\nUtilizing materials characterization techniques.\n\nJob Type:\nExperienced HireShift:\nShift 1 (United States of America)Primary Location:\nUS, Oregon, HillsboroAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $76,390.00-146,440.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. 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