{"id":2985901,"url":"https://alion.io/job/intel-senior-process-integration-engineer","title":"Senior Process Integration Engineer","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":124,"ghost_share":0.024,"stale_share":0.556,"repost_share":0.04,"time_to_fill_p50_days":24,"computed_at":"2026-10-23T05:54:15Z"}},"role":"Semiconductors","role_family":"Semiconductors","seniority":"senior","employment_type":"full_time","work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Taipei, Taiwan","Hsinchu, Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Photolithography","optional":true}],"status":"live","first_seen_at":"2026-10-21T08:25:14Z","employer_posted_date":"2026-10-21","last_verified_at":"2026-10-22T00:12:41Z","board_verified":true,"closed_at":null,"days_open":2,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":2},"description":"Job Details:\nJob Description:\nThe Role and Impact\nAs a Process Integration Development Engineer, you will drive revolutionary advancements in substrate manufacturing technologies, ensuring smooth and efficient integration processes for next-generation packaging solutions. Your primary focus will be working closely with supplier engineering teams to develop and optimize processes, manage capacity, improve yield and enhance lead times. This role is pivotal to Intel's ability to deliver cutting-edge solutions to meet growing customer demand on EMIB-T advanced packaging solutions. \nBusiness group\nThe role resides within Intel Corporation's Substrate Packaging Technology Development (SPTD) Dept and in the Substrate Integration Asia group, which focuses on advancing substrate packaging technologies to enable innovative solutions for heterogeneous chip architectures. The group collaborates with global teams and suppliers to deliver scalable manufacturing processes, supporting Intel's broader goals of technology leadership and innovation in advanced packaging. \nKey Responsibilities\nEngage with supplier engineering teams and Intel's US integration group to advance substrate technologies and manage critical process interactions. \nMonitor, optimize, and enhance bottleneck processes to reduce throughput time (TPT) and improve efficiencies. \nOversee schedules for product and test vehicle (TV) deliveries, resolving issues to meet aggressive on-time delivery (OTD) goals. \nAnalyze substrate lead times, develop reduction roadmaps, and ensure quarterly lead time targets are met. \nEnsure supplier adherence to Process Control System (PCS) commitments. \nCollaborate with internal teams to design and implement factory certification plans focused on yield improvement. \nDevelop milestone-driven micro-schedules for new factory startups, ensuring supplier compliance with startup timelines. \nLead qualification activities and monitor ramp indicators to ensure seamless production ramp-up for new capacity. \nInfluence strategic decision-making at supplier management levels through data-driven insights and recommendations.\nExpectation is for candidate to be at supplier factory on-site for minimum of 4 days a week.\nQualifications:\nMinimum Qualifications\nBachelor's degree in Science or Engineering with 10+ years, a Master's degree with 8+ years, or a PhD with 6+ years of work experience in a relevant field. \n8+ years of experience in fab back-end or substrate manufacturing process development. \nProficiency in supplier management, yield improvement and lead time analysis, with hands-on experience in structured problem-solving and supplier influence. Preferred Qualifications\nExpertise in substrate process building blocks, including component embedding, laser drilling, dielectric lamination, lithography, multi-metal electrolytic plating, defect inspection/metrology, and electrical testing. \nProven experience with process tool qualification in TD/ramp or HVM environments. \nFamiliarity with factory operations, substrates, manufacturing, process engineering, and yield improvement. \nFluent English communication skills, with exceptional presentation abilities and confidence to engage with supplier management. We invite you to join our dynamic team and make an impact in shaping the future of advanced substrate packaging technologies.\nJob Type:\nExperienced HireShift:\nShift 1 (Taiwan)Primary Location:\nTaiwan, TaipeiAdditional Locations:\nTaiwan, HsinchuPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/AWork Model for this Role\nThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","description_format":"text","description_chars":4641,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"Advanced (C1)","optional":true}]},"benefits":["Hybrid work"],"hiring_locations":[{"name":"Taiwan","iso":"TW","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-21T08:25:14Z"}],"visa":[],"liveness":{"score":63,"band":"ok","label":"Likely open","p_open":1,"p_active":0.632,"p_room":1,"age_days":1,"expected_fill_days":24,"reasons":["conf:29","stale_co","velocity","win:early","comp:brand"],"computed_at":"2026-10-23T05:54:15Z"},"pay":null,"html_url":"https://alion.io/job/intel-senior-process-integration-engineer","json_url":"https://alion.io/job/intel-senior-process-integration-engineer.json","meta":{"generated_at":"2026-10-23T13:18:10Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":19824,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-24T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":35},"rest":"https://alion.io/mcp/rest/get_company?id=35"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fintel-senior-process-integration-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fintel-senior-process-integration-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fintel-senior-process-integration-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/intel-senior-process-integration-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fintel-senior-process-integration-engineer"}]}