{"id":1528239,"url":"https://alion.io/job/jcet-group-associate-engineer-wire-bond-equipment","title":"Associate Engineer – Wire Bond Equipment","company":{"id":59089,"name":"JCET Group","domain":"jcetglobal.com","url":"https://alion.io/company/jcet-group","size_band":null,"is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":null,"truth_index":null},"role":"Semiconductors","role_family":"Semiconductors","seniority":"junior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Singapore"],"countries":["SG"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":1800,"max":2700,"currency":"SGD","period":"month","gross":true,"usd_annual":25380},"salary_estimate":null,"experience_years_min":2,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-09-30T00:00:00Z","employer_posted_date":null,"last_verified_at":"2026-09-30T00:00:00Z","board_verified":false,"closed_at":null,"days_open":28,"trust":{"level":"not_scored","repost_count":null,"flags":[],"days_open":28},"description":"About us\nSTATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.\nAbout the role\nWe are seeking a motivated and hands-on Associate Engineer to support the setup, maintenance, troubleshooting, and repair of wire bond equipment in a semiconductor manufacturing environment.\nKey responsibilities\nPerform machine setup, qualification, and conversion for wire bond equipment.\n\nTroubleshoot and repair equipment-related issues to minimize production downtime.\n\nConduct preventive and corrective maintenance activities.\n\nMonitor equipment performance and implement improvement actions.\n\nSupport production during machine breakdowns and urgent technical issues.\n\nPerform root cause analysis and corrective actions.\n\nMaintain equipment documentation and spare parts records.\n\nWhat we're looking for\nMinimum Diploma in Electrical, Electronics, Mechanical, Mechatronics Engineering or related field.\n\nMinimum 2 years of hands-on experience in wire bond equipment maintenance and troubleshooting.\n\nExperience with KNS Maxum, iConn, or Rapid Bonder machines is preferred.\n\nStrong troubleshooting and problem-solving skills.\n\nKnowledge of semiconductor backend assembly processes is an advantage.\n\nAble to support 12-hour rotating shifts.\n\nWilling to work both Day Shift and Night Shift based on operational requirements.\n\nSkills\nEquipment and Inventory Management, Preventive Maintenance, Semiconductor Industry, Mechatronics Engineering, Root Cause Analysis, Electrical, System Setup, shifts schedules, Mechanical, Equipment Maintenance, Analytical and Problem-Solving Skills, Maintenance Support, Electrical Engineering (including power engineerin, Wire Bonding, Electronics, Performance 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