{"id":3321866,"url":"https://alion.io/job/intel-silicon-packaging-design-engineer","title":"Silicon Packaging Design Engineer","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"A","score":85,"open_postings":91,"ghost_share":0.033,"stale_share":0.505,"repost_share":0.044,"time_to_fill_p50_days":30,"computed_at":"2026-10-29T05:49:05Z"}},"role":"Hardware","role_family":"Hardware","seniority":"staff","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Bengaluru, India"],"countries":["IN"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":32000,"max_usd":68000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":646},"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Mentor Xpedition","optional":false}],"status":"live","first_seen_at":"2026-10-26T00:00:00Z","employer_posted_date":"2026-10-26","last_verified_at":"2026-10-29T02:31:34Z","board_verified":true,"closed_at":null,"days_open":3,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":3},"description":"Job Details:\nJob Description:\nDefine packaging solutions for highly innovative integrated circuits, meeting adequate mechanical, thermal and electrical performance with the goal to achieve lowest package and system level cost.Co-design with chip designer, system engineering and PCB design teams during the development stage to optimize pad layout and pin map for most cost effective package and system.\nIndependently plan, design and develop quality custom lead frame/substrate/module with supporting electrical simulation to reduce cross-talk, IR drop, and noise issues of the device.\nTechnical lead for implementing packaging solutions at OSAT assembly site and/or internal assembly site. Ensure optimized package design which meets the assembly design rules of the selected assembly site. Work with the assembly partner to mitigate any potential risk and improve situation to meet yield target within the project milestone requirement.\nCo-work with NPI manager to prepare assembly site readiness for continuous uninterrupted flow from wafer fab-out to quality packaged sample meeting the required NPI schedule.\nMaintain complete set of product specific packaging related drawings, and reports.\nQualifications:\nBachelor / Master degree in Electrical Engineering / Mechanical Engineering / Material Science with more than 10 years experience in the field of IC Packaging Design and Layout.Package design experience using Siemens Xpedition EDA tool set is a must.\nUnderstand performance and cost trade-offs for different layout and assembly rules.\nExtensive manufacturing process knowledge regarding wafer bumping, substrate and lead frame manufacturing and assembly of wire bond and flip chip packages is required.\nPractical knowledge of Signal integrity and Power integrity in PCB design will be an advantage.\nPossesses good analytical, communication and organization skills.\nJob Type:\nIntel Contract EmployeeShift:\nShift 1 (India)Primary Location:\nIndia, BangaloreAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/AWork Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. 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