Account Manager 3

The group you’ll be a part of

The APCO (Advanced Packaging Customer Operations) team is responsible for driving business growth and supporting customers in the advanced packaging and substrate manufacturing markets.

As part of the APCO team, you will work closely with leading OSAT, PCB, and semiconductor manufacturers, promoting and supporting a portfolio of advanced process equipment, including:

• Panel plating systems for PCB and substrate manufacturing customers
• Electroplating tools for advanced packaging applications
• Etch systems for wafer-level and panel-level processing
• PECVD equipment for semiconductor packaging and wafer-level manufacturing

You will collaborate with customers, engineering teams, and global business partners to develop solutions, address technical and commercial requirements, and drive successful adoption of APCO products across the semiconductor packaging ecosystem.

The impact you’ll make

As an Account Manager at Lam, you are essential to fostering lasting relationships with our valued customers. Engaging directly with customers, you'll proactively address their needs, arrange strategic meetings, and support them with a range of Lam’s wafer fabrication equipment products and services. Your dynamic approach ensures the success of our partnerships and contributes to Lam's position as an industry leader.

What you’ll do

• Drive sales growth by promoting and selling semiconductor manufacturing equipment and panel handling solutions to customers in the OSAT, PCB, and electronics manufacturing markets.
• Build and maintain strong relationships with existing customers while identifying and developing new business opportunities.
• Act as the primary customer interface, understanding customer requirements and providing effective technical and commercial solutions.
• Collaborate closely with engineering, product management, and service teams to address customer needs and ensure successful project execution.
• Coordinate technical discussions, product demonstrations, and customer presentations.
• Manage the sales process from opportunity identification through quotation, negotiation, and order closure.
• Gather market intelligence and customer feedback to support product development and business strategy.
• Ensure high levels of customer satisfaction through proactive communication and ongoing support.

This version sounds professional and emphasizes customer relationships, tool sales, and close collaboration with engineering teams.

Who we’re looking for

• Minimum of 5 years of related experience with a Bachelor’s degree; or 3 years and a Master’s degree; or a PhD without experience; or equivalent work experience.

• Key Requirements:

  • Proven sales experience in the semiconductor, OSAT, or PCB industry.
  • Strong knowledge of panel handling equipment/tools and related manufacturing processes.
  • Established customer relationships and the ability to develop new business opportunities.
  • Fluent English communication skills, both written and verbal.
  • Excellent customer-facing, presentation, and negotiation skills.

  • Strong interpersonal and communication abilities, with the capability to work effectively across internal and external stakeholders.

  • Self-motivated, results-driven, and capable of managing multiple customer accounts and projects.

Preferred qualifications

Preferred Experience:

• Experience selling semiconductor manufacturing equipment, automation systems, or panel handling solutions.
• Familiarity with advanced packaging, substrate, PCB, or panel-level manufacturing processes.
• Experience working with global customers and multinational teams.

This position requires a customer-focused individual who can build strong relationships, identify business opportunities, and drive sales growth in the semiconductor packaging and electronics manufacturing market.

Our commitment

We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results.

Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees.

Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories - On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time.