{"id":3328392,"url":"https://alion.io/job/intel-quality-and-reliability-engineer","title":"Quality and Reliability Engineer","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":90,"ghost_share":0.033,"stale_share":0.544,"repost_share":0.044,"time_to_fill_p50_days":30,"computed_at":"2026-11-02T06:13:15Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":"full_time","work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["George Town, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":19500,"max_usd":44000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":8444},"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Machine Learning","optional":false}],"status":"live","first_seen_at":"2026-09-10T00:00:00Z","employer_posted_date":"2026-09-10","last_verified_at":"2026-11-02T07:34:56Z","board_verified":true,"closed_at":null,"days_open":53,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":53},"description":"Job Details:\nJob Description:\nThe Role and Impact:\nWe are seeking a passionate Manufacturing Quality and Reliability Engineer to join the Foundry QnR team at our Penang site supporting Intel's packaging programs. The scope will be supporting C4 bumping and interconnect quality for WPM (wafer packaging manufacturing/ 3D Foveros technology) and ATM (assembly technology Mfg/ traditional package level assembly).\nYou will play a critical role in ensuring our products and bumping processes meet the highest quality and reliability standards from wafer fabrication through packaging and assembly.\nThis position is pivotal to the success of our manufacturing operations, directly impacting the performance of our products and customer satisfaction. By driving continuous process improvements and proactive quality initiatives, you will contribute to building a culture of excellence while helping Intel maintain its reputation as an industry leader.\nThis role provides the opportunity to influence development forums, and factory operations while advancing cutting-edge manufacturing practices.\nKey Responsibilities:\nManage manufacturing excursions while driving continuous improvement: chair MRB meetings, drive containment strategies, rapid product risk assessments and discrepant material dispositions (3D). Effectively communicate with internal Foundry partners and Intel customers.\nProvide technical input on solder joint reliability and thermomechanical interactions between wafer, die, and package to support risk assessment and technical decision-making.\nCollaborate with cross-functional teams to drive effective Root Cause and systemic Corrective actions (8D's).\nDevelop and implement systems for early detection and containment of excursions.\nOwn and continuously enhance material disposition RFC's, eDispo screens, and other QnR best known methods.\nSupport factory Operations and output commits, e.g. daily/ timely material disposition and die inking for meeting commits.\nSupport technology certification and ramp activities collaborating with TD and ramp partners.\nUse data extraction tools, custom scripting and statistical analysis techniques to assess and present inline, EOL, and Reliability data.\nExtract insights from structured and unstructured data using statistics and machine learning to determine product disposition.\nQualifications:\nMinimum Qualifications:\nMaster's degree in Material Science, Physics, Chemical Engineering, Mechanical Engineering or related field of study with relevant work experience in semiconductor Manufacturing, C4 bumping process and chip assembly.\n5 years of relevant work experience in semiconductor Manufacturing, C4 bumping process, and chip assembly with a bachelor's degree.\nExperience in solder joint reliability, excursion management, and failure mode analysis.\nProficiency in statistics and data analytics tools for quality and reliability assessments.\nExperience with data mining to synthesize insights from structured and unstructured data.\nFamiliar with QnR Quality Systems and tools.\nEffective verbal and written communication, and effective meetings skills.\nMotivated self-starter and self-driven learner to develop skills in various semiconductor and chip assembly processes.\nDemonstrate strong Quality and Zero-defect mindset, and Intel values of Velocity, Efficiency, and Customer 1st.\nBe comfortable working in a diverse environment and across geographies.\nPreferred Qualifications:\nInfluencing skills to drive a quality-focused mindset across the organization.\nProven ability to manage impactful Material Review Boards (MRBs).\nJoin us to shape the future of manufacturing quality and reliability at Intel and make a lasting impact on our products, processes, and customer experiences. Apply now to be part of this exciting journey.\nJob Type:\nExperienced HireShift:\nShift 1 (Malaysia)Primary Location:\nMalaysia, PenangAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/AWork Model for this Role\nThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. 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