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Location
In office (Dortmund)
Seniority
Intern
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Internship

Confirmed on the employer's own hiring board on Oct 11, 2026. First seen by Alion on Sep 1, 2026.

Overview
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Revolutionary Copper MIMO technology eliminates costly HBM chips. 10X lower cost, 3X lower power, 8X more scale for next-gen AI systems and connectivity.

Kandou is redefining AI infrastructure through innovative interconnect technologies that significantly reduce power consumption while maintaining high bandwidth and ultra-low latency. Our mission is to make AI systems more scalable, efficient, and accessible.

We currently have internship openings in our Engineering Team for MSc students in Dortmund - North Rhine-Westphalia - Germany and the surrounding area, offering a 6-month term with the possibility of extension, in the following areas:

Your Responsibilities

Depending on your area of expertise, you will support one or more of our engineering teams in the following areas:

  • Digital Design

  • Support the RTL design of digital circuits using SystemVerilog or VHDL.

  • Contribute to the development, analysis, and optimization of digital logic.

  • Support synthesis flows and evaluate synthesis results.

  • Digital Verification

  • Develop and maintain verification environments using SystemVerilog and UVM.

  • Create and execute functional tests.

  • Support the implementation of SystemVerilog Assertions.

  • Physical Design

  • Support floorplanning, place-and-route, and design implementation activities.

  • Contribute to Static Timing Analysis tasks.

  • Develop automation and data-analysis scripts.

  • Analog Design

  • Support the development and analysis of analog and mixed-signal circuits.

  • Contribute to SPICE-based circuit simulations.

  • Support high-speed SerDes, PLL, or related connectivity design activities.

  • Your Qualifications

  • Currently enrolled in a Master's degree program in Dortmund- North Rhine-Westphalia-Germany and the surrounding area in Electrical Engineering, Microelectronics, Telecommunications Engineering, Information Technology, Computer Engineering, or a related field, with a completed Bachelor's degree.

  • Basic knowledge in at least one of: digital design & RTL, digital verification, physical design, or analog/mixed-signal design.

  • Structured, analytical, and detail-oriented working style with clear documentation skills.

  • Preferred Additional Skills

Depending on your area of assignment, the following are a plus:

  • Digital: SystemVerilog, VHDL, UVM, SystemVerilog Assertions, or formal verification.

  • Physical Design: Static Timing Analysis, CDC analysis, floorplanning/place-and-route, Cadence Innovus or Synopsys ICC2.

  • Analog: SPICE simulation, Cadence Virtuoso, high-speed SerDes or PLL design.

  • General: Python, Tcl, or Perl scripting; version-control systems and automated development flows.

  • What We Offer

  • Hands-on exposure to real semiconductor and connectivity projects, working closely with experienced engineering teams.

  • The chance to apply your Master's coursework to real-world engineering tasks in an international environment.

  • Flexible working hours with meaningful, independent responsibilities and hybrid options where applicable.

  • Application

Please submit your CV and include the following information:

  • Your Master's degree program, university, and expected graduation date.

  • Proof of current enrollment.

  • Preferred technical area of assignment and availability (hours per week).

  • Relevant experience (projects, internships, EDA tools/languages) and earliest possible start date.

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