{"id":2645524,"url":"https://alion.io/job/lam-research-process-engineer-5-advanced-packaging-integration-technologist","title":"Process Engineer 5 (Advanced Packaging Integration Technologist)","company":{"id":58649,"name":"Lam Research","domain":"lamresearch.com","url":"https://alion.io/company/lam-research","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"C","score":57,"open_postings":672,"ghost_share":0.438,"stale_share":0.057,"repost_share":0.722,"time_to_fill_p50_days":71,"computed_at":"2026-10-22T06:10:10Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":null,"work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"inferred","locations":["Tualatin, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":108000,"max_usd":204000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":5966},"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"ALD","optional":true},{"name":"CVD","optional":true},{"name":"Design of Experiments","optional":true},{"name":"JMP","optional":true},{"name":"Minitab","optional":true},{"name":"Plasma Etch","optional":true},{"name":"PVD","optional":true},{"name":"Statistical Process Control","optional":true}],"status":"live","first_seen_at":"2026-09-19T21:03:12Z","employer_posted_date":"2026-10-15","last_verified_at":"2026-10-22T05:35:38Z","board_verified":true,"closed_at":null,"days_open":32,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":32},"description":"The group you’ll be a part of\nThe Advanced Packaging Integration Group focuses on driving differentiated solutions from Lam to enable customer heterogeneous integration product and process roadmaps through orchestration of joint projects and integrated test vehicles with ecosystem partners including research institutes, consortia, universities, and peer companies. The Technology and Ecosystem Engagements Group enables a virtual integration center for Lam product groups and customer engagement teams to drive accelerated studies to understand and resolve challenging process integration problems and deliver unique and effective product solutions to meet future customer roadmaps.\nThe impact you’ll make\nIn this role, you will directly contribute to expanding Lam Research's Advanced Packaging technology leadership and industry influence by leading and executing complex JDPs and research programs that create measurable business value across engineering, manufacturing, supply chain, and business operations. You will partner with engineers and leaders across multiple product groups and customer account teams across Lam as well as external ecosystem leaders to orchestrate a virtual integration center that enables faster decision-making, operational efficiency, innovation, and strengthens Lam's competitive advantage. You will collaborate and generate integration flows that meet manufacturability and reliability requirements to drive novel technology development options. You will also represent Lam Research as a technology ambassador at industry conferences and symposiums, enhancing our vision and strategy of advancing technology through strong ecosystem collaborations.\nWhat you’ll do\nSubject matter expertise in logic and memory advanced packaging integration including 2D/2.5D/3D, WLP, HBM, etc.\nAbility to synthesize customer AP roadmap needs, generate process integration flow options, identify unit process challenges, and propose solution paths to enable highest possible product performance, yield, and reliability.\nEngage closely with PG engineering and customer account technologist teams on test vehicle needs for improved unit process development and characterization, help develop test vehicle flows.\nStudy system-level co-optimization trends across different logic and memory product and process segments, identify emerging challenges and critical HW and process needs that Lam products need to develop to stay differentiated and ahead of competition.\nDesign experiments, lead data analysis, and drive systematic root-cause + corrective actions as needed to resolve process integration problems.\nAlong with ecosystem engagement lead and program managers, develop clear JDP scope, objectives, KPIs/success metrics, and milestones.\nEngage and lead collaborations with peers/partners/startups to define, execute, and implement co-optimized integration strategies and solutions.\nDrive JDPs with materials suppliers and metrology companies to realize and enable new avenues for co-development and characterization.\nStay up to date on advanced packaging research, pathfinding, and innovations and assist product marketing leaders in market assessments, competitive intelligence reports, strategic initiatives, and portfolio gap analysis.\nSupport customer engagement meetings and escalations related to integrated problems.\nRepresent Lam at industry conferences and symposiums to expand network, influence, and branding.\nSupport mentoring and recruitment for the ecosystem team.\nWho we’re looking for\nMaster's or PhD in Engineering (electrical/mechanical/chemical), Materials Science, Applied Physics, Chemistry, or a related discipline.\n10+ years of experience in semiconductor process development, packaging integration (TSV, WLP, HB, panel level packaging etc.), model-based problem solving, program management, or related business functions within a complex enterprise environment.\nStrong fundamental understanding of advanced packaging technologies and integration, industry direction, and research initiatives.\nProficiency in statistical data analysis, process controls, optimization, and utilizing AI tools for efficiency.\nExcellent communication and problem-solving skills with the ability to collaborate extensively within and outside Lam Research.\nDemonstrated experience partnering with senior executives and business stakeholders to define strategy, prioritize investments, and deliver business outcomes.\nExperience managing cross-functional programs and influencing stakeholders in a global, matrixed organization.\nPreferred qualifications\nExperience with initiation, definition, and execution of joint development projects with research institutes, industry consortia, and academic institutions.\nSemiconductor, capital equipment, industrial technology, or advanced manufacturing industry experience.\nStrong network across the industry ecosystem and research communities.\nHighly effective in ambiguous situations, capable of making high-impact decisions with incomplete data to ensure programs stay on track and on schedule.\nFamiliarity with working in a laboratory and on semiconductor equipment with experience in surface preparation and analytical techniques.\nIn-depth understanding of Statistical Process Control (SPC) and/or Design of Experiments (DOE).\nWorking knowledge of statistical analysis and problem-solving methodologies.\nExperience with statistical tools (JMP, Minitab, etc.).\nBackground in Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Plasma-Enhanced Chemical Vapor Deposition (PECVD), or Physical Vapor Deposition (PVD).\nBackground in Plasma Physics, Reactive Ion Etching (RIE), Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP).\nKnowledge of material synthesis and material characterization.\nExperience working in a collaborative and matrixed environment with diverse teams, semiconductor customers, and/or partners.\nExperience in semiconductor, process design, deposition, etch dielectrics or conductor, metal films, etc.\nOur commitment\nWe believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results.\nLam Research (\"Lam\" or the \"Company\") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees.\nLam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories - On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time.\nOur Perks and Benefits\nAt Lam, our people make amazing things possible. That’s why we invest in you throughout the phases of your life with a comprehensive set of outstanding benefits.","description_format":"text","description_chars":7792,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Semiconductor Equipment"],"lifecycle":[{"event":"open","at":"2026-10-15T19:58:21Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 233 · green card filings: 85","filings_12m":233,"filings_prev_12m":267,"green_card_filings_12m":85,"median_offered_wage_usd":137500,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":79,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.875,"p_room":0.9,"age_days":32,"expected_fill_days":71,"reasons":["conf:0","velocity","win:mid","comp:brand"],"computed_at":"2026-10-22T06:10:10Z"},"pay":null,"html_url":"https://alion.io/job/lam-research-process-engineer-5-advanced-packaging-integration-technologist","json_url":"https://alion.io/job/lam-research-process-engineer-5-advanced-packaging-integration-technologist.json","meta":{"generated_at":"2026-10-22T07:42:24Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":3437,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-23T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":58649},"rest":"https://alion.io/mcp/rest/get_company?id=58649"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Flam-research-process-engineer-5-advanced-packaging-integration-technologist"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Flam-research-process-engineer-5-advanced-packaging-integration-technologist"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Flam-research-process-engineer-5-advanced-packaging-integration-technologist"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/lam-research-process-engineer-5-advanced-packaging-integration-technologist\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Flam-research-process-engineer-5-advanced-packaging-integration-technologist"}]}