{"id":3525136,"url":"https://alion.io/job/intel-packaging-module-development-engineer-5","title":"Packaging Module Development Engineer","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":101,"ghost_share":0.03,"stale_share":0.535,"repost_share":0.059,"time_to_fill_p50_days":30,"computed_at":"2026-11-06T05:58:05Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hillsboro, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":111000,"max_usd":210000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":6333},"experience_years_min":6,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Statistical Process Control","optional":false}],"status":"live","first_seen_at":"2026-10-29T00:00:00Z","employer_posted_date":"2026-10-29","last_verified_at":"2026-11-06T15:53:26Z","board_verified":true,"closed_at":null,"days_open":8,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":8},"description":"Job Details:\nJob Description:\nThe Role and Impact\nAs a Module Development Engineer within Intel's Advanced Packaging Technology Development (APTD) Metrology Group, you will contribute to the development, optimization, and implementation of advanced metrology capabilities supporting Intel's next-generation semiconductor packaging technologies.\nYour work will combine hands-on equipment and process development, equipment qualification, manufacturing process optimization, and technology development initiatives. You will support both existing metrology operations and the evaluation of emerging technologies that enable future manufacturing capabilities.\nCollaborating with cross-functional teams across process integration, module engineering, advanced process control, automation, and equipment suppliers, you will help improve manufacturing readiness, equipment performance, and process capabilities while contributing to Intel's long-term technology roadmap.\nAbout the Group\nThe APTD Metrology Group at Intel supports critical semiconductor technology development programs by enabling advanced measurement and inspection capabilities.\nAs packaging technologies continue to evolve, metrology plays an essential role in process development, yield improvement, and manufacturing readiness.\nThe group works closely with engineering, manufacturing, and technology development teams to introduce innovative measurement solutions and support Intel's next-generation semiconductor technologies.\nKey Responsibilities\nContribute to the development and execution of metrology technology roadmaps by evaluating emerging equipment capabilities, industry trends, and future manufacturing requirements.\nParticipate in technology development and pathfinding initiatives, including feasibility studies, process evaluations, and the introduction of new metrology capabilities.\nSupport the installation, qualification, characterization, and validation of new metrology and inspection equipment to ensure manufacturing readiness.\nOwn and support metrology equipment and manufacturing processes, including equipment troubleshooting, process monitoring, recipe development, and continuous improvement activities.\nDevelop, optimize, and implement manufacturing process improvements to enhance equipment performance, process stability, yield, and operational efficiency.\nSupport metrology module development activities, including recipe optimization, process parameter evaluation, statistical process control (SPC), and sampling strategies.\nInvestigate manufacturing process excursions, perform root cause analysis, and implement corrective actions to improve equipment and process performance.\nCollaborate with equipment suppliers and cross-functional engineering teams to evaluate new technologies, resolve technical challenges, and support equipment development initiatives.\nPartner with process integration, manufacturing, automation, and advanced process control teams to implement process improvements and enhance manufacturing capabilities.\nProvide technical insights, process performance data, and recommendations to support engineering decisions, technology development projects, and manufacturing readiness reviews.\nYour contributions will help advance Intel's semiconductor manufacturing capabilities while supporting the development of next-generation advanced packaging technologies.\nQualifications:\nMinimum Qualifications\nCandidates must possess one of the following:\nBachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related STEM field with 6+ years of semiconductor manufacturing experience, including manufacturing process development and application of statistical process control (SPC), data analysis, and/or process improvement methodologies.\nOR\nMaster's degree in the same fields with 4+ years of semiconductor manufacturing experience, including manufacturing process development and application of statistical process control (SPC), data analysis, and/or process improvement methodologies.\nOR\nPhD in the same fields with 2+ years of semiconductor manufacturing experience, including manufacturing process development and application of statistical process control (SPC), data analysis, and/or process improvement methodologies.\nPreferred Qualifications\nExperience owning, sustaining, or optimizing semiconductor metrology or inspection equipment, including equipment recipes and process performance.\nExperience contributing to technology development initiatives, equipment capability evaluations, or future technology roadmaps.\nRecognized technical leadership with a proven ability to solve complex engineering challenges.\nStrong collaboration skills across cross-functional teams, including yield, operations, and supplier management. Intel invites forward-thinking engineers to join us in shaping the future of semiconductor technology. Contribute your expertise and creativity to help drive innovation and make an impact at Intel. Apply today.\nJob Type:\nExperienced HireShift:\nShift 1 (United States of America)Primary Location:\nUS, Oregon, HillsboroAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $155,520.00-219,550.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","description_format":"text","description_chars":6990,"description_truncated":false,"requirements":{"experience_years_min":6,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-30T13:46:17Z"}],"visa":[{"country":"US","licensed_sponsor":true,"adverts_offering_sponsorship_24m":0,"sanctioned_now":false,"evidence":"H-1B filings in 12 months: 2,014 · green card filings: 487","filings_12m":2014,"filings_prev_12m":3001,"green_card_filings_12m":487,"median_offered_wage_usd":134579,"route":null,"cap_exempt":false,"checked_at":"2026-11-06T21:34:21+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":70,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.695,"p_room":1,"age_days":8,"expected_fill_days":30,"reasons":["conf:8","stale_co","wave","velocity","win:early","comp:brand"],"computed_at":"2026-11-06T05:58:05Z"},"pay":null,"html_url":"https://alion.io/job/intel-packaging-module-development-engineer-5","json_url":"https://alion.io/job/intel-packaging-module-development-engineer-5.json","meta":{"generated_at":"2026-11-06T21:40:25Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":2395,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-07T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":35},"rest":"https://alion.io/mcp/rest/get_company?id=35"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fintel-packaging-module-development-engineer-5"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fintel-packaging-module-development-engineer-5"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fintel-packaging-module-development-engineer-5"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/intel-packaging-module-development-engineer-5\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fintel-packaging-module-development-engineer-5"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3525136}},{"tool":"search_jobs","arguments":{"company":"intel.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3525136},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. Docs: https://alion.io/developers"}}