{"id":426440,"url":"https://alion.io/job/lam-research-structural-thermal-modeling-engineer-3","title":"Structural/ Thermal Modeling Engineer 3","company":{"id":58649,"name":"Lam Research","domain":"lamresearch.com","url":"https://alion.io/company/lam-research","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"C","score":56,"open_postings":574,"ghost_share":0.443,"stale_share":0.066,"repost_share":0.699,"time_to_fill_p50_days":72,"computed_at":"2026-11-05T05:54:30Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"middle","employment_type":null,"work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Tualatin, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":100000,"max_usd":182000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":4330},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Abaqus","optional":false},{"name":"ANSYS","optional":false},{"name":"Nastran","optional":false},{"name":"HPC","optional":true}],"status":"live","first_seen_at":"2025-09-24T16:16:44Z","employer_posted_date":"2026-04-14","last_verified_at":"2026-11-06T01:27:47Z","board_verified":true,"closed_at":null,"days_open":407,"trust":{"level":"stale","repost_count":0,"flags":["stale"],"days_open":406},"description":"The group you’ll be a part of\nIn the Global Products Group, we are dedicated to excellence in the design and engineering of Lam's etch and deposition products. We drive innovation to ensure our cutting-edge solutions are helping to solve the biggest challenges in the semiconductor industry.\nThe impact you’ll make\nWe move atoms that move the world.\nAt Lam Research, we create equipment that allows chipmakers to build device features more than 1,000 times smaller than a grain of sand. This tiny scale has a huge impact. Virtually every leading-edge chip inside the electronic products you use every day (TVs, smartphones, laptops, cars-even medical devices) has been made using our equipment.\nAs one of the world’s most trusted suppliers in the semiconductor equipment industry, we’re transforming technology. Our equipment places atoms so precisely that nearly every chip today is made using our innovations.\nTo build a prosperous career, start with an atom.\nShould you choose to walk the path historically driven by Moore’s law, your primary job function will involve cutting edge R&D activities in the Semiconductor Equipment Industry. If solving challenges no one has faced before or attempted are of interest to you, then Lam Research is the company for you.\nWhat you’ll do\nDeveloping physics-based models for Thermo-Elastic, Structural and CFD applications for components in semiconductor capital equipment industry. Experience in commercial software like ABAQUS, ANSYS, NASTRAN, COMSOL, etc., is highly desirable.\nData driven modeling - Juncture of physics-based modeling with data-driven, AI/ML methods: Developing methods for translating tool operational data into improved engineering designs\nUtilizing DOE, Optimization, and statistical methods to correlate Simulation data to experimental data.\nStochastic optimization tools to bridge between simulation and experiments.\nPredict, measure and analyze the experimental data of mechanical designs, process specification and software programs for semiconductor manufacturing equipment. \nUncertainty Quantification & propagation, sensitivity analysis, statistical inference for model calibration, decision making under uncertainty.\n\nDeveloping and maintaining live multi-physics models\nMulti-scale modeling from nano, meso to macro levels\nProvide design improvements of in-service tools based upon quantitative field measured failure data and less quantitative quality metrics as measured by Lam Research. \nUse advanced statistical, probabilistic and forecasting methods to best quantify design and performance of overall system. \nProvide written reports and oral presentation of results to design teams and management.\nWork directly with mechanical, electrical, process and software engineers to define design requirements, goals and objectives of design, CIP, testing and simulation plans. \nWho we’re looking for\nMinimum Qualifications:\nPhD in Mechanical Engineering or closely related field with strong emphasis in solid mechanics, heat transfer and fluid mechanics or related fields.\nStrong ability and understanding of AI/ML concepts and hybrid physics-based AI/ML modeling software.\nCoding ability to supplement commercial software for specific applications as needs arise.\nAbility to work within a team to own and design concepts and drive design decisions.\nAbility to lead and conduct design reviews in cross functional and matrixed environments.