Lead Electrical Systems Engineer
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Leidos Defense is seeking a highly skilled, visionary Principal Electrical Engineer to join our multi-disciplinary engineering organization. In this role, you will drive the architectural design, hardware-software integration, and deployment of next-generation tactical systems, advanced avionics, and flight instrumentation for critical Department of Defense (DoD) initiatives. As a Principal contributor, you will act as a primary subject matter expert, translating complex customer concepts into flight-ready hardware solutions. You will provide strategic technical direction across multi-functional Integrated Product Teams (IPTs), manage high-level engineering complexities, design robust embedded architectures, and guide engineering teams through entire hardware lifecycles.
If this sounds like the kind of environment where you can thrive, keep reading!
Leidos Defense Systems Sector provides a diverse portfolio of systems, solutions, and services covering land, sea, air, space, and cyberspace for customers worldwide. Solutions for Defense include enterprise and mission IT, large-scale intelligence systems, command and control, geospatial and data analytics, cybersecurity, logistics, training, and intelligence analysis and operations support. Our team is solving the world’s toughest security challenges for customers with “can’t fail” missions. To explore and learn more, click here!
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Primary Responsibilities.
- Architect, lead, and deliver state-of-the-art avionics, electrical weapon interfaces, and custom/COTS Line Replaceable Units (LRUs) for missile systems, Unmanned Aerial Vehicles (UAVs), and fieldable launch platforms.
- Support complex system co-designs utilizing high-performance Xilinx/AMD Zynq SoCs, Altera FPGAs, soft-core processors (MicroBlaze), and complex network architectures (bare-metal, RTOS-based, UDP/IP stacks, and Weapon Open System Architecture/WOSA messaging frameworks).
- Oversee complex Multi-Layer Power Distribution Network (PDN) definitions, multi-rail low-noise regulation circuits, rigid-flex PCBA layouts, and high-speed digital interfaces (PCIe, multi-Gbps transceivers, ADCs/DACs, and RF modems).
- Direct multi-disciplinary Integrated Product Teams (IPTs) for electronics, cabling, grounding, and bonding. Act as the primary internal technical authority, hosting weekly technical interchange meetings with external subcontractors to maintain design consistency.
- Partner with systems engineering teams to translate military standards into rigorous hardware requirements. support Control Account Managers (CAMs) by providing precise technical write-ups, work breakdowns, and schedule estimates for Earned Value Management (EVM), CapEx initiatives, and major competitive proposals.
- Act as a certified test conductor or lead verification engineer to establish comprehensive system-level test plans, environmental stress screening, HWIL integration, and launch-readiness countdown actions.
Basic Qualifications.
- Active Top-Secret Clearance
- Master’s degree in, electrical engineering, or related STEM discipline with 10+ years of hardware architecture experience; OR a bachelor’s degree in electrical engineering, or similar with 12+ years of relevant engineering experience.
- Proven background as a hardware architect or technical lead creating flight-worthy electronics, avionics assemblies, and custom PCBAs.
- Extensive experience with SoC/FPGA systems, RTOS environments, and high-frequency digital/analog hardware interfaces.
- Comprehensive working knowledge and implementation history with defense standards, including MIL-STD-461 (EMI/EMC), MIL-STD-704 (Aircraft Power), MIL-STD-1472 (Human Factors), IPC-D-620 Class 3 (Cabling/Harnessing),and IPC-D-630.
- Demonstrated experience leading multi-disciplinary engineering teams, acting as an IPT Lead, product owner, or scrum master within an agile framework.
- U.S. Citizenship is strictly required. Candidate must possess an active Top[Secret security clearance
- Ability to travel 10-20%
Preferred Qualifications.
- Prior experience designing electronics specialized for extreme environments (e.g., high-shock rocket deployments >10kG, thermal battery integrations, and un-potted chassis designs).
- Familiarity with Model-Based Systems Engineering (MBSE) methodologies, SysML concepts, or requirements tools such as Cameo/MagicDraw and IBM DOORS.
- Hands-on experience implementing open system architectures such as Weapon Open System Architecture (WOSA) or Modular Open Systems Approach (MOSA) messaging standards.
- Experience with advanced RF simulation tools, anechoic chamber testing, and Maximum Power Point Tracking (MPPT) for space-constrained power subsystems (such as CubeSats).
AppKinetic
If you're looking for comfort, keep scrolling. At Leidos, we outthink, outbuild, and outpace the status quo - because the mission demands it. We're not hiring followers. We're recruiting the ones who disrupt, provoke, and refuse to fail. Step 10 is ancient history. We're already at step 30 - and moving faster than anyone else dares.
Original Posting:
July 22, 2026For U.S. Positions: While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.
Pay Range:
Pay Range $131,300.00 - $237,350.00The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.