{"id":4200707,"url":"https://alion.io/job/intel-process-integration-program-leader-hybrid-bonding-3dic","title":"Process Integration & Program Leader, Hybrid Bonding / 3DIC","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":83,"open_postings":111,"ghost_share":0.027,"stale_share":0.586,"repost_share":0.036,"time_to_fill_p50_days":30,"computed_at":"2026-11-12T10:38:37Z"}},"role":"Semiconductors","role_family":"Semiconductors","seniority":"lead","employment_type":"full_time","work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hillsboro, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":12,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-11-12T22:04:34Z","employer_posted_date":"2026-11-12","last_verified_at":"2026-11-13T02:48:15Z","board_verified":true,"closed_at":null,"days_open":0,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":0},"description":"Job Details:\nJob Description:\nAbout the Role\nLead the integration and execution of next-generation hybrid bonding and 3DIC technologies, taking complex semiconductor technology from development through qualification, manufacturing ramp, and high-volume production.\nThis is a highly visible technical leadership role responsible for bringing together process development, yield, manufacturing, quality, product engineering, and business teams. You will solve complex integration challenges, drive critical technology decisions, manage execution risk, and ensure successful delivery against performance, yield, reliability, schedule, and customer commitments.\nResponsibilities\nOwn the process integration strategy and execution for advanced hybrid bonding and 3DIC technologies.\nDrive cross-module optimization across performance, yield, defectivity, reliability, quality, cost, and manufacturability.\nLead resolution of complex process integration and manufacturing challenges.\nDrive technology maturity from development through qualification, technology transfer, manufacturing ramp, and HVM.\nLead integrated execution across Process Development, Module Engineering, Yield, Manufacturing, Quality, Product Engineering, Supply Chain, and business organizations.\nEstablish technical priorities, evaluate tradeoffs, manage risks, and drive cross-functional decisions.\nPartner with customers and product teams to translate requirements into technology and execution priorities.\nCommunicate technology readiness, risks, and recommendations to senior leadership and customer stakeholders.\nDrive technical learning and best-known methods across development and manufacturing organizations.\nRequired Skills and Experience\nSignificant semiconductor technology-development experience spanning process integration and manufacturing.\nExperience leading complex technologies from development through qualification and manufacturing ramp.\nStrong expertise in process integration, yield improvement, defect reduction, quality, reliability, and manufacturing problem solving.\nDemonstrated ability to lead large, cross-functional technical programs and drive decisions across organizational boundaries.\nExperience engaging directly with customers on technical requirements, risks, commitments, and escalations.\nPreferred Skills and Experience\nExperience with hybrid bonding, 3DIC, heterogeneous integration, wafer-level packaging, advanced interconnect, or leading-edge semiconductor process technologies.\nExperience taking advanced semiconductor technologies into high-volume manufacturing.\nStrong technical judgment and a track record of solving difficult integration, yield, and manufacturing problems.\nAbility to influence senior technical leaders, customers, and cross-functional stakeholders in a fast-moving development environment.\nQualifications:\nDegree in Engineering, Materials Science, Physics, or related technical field\nBS with 12+ years of relevant experience; MS with 8+ years; or PhD with 6+ years.\nJob Type:\nExperienced HireShift:\nShift 1 (United States of America)Primary Location:\nUS, Oregon, HillsboroAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.Benefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $248,400.00-350,690.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role\nThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","description_format":"text","description_chars":5471,"description_truncated":false,"requirements":{"experience_years_min":12,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"phd","optional":false},"security_clearance":false,"languages":[]},"benefits":["Hybrid work"],"hiring_locations":[{"name":"United States","iso":"US","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-11-12T22:04:34Z"}],"visa":[{"country":"US","licensed_sponsor":true,"adverts_offering_sponsorship_24m":0,"sanctioned_now":false,"evidence":"H-1B filings in 12 months: 2,029 · green card filings: 490","filings_12m":2029,"filings_prev_12m":3014,"green_card_filings_12m":490,"median_offered_wage_usd":134832,"route":null,"cap_exempt":false,"checked_at":"2026-11-12T07:36:15+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":86,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.86,"p_room":1,"age_days":0,"expected_fill_days":30,"reasons":["conf:1","win:early","comp:brand"],"computed_at":"2026-11-13T04:20:08Z"},"pay":null,"html_url":"https://alion.io/job/intel-process-integration-program-leader-hybrid-bonding-3dic","json_url":"https://alion.io/job/intel-process-integration-program-leader-hybrid-bonding-3dic.json","meta":{"generated_at":"2026-11-13T04:20:08Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":9183,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-14T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.1,"usd":0.01,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":35},"rest":"https://alion.io/mcp/rest/get_company?id=35"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fintel-process-integration-program-leader-hybrid-bonding-3dic"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"free","price":{"credits":0,"usd":0},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fintel-process-integration-program-leader-hybrid-bonding-3dic"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.1,"usd":0.01},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fintel-process-integration-program-leader-hybrid-bonding-3dic"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/intel-process-integration-program-leader-hybrid-bonding-3dic\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fintel-process-integration-program-leader-hybrid-bonding-3dic"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":4200707}},{"tool":"search_jobs","arguments":{"company":"intel.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":4200707},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. Docs: https://alion.io/developers"}}