{"id":2985925,"url":"https://alion.io/job/intel-thin-films-module-engineering-phd-intern","title":"Thin Films Module Engineering - PhD Intern","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":83,"open_postings":104,"ghost_share":0.019,"stale_share":0.596,"repost_share":0.038,"time_to_fill_p50_days":27,"computed_at":"2026-10-21T05:46:15Z"}},"role":"Early Careers","role_family":"Early Careers","seniority":"intern","employment_type":"internship","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hillsboro, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":51000,"max_usd":83000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":372},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"JMP","optional":true},{"name":"Python","optional":true}],"status":"live","first_seen_at":"2026-10-20T00:00:00Z","employer_posted_date":"2026-10-20","last_verified_at":"2026-10-21T16:05:53Z","board_verified":true,"closed_at":null,"days_open":1,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":1},"description":"Job Details:\nJob Description:\nThe Role and Impact\nAs a Module Engineering PhD Intern, you will play a key role in developing and sustaining semiconductor manufacturing processes for a specific module. Your day-to-day responsibilities will include supporting equipment troubleshooting, performing maintenance and qualification activities, and collaborating with engineering teams to optimize process control methodologies. This role offers a unique opportunity to gain hands-on experience in semiconductor manufacturing while building essential skills for a future career in engineering. \nBusiness group \nYou will join the Intel Foundry team, a dynamic and innovative group dedicated to delivering cutting-edge manufacturing solutions that drive Intel's technology forward. The team focuses on advancing semiconductor fabrication processes in areas such as Diffusion, Dielectrics, Implant, EPI, and FE Metals. As part of this group, you will contribute to Intel's mission of creating world-changing technology that enables global progress and enriches lives.\nWhat We Do\nAs members of the Manufacturing Development and Customer Engineering (MDCE) team, we are responsible for improving process capability for multiple technology nodes (Intel 18A, Intel 3, Intel 12nm and upcoming technologies) from initial product qualification through high volume manufacturing. The focus will be on delivering yield improvement, performance enhancement, variation and cost reduction.\nKey Responsibilities \nAssist with the development and implementation of thin film manufacturing processes for a specific module within Intel's semiconductor production. \nSupport troubleshooting and maintenance activities for manufacturing equipment to ensure optimal performance. \nParticipate in equipment qualification processes, ensuring compliance with quality and functional standards. \nCollaborate with engineering teams to optimize process control methodologies and achieve production targets. \nEstablish strong working relationships and partner closely with technology development, high volume manufacturing and cross-functional stakeholders to achieve common goals.\nAnalyze data trends, identify solutions for process improvement and drive automation improvements (using AI where applicable)\nContribute to sustaining and improving manufacturing tools and processes while gaining hands-on experience in semiconductor engineering.\nQualifications:\nMinimum Qualifications \nCurrently pursuing a PhD degree in a relevant STEM discipline (e.g. Physics, Applied Chemistry, Chemical Engineering, Electronic Engineering, Mechanical Engineering, Computer Science, etc.).\nStrong analytical and problem-solving skills.\nExperience writing software code for application in above majors \nExcellent communication skills - both written and verbal.\nAbility to work independently and as part of a diverse, high-performing team.\nWillingness to work in a cleanroom environment.\nStrong attention to detail and disciplined approach to procedures.\nData analysis skills with demonstrated ability to construct clear data-based problem statements, design of experiment.\nPreferred Qualifications\nExperience with data analysis tools and software (e.g. JMP, Python, Excel, and AI tools).\nAbility to summarize data for technical and non-technical audiences. \nPlease note, the ideal candidate will be open to work a 6-month internship schedule beginning the Spring of 2027 through December 2027.\nThis is your chance to join a global leader in semiconductor manufacturing, gain real-world experience, and contribute to innovative solutions that shape the future of technology. If you are ready to learn, grow, and make an impact, we encourage you to apply today.\nJob Type:\nStudent / InternShift:\nShift 1 (United States of America)Primary Location:\nUS, Oregon, HillsboroAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.Work Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","description_format":"text","description_chars":5590,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"phd","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-21T08:25:14Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 2,014 · green card filings: 487","filings_12m":2014,"filings_prev_12m":3001,"green_card_filings_12m":487,"median_offered_wage_usd":134579,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":86,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.86,"p_room":1,"age_days":1,"expected_fill_days":27,"reasons":["conf:1","win:early","comp:junior,brand"],"computed_at":"2026-10-21T17:36:33Z"},"pay":null,"html_url":"https://alion.io/job/intel-thin-films-module-engineering-phd-intern","json_url":"https://alion.io/job/intel-thin-films-module-engineering-phd-intern.json","meta":{"generated_at":"2026-10-21T17:36:33Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":24828,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-22T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":35},"rest":"https://alion.io/mcp/rest/get_company?id=35"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fintel-thin-films-module-engineering-phd-intern"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fintel-thin-films-module-engineering-phd-intern"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fintel-thin-films-module-engineering-phd-intern"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/intel-thin-films-module-engineering-phd-intern\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fintel-thin-films-module-engineering-phd-intern"}]}