{"id":3444165,"url":"https://alion.io/job/jcet-group-senior-process-associate-engineer","title":"Senior / Process Associate Engineer","company":{"id":59089,"name":"JCET Group","domain":"jcetglobal.com","url":"https://alion.io/company/jcet-group","size_band":"201-500","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":null,"truth_index":null},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"junior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Singapore"],"countries":["SG"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":2600,"max":3500,"currency":"SGD","period":"month","gross":true,"usd_annual":32748},"salary_estimate":null,"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-29T00:00:00Z","employer_posted_date":null,"last_verified_at":"2026-10-29T00:00:00Z","board_verified":false,"closed_at":null,"days_open":4,"trust":{"level":"not_scored","repost_count":null,"flags":[],"days_open":4},"description":"About us\nSTATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.\nAbout the role\nTo provide technical and administrative support to Process Engineers in CoW Dept to ensure total customer satisfaction related to product quality, productivity and cost effectiveness.\nKey responsibilities\nTroubleshooting line issues in Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure area\n\nSupport small improvement projects assigned by Process Engineer\n\nAct as communication channels to transmit all messages/information (in particular process change related) to production floor\n\nImmediate response to analyze products with problem\n\nCross support with line supervisor to clear real time bottleneck that impact cycle time and quality\n\nCross support with others Process Associate Engineer to clear equipment down times\n\nWhat we're looking for\nDiploma in any Engineering field\n\nAbility to work 12 hours rotating shift\n\nPositive mindset and ability to adapt to fast-paced working environment\n\nWillingness to study the process of Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure\n\nFresh graduate is encouraged to apply\n\nSkills\nGraduate Recruitment, communication channels, Resolving Product Problems, Urban Design, Process Improvement, Wafer Testing, shifts schedules, Asian Studies, Social Sciences, Data Engineering, Equipment Maintenance, Plasmas, real-time support, Engineering, Design Research, Work in A Fast Paced 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