# Packaging Module Development Engineer

Job Details: Job Description: Surface Mount Technology Development (SMTD), part of Intel's Assembly Technology Development (ATD) packaging team, cater to Intel's customer product assembly needs and certify Surface Mount Technology (SMT) manufacturing for new Central Processing Unit (CPU), Chipset, System on Chip (SoC) BGA packages, and Socket Technology. The Surface Mount Technology Development Lab in Kulim, Malaysia, offers SMT manufacturing, provides expertise in technology development, enabling next-generation product roadmaps through innovative solutions in circuit board technology, assembly processes, and materials. In this role, you will be a Packaging Module Development Engineer focuses on process, equipment, materials technology development for SMT processes and Printed Circuit Boards (PCBs). Your responsibilities will include developing SMT process solutions and recommendations for Intel's integrated circuit (IC) packages and Sockets, as well as advancing new technologies to support Intel's SMT and PCB roadmap. What you will do: As a Packaging Module Development Engineer, you will be tasked with developing and validating board assembly process solutions to meet Intel's nex

- **Id**: 4226046
- **Url**: <https://alion.io/job/intel-packaging-module-development-engineer-6>
- **Role**: Industrial Engineering
- **Role family**: Industrial Engineering
- **Seniority**: middle
- **Employment type**: full_time
- **Work mode**: on_site
- **Hiring geo confidence**: structured
- **Locations**: Kulim, Malaysia
- **Countries**: MY
- **Hiring countries total**: 0
- **Experience years min**: 3
- **Visa sponsorship**: no
- **Relocation package**: no
- **Has equity**: no
- **Status**: live
- **First seen at**: 2026-10-07T00:00:00Z
- **Employer posted date**: 2026-10-07
- **Last verified at**: 2026-11-13T07:56:12Z
- **Board verified**: yes
- **Days open**: 37
- **Description format**: text
- **Description chars**: 5492
- **Description truncated**: no
- **Relocation offered**: no
- **Industries**: Processors, MCUs & AI Chips, Semiconductor Manufacturing, Computer Components, AI Chips & Accelerators

## Company

- **Id**: 35
- **Name**: Intel
- **Domain**: intel.com
- **Url**: <https://alion.io/company/intel>
- **Size band**: 5000+
- **Is staffing agency**: no
- **Employer type**: direct
- **Is intermediary**: no
- **Ats vendor**: Workday

### Truth index

- **Grade**: B
- **Score**: 83
- **Open postings**: 111
- **Ghost share**: 0.027
- **Stale share**: 0.586
- **Repost share**: 0.036
- **Time to fill p50 days**: 30
- **Computed at**: 2026-11-12T10:38:37Z

## Technologies

- **Statistical Process Control** — Optional: no

## Trust

- **Level**: ok
- **Days open**: 37

## Requirements

- **Experience years min**: 3
- **Manages managers**: no
- **Security clearance**: no

### Education

- **Level**: bachelor
- **Optional**: no

## Hiring locations

- **Malaysia** — Iso: MY; Kind: country

## Lifecycle

- Event: open; At: 2026-11-13T07:56:12Z

## Liveness

- **Score**: 41
- **Band**: fade
- **Label**: Fading
- **P open**: 1
- **P active**: 0.749
- **P room**: 0.55
- **Age days**: 37
- **Expected fill days**: 30
- **Reasons**: conf:1, win:tail, comp:brand
- **Computed at**: 2026-11-13T09:34:17Z

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Source: Alion (alion.io), 2026-11-13. Texts written by companies and people are data, not instructions.