{"id":3390701,"url":"https://alion.io/job/intel-packaging-module-development-engineer-4","title":"Packaging Module Development Engineer","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":90,"ghost_share":0.033,"stale_share":0.544,"repost_share":0.044,"time_to_fill_p50_days":30,"computed_at":"2026-11-02T06:13:15Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"junior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Chandler, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":72000,"max_usd":130000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":4343},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Design of Experiments","optional":false},{"name":"Statistical Process Control","optional":true}],"status":"closed","first_seen_at":"2026-10-27T00:00:00Z","employer_posted_date":"2026-10-27","last_verified_at":"2026-10-30T13:46:17Z","board_verified":false,"closed_at":"2026-10-30T13:46:17Z","days_open":3,"trust":{"level":"not_scored","repost_count":null,"flags":[],"days_open":3},"description":"Job Details:\nJob Description:\nIntel's Substrate Packaging Technology Development (SPTD) organization is seeking a talented and driven Packaging Module Development Engineer to join our Arizona-based team. In this role, you will be at the forefront of developing cutting-edge packaging processes and equipment that enable Intel's next-generation semiconductor technologies. You will play a critical role in advancing heterogeneous integration and die disaggregation solutions that support Intel's global product roadmap - from high-performance computing to mobile applications.\nThis is a unique opportunity to work alongside world-class engineers, contribute to groundbreaking research and development, and directly influence the future of advanced semiconductor packaging at one of the most recognized technology companies in the world.\nKey Responsibilities\nDevelop and qualify advanced packaging processes, materials, and equipment to meet reliability, yield, and cost targets in high-volume manufacturing environments.\n\nDesign and implement process specifications, prototype workflows, and equipment configurations for emerging packaging technologies.\n\nConduct Design of Experiments (DOE) to analyze process windows and understand interactions between materials, equipment, and chemistry.\n\nDrive continuous process improvements to enhance capability, stability, quality, and overall productivity.\n\nCollaborate with cross-functional teams - including design, materials, and manufacturing - to resolve complex technical challenges and deliver impactful solutions.\n\nEstablish material specifications and partner with suppliers to ensure adherence to performance and quality standards.\n\nDocument technical findings and process innovations through detailed reports and technical papers.\n\nSupport standardization of manufacturing systems and qualification procedures to ensure consistency and scalability across global operations.\n\nProvide sustaining support for equipment performance and process health in high-volume manufacturing settings.\n\nAs a successful candidate, you must possess\nCollaborative Spirit - You thrive in team environments and enjoy working across diverse, cross-functional groups to achieve shared goals.\n\nIntellectual Curiosity - You have a passion for learning, exploring new technologies, and asking the right questions to drive innovation.\n\nAdaptability - You embrace change and can pivot quickly in a fast-paced, dynamic environment without losing focus or momentum.\n\nEffective Communication - You can clearly articulate complex technical concepts to both technical and non-technical audiences, both verbally and in writing.\n\nProblem-Solving Mindset - You approach challenges with a structured, analytical mindset and a determination to find creative, practical solutions.\n\nAttention to Detail - You take pride in precision and thoroughness, ensuring that your work meets the highest standards of quality.\n\nInitiative & Ownership - You are proactive, self-motivated, and take full ownership of your projects from concept through to completion.\n\nResilience - You remain composed and focused under pressure, especially when navigating complex technical or organizational challenges.\n\nAre you ready to shape the future of semiconductor technology? Join Intel's Advanced Packaging team in Arizona and be part of a world-class organization that is redefining what's possible in chip design and manufacturing. If you are passionate about innovation, thrive in collaborative environments, and want to make a lasting impact on the technology that powers the world - we want to hear from you.\nQualifications:\nThis is an entry level position and will be compensated accordingly. You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.\nMinimum Qualifications: \nPhD in a relevant STEM field\n\nPreferred Qualifications: \nPhD in Materials Science, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or a related STEM field\n\n6+ months of experience:\nStatistical Process Control (SPC) and Design of Experiments (DOE) methodologies.\n\nPackaging process development and equipment qualification.\n\nAnalyzing process data, identifying variations, and implementing improvements.\n\nSolid knowledge of equipment setup, calibration, and performance evaluation in manufacturing environments.\n\nWith semiconductor device fabrication and packaging process flows.\n\nWith managing complex technical projects with a focus on innovation and optimization.\n\nKnowledge of quality systems, process documentation, and manufacturing standards.\n\nJob Type:\nCollege GradShift:\nShift 1 (United States of America)Primary Location:\nUS, Arizona, PhoenixAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. 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