\nStrong written and oral communication. Self-starter to start own initiatives and projects for continuous improvement in capabilities and design.\nThis is a graduate eligible role. \nPreferred qualifications\nPreferred knowledge of chemistry, semiconductor metrology methods, and employing sensors and hardware designs in a vacuum environment is also a plus.\nExpertise or working knowledge in several of these areas are desired:Big data, AI/ML algorithms and concepts.\nMulti-physics modeling,\nMulti-scale modeling, Feature scale from nano, meso scale to macro scale.\nHeat transfer in low pressure regimes\nHPC, optimization and cloud computing\nNumerical methods - Smoothed Particle Hydrodynamics (SPH), MD, BTE, Spectral Element, molecular dynamics, DSMC.\nThin film mechanics and characterization\nCeramic materials\nFracture mechanics and Fatigue\nUncertainty qualification, error analysis, statistical methods.\nStatistical theory, DOE, optimization algorithms.\n\nOur commitment\nWe believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results.\nLam Research (\"Lam\" or the \"Company\") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees.\nLam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories - On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time.\nOur Perks and Benefits\nAt Lam, our people make amazing things possible. That’s why we invest in you throughout the phases of your life with a comprehensive set of outstanding benefits.","description_format":"text","description_chars":6120,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"phd","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Cybersecurity","Manufacturing","Semiconductor Manufacturing"],"lifecycle":[{"event":"open","at":"2026-09-06T04:55:38Z"},{"event":"close","at":"2026-09-07T01:03:26Z"},{"event":"reopen","at":"2026-09-07T14:08:58Z"},{"event":"close","at":"2026-09-08T11:09:16Z"},{"event":"reopen","at":"2026-09-08T14:09:17Z"},{"event":"close","at":"2026-09-09T08:09:31Z"},{"event":"reopen","at":"2026-09-09T14:09:46Z"},{"event":"close","at":"2026-09-09T17:09:57Z"},{"event":"reopen","at":"2026-09-09T23:10:13Z"},{"event":"close","at":"2026-09-10T02:10:13Z"},{"event":"reopen","at":"2026-09-10T08:10:17Z"},{"event":"close","at":"2026-09-10T14:10:24Z"},{"event":"reopen","at":"2026-09-11T08:14:10Z"},{"event":"close","at":"2026-09-11T20:31:49Z"},{"event":"reopen","at":"2026-09-12T00:12:28Z"},{"event":"close","at":"2026-09-12T03:20:38Z"},{"event":"reopen","at":"2026-09-12T19:05:56Z"},{"event":"close","at":"2026-09-13T01:06:09Z"},{"event":"reopen","at":"2026-09-13T22:06:15Z"},{"event":"close","at":"2026-09-14T01:06:21Z"},{"event":"reopen","at":"2026-09-14T04:06:32Z"},{"event":"close","at":"2026-09-14T07:06:46Z"},{"event":"reopen","at":"2026-09-14T20:28:58Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 233 · green card filings: 85","filings_12m":233,"filings_prev_12m":267,"green_card_filings_12m":85,"median_offered_wage_usd":137500,"route":null,"cap_exempt":false,"checked_at":"2026-10-29T16:27:21+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":6,"band":"cold","label":"Long shot","p_open":1,"p_active":0.199,"p_room":0.28,"age_days":406,"expected_fill_days":72,"reasons":["conf:0","stale_co","velocity","win:tail","crowd:brand"],"computed_at":"2026-11-05T05:54:30Z"},"pay":null,"html_url":"https://alion.io/job/lam-research-structural-thermal-modeling-engineer-3","json_url":"https://alion.io/job/lam-research-structural-thermal-modeling-engineer-3.json","meta":{"generated_at":"2026-11-06T01:32:04Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":2534,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-07T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":58649},"rest":"https://alion.io/mcp/rest/get_company?id=58649"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Flam-research-structural-thermal-modeling-engineer-3"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Flam-research-structural-thermal-modeling-engineer-3"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Flam-research-structural-thermal-modeling-engineer-3"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/lam-research-structural-thermal-modeling-engineer-3\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Flam-research-structural-thermal-modeling-engineer-3"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":426440}},{"tool":"search_jobs","arguments":{"company":"lamresearch.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":426440},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. Docs: https://alion.io/developers"}}