嵌入式软件工程师

BIWIN • Chinese: C1 • Digital Storage • Computer Components • 16 days ago
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Salary
≈ $27k – $78k per year (Estimated)
Location
In office (Hangzhou)

Confirmed on the employer's own hiring board on Oct 20, 2026. First seen by Alion on Feb 5, 2025. BIWIN scores B on the Alion truth index.

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Profile match

BIWIN

BIWIN, formally Shenzhen BIWIN Storage Technology, is a Chinese semiconductor memory company headquartered in Shenzhen that designs, packages and tests storage products, including embedded eMMC, UFS and LPDDR memory, solid state drives, DRAM modules and memory cards. Founded in 2010 and listed on the Shanghai STAR Market under code 688525, it is recognised as a national high-tech enterprise and has received strategic investment from the second phase of China's National Integrated Circuit Industry Investment Fund. Its openings include 2027 graduate roles in accounting, HR, SMT and AOI process and MES engineering, plus senior chip architecture and packaging process positions.
biwin.com.cn • HQ: Shenzhen, China • Memory & Storage Chips • Computer Components • Digital Storage • 1001-5000 employees • Est. 2010
Tech stack of BIWIN
Backed by Fortune Capital

岗位职责 / Responsibilities

1、参与EMMC/UFS嵌入式产品固件开发及维护;

2、负责固件复杂模块的需求分析、方案设计、实现与优化;

3、参与复杂特性的设计及实现;

4、参与开发需求、架构/特性/模块设计文档及测试用例设计文档的评审;

5、主导问题定位及解决;

6、承担部分初/中级固件工程师的培养工作;

7、参与先进存储算法及产品的预研

任职要求 / Requirements

1、拥有较丰富的C语言编码与问题定位的经验;

2、包括编码、debug、代码优化、代码审查及技术文档撰写在类的基本功优秀;

3、曾经负责过复杂特性或模块的设计与开发且交付质量优秀;

4、拥有不低于5年的闪存类产品固件开发经验或其它存储类产品软件或其它嵌入式软件开发经验;

5、团队工作能力优秀;

6、工作态度积极、能主动克服各种困难、自我驱动能力优秀;

7、熟悉EMMC、UFS、SATA、NVME 接口协议及相关的开发;

8、熟悉NAND Flash的特性及使用;

9、熟悉常见的FTL算法，如重建、GC、WL、read disturb、data retention等;

10、熟悉或了解IPD 产品开发流程更优;

注：具备上述7、8、9项任意一项即可

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