{"id":3941285,"url":"https://alion.io/job/l3harris-technologies-senior-specialist-electrical-engineering-microelectronics-failure-analysis-engineer","title":"Senior Specialist, Electrical Engineering -Microelectronics Failure Analysis Engineer","company":{"id":177017,"name":"L3Harris Technologies","domain":"l3harris.com","url":"https://alion.io/company/l3harris-technologies","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"SuccessFactors","truth_index":{"grade":"A","score":100,"open_postings":53,"ghost_share":0,"stale_share":0.019,"repost_share":0.038,"time_to_fill_p50_days":21,"computed_at":"2026-11-09T06:03:00Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Palm Bay, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Electron Microscopy (SEM/TEM)","optional":false},{"name":"MATLAB","optional":false},{"name":"Python","optional":false}],"status":"live","first_seen_at":"2026-11-02T00:00:00Z","employer_posted_date":"2026-11-02","last_verified_at":"2026-11-10T00:37:31Z","board_verified":true,"closed_at":null,"days_open":8,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":8},"description":"Job Title: Senior Specialist, Electrical Engineering - Microelectronics Failure Analysis Engineer\nJob Code: 47053\nJob Location: Palm Bay, Florida\nJob Schedule: 9/80 - Employees work 80 hours over nine days in each two-week period, with every other Friday off.\nJob Description\nL3Harris is seeking a Senior Specialist, Microelectronics Failure Analysis Engineer to investigate component failures and provide actionable insights that improve product quality and reliability. This role will lead investigations involving microelectronic components or circuit level assemblies that fail during manufacturing, qualification, testing, or field operation.\nThe engineer will develop investigative plans, perform hands-on electrical and physical analysis, and interpret evidence to identify failure mechanisms and establish root cause. Core techniques include optical microscopy, X-ray inspection, cross-sectioning, scanning electron microscopy (SEM), photoemission microscopy, electrical testing, decapsulation, and delayering.\nThis position requires strong technical judgment, laboratory proficiency, and the ability to communicate complex findings clearly to both technical and non-technical audiences. The successful candidate will collaborate with design, manufacturing, quality, reliability, and supplier teams to recommend corrective actions and verify their effectiveness.\nEssential Functions\nLead microelectronic failure investigations from initial assessment and test planning through root cause determination, reporting, and corrective action verification.\nEstablish analysis strategies based on device construction, failure symptoms, operating history, and available evidence, sequencing techniques to preserve critical information.\nUse optical microscopy and X-ray inspection to evaluate component condition, package integrity, internal structures, and potential assembly defects.\nPerform electrical testing and characterization to reproduce reported failures, identify abnormal device behavior, and isolate suspect circuits or connections.\nApply photoemission microscopy and liquid crystal hotspot detection to isolate leakage related phenomena on integrated circuits. \nPrepare samples through decapsulation, cross-sectioning, and controlled delayering to expose internal features while minimizing preparation-induced damage.\nExamine exposed structures using SEM to characterize defects in semiconductor devices, metallization, bond wires, interfaces, and package interconnects.\nCorrelate electrical measurements, imaging results, physical observations, and manufacturing or field history to distinguish failure symptoms from underlying causes.\nEvaluate potential mechanisms such as electrical overstress, electrostatic discharge, corrosion, contamination, delamination, metallization damage, and interconnect fatigue.\nPartner with engineering, manufacturing, quality, reliability, and suppliers to translate investigation findings into practical design, material, or process improvements.\nAssess follow-up test results and analysis data to determine whether corrective actions address the identified failure mechanism.\nProduce clear technical reports that document methods, supporting evidence, conclusions, limitations, and recommended next steps.\nPresent detailed findings to technical teams and provide concise, accessible summaries for program leadership, customers, and non-technical stakeholders.\nManage concurrent investigations, communicate priorities and progress, and escalate technical risks or resource constraints.\nDevelop and improve laboratory procedures, sample preparation methods, and analysis workflows.\nProvide technical guidance and mentoring to engineers and laboratory personnel.\nMaintain traceable investigation records and follow applicable laboratory safety, chemical handling, ESD control, and equipment procedures.\nQualifications\nBachelor’s degree in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related technical discipline and a minimum of six years of relevant experience; graduate degree and a minimum of four years of relevant experience; or, in lieu of a degree, a minimum of ten years of relevant experience.\nPreferred Additional Skills\nExperience analyzing analog, digital, mixed-signal, RF, power, or discrete semiconductor components.\nHands-on experience investigating failures in semiconductor devices, integrated circuits, or microelectronic packages.\nDemonstrated proficiency in electrical testing and physical failure analysis, including optical microscopy, X-ray inspection, cross-sectioning, SEM, photoemission microscopy, decapsulation, and delayering.\nWorking knowledge of semiconductor device operation, fabrication processes, packaging technologies, and common failure mechanisms.\nExperience integrating results from multiple analytical techniques to develop evidence-based root cause conclusions.\nDemonstrated ability to write technical reports and communicate investigation results to technical and non-technical audiences.\nAbility to work independently and collaborate across multidisciplinary teams.\nFamiliarity with advanced packaging, including flip-chip devices, ball grid arrays, stacked die, and multichip modules.\nExperience with complementary techniques such as energy-dispersive X-ray spectroscopy (EDS), scanning acoustic microscopy, or thermal imaging.\nKnowledge of physics-of-failure principles and methods for distinguishing component defects from assembly, application, or environmental causes.\nExperience supporting aerospace, defense, or other high-reliability electronics programs.\nProficiency with data analysis and automation tools such as Python, MATLAB, or LabVIEW.\nStrong organizational skills and experience balancing multiple investigations with competing priorities.\nActive security 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