{"id":983185,"url":"https://alion.io/job/iqm-quantum-computers-design-engineer-microelectronics-packaging","title":"Design Engineer, Microelectronics Packaging","company":{"id":1040073,"name":"IQM Quantum Computers","domain":"iqm.tech","url":"https://alion.io/company/iqm-2","size_band":"201-500","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Teamtailor","truth_index":{"grade":"B","score":75,"open_postings":8,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":30,"computed_at":"2026-11-01T06:10:25Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":null,"employment_type":"full_time","work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Tokyo, Japan"],"countries":["JP"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"IQM","optional":false}],"status":"live","first_seen_at":"2026-09-14T16:09:15Z","employer_posted_date":"2026-09-14","last_verified_at":"2026-11-01T20:13:35Z","board_verified":true,"closed_at":null,"days_open":48,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":48},"description":"At IQM, we build world-leading quantum computers for the well-being of humankind. We design systems to tackle computational challenges beyond the practical limits of classical machines. Our work sits at the edge of science and engineering. It's complex, demanding, and deeply collaborative. We turn deep research into reliable, full-stack systems that drive discoveries in fields like medicine, energy, and technology, reshaping how the world computes.\nJoin the team that gives quantum a heartbeat.\nThe work\nIn this role, you will develop the 3D integrated stack that gives our QPUs clean, high-quality microwave and DC connectivity, built to survive and perform at cryogenic temperatures. You will work as part of our Emerging Technologies team, based at our Japan site. Your work sits right at the intersection of IQM's own development teams in Europe and our Japanese partners, helping define the packaging solutions that will let future generations of QPUs scale.\nWhat you’ll actually do\nDevelop functionalities and features of the 3D integrated stack for high-quality microwave and DC connectivity under cryogenic operation\n\nDefine stack and process requirements together with internal teams and external fabrication partners, covering PCB, ceramic, glass, or silicon-based processes\n\nDevelop, optimize, and characterize die packaging processes for chips built to operate in cryogenic environments\n\nPlan and implement testing and validation procedures, both at IQM and together with our Japanese partners\n\nAct as the technical link between IQM and our partners, balancing QPU package requirements with what is realistically achievable on their end\n\nContribute to planning test strategies, mapping out what capabilities are available at IQM and at partner sites\n\nGet hands on with testing: electrical and thermal characterization of stack features\n\nDocument your work clearly, so findings are easy to pick up by teammates and partners across time zones\n\nWork independently day to day, while staying closely connected to IQM's development teams in Europe\n\nWhat we’re looking for\nMaster's or PhD in experimental physics, electrical engineering, or a related technical field\n\nExperience with heterogeneous 3D integration technologies, such as bump bonding or RDL fan-out\n\nWorking knowledge of standard CAD tools used in package design\n\nUnderstanding of DC, thermal, and/or microwave characterization techniques\n\nFamiliarity with cryogenic measurement techniques\n\nComfortable working independently, and just as comfortable coordinating across IQM's European teams and external partners\n\nStrong documentation skills, and fluent spoken and written English and Japanese\n\nWillingness to travel\n\nSeen as an advantage\nExperience with superconducting quantum computing hardware, chips, or system integration\n\nUnderstanding of superconducting materials properties\n\nPrior experience collaborating with external fabrication or foundry partners\n\nWhy IQM?\nFull-stack quantum computing: From quantum hardware to software layers and beyond, we build across the full-stack.\n\nHigh-performance playground: We aim high, and we know sustainable performance only works when life outside work does too-hybrid setups, flexible hours.\n\nNever the smartest: You won’t always be the smartest person in the room. Neither will we. Expect to learn constantly - from each other and beyond with IQM’s Learning Hub, LinkedIn Learning, and a team-based L&D budget.\n\nApproachable leadership: Flat hierarchy, direct access. Feel free to approach any leaders. They're friendlier than they look!\n\nThe sweet spot: Big enough to matter. Small enough to move fast. Growing between a startup and a corporation. We’re in the phase where top performers get noticed.\n\nBigger than IQM: Our people build know-how for the entire quantum ecosystem. We publish papers, run hackathons, and help shape a market that's still being defined.\n\nThe future of computing won’t build itself. You might be one of the few who do.\nMeet our people and learn more about IQM on ourstories page.\n\nExplore ourscientific publications.\n\nWe'll start interviews and move forward with hiring as soon as we meet strong candidates. Please submit your application soon.\n600M€+ Total Funding | 400+ Team Members | 30+ Quantum Computers Built | 300+ Patents Filed | 10 Location Globally","description_format":"text","description_chars":4309,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"All levels","optional":false}]},"benefits":[],"hiring_locations":[{"name":"Japan","iso":"JP","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Electrical & Electronic Engineering","Venture Capital"],"lifecycle":[{"event":"open","at":"2026-09-16T22:25:23Z"}],"visa":[],"liveness":{"score":26,"band":"fade","label":"Fading","p_open":1,"p_active":0.589,"p_room":0.45,"age_days":47,"expected_fill_days":30,"reasons":["conf:0","velocity","win:tail"],"computed_at":"2026-11-01T06:10:25Z"},"pay":null,"html_url":"https://alion.io/job/iqm-quantum-computers-design-engineer-microelectronics-packaging","json_url":"https://alion.io/job/iqm-quantum-computers-design-engineer-microelectronics-packaging.json","meta":{"generated_at":"2026-11-01T20:47:59Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":31806,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-02T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":1040073},"rest":"https://alion.io/mcp/rest/get_company?id=1040073"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fiqm-quantum-computers-design-engineer-microelectronics-packaging"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fiqm-quantum-computers-design-engineer-microelectronics-packaging"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fiqm-quantum-computers-design-engineer-microelectronics-packaging"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/iqm-quantum-computers-design-engineer-microelectronics-packaging\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fiqm-quantum-computers-design-engineer-microelectronics-packaging"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":983185}},{"tool":"search_jobs","arguments":{"company":"iqm.tech","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":983185},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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