{"id":2685644,"url":"https://alion.io/job/lenovo-interconnect-engineer-ai-infrastructure-interconnect-solutions","title":"Interconnect Engineer (AI Infrastructure / Interconnect Solutions)","company":{"id":15044,"name":"Lenovo","domain":"lenovo.com","url":"https://alion.io/company/lenovo","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Avature","truth_index":{"grade":"A","score":100,"open_postings":5,"ghost_share":0,"stale_share":0,"repost_share":0,"time_to_fill_p50_days":9,"computed_at":"2026-10-21T05:46:15Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Taipei, Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":19500,"max_usd":45000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":7932},"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"HPC","optional":false},{"name":"NVLink","optional":false}],"status":"live","first_seen_at":"2026-10-16T07:32:18Z","employer_posted_date":"2026-10-16","last_verified_at":"2026-10-21T06:42:29Z","board_verified":true,"closed_at":null,"days_open":5,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":5},"description":"Key Responsibilities\nInterconnect Solution Development\nDevelop and support interconnect solutions for AI servers, GPU, rack-level, and cluster-level platforms.\nDefine cable and connector requirements based on system architecture, SI requirements, power delivery, thermal, and mechanical (and manufacturability) constraints.\nSupport advanced interconnect applications, including:High-speed copper and optical interconnects\nPatch panels\nOptical cable assemblies\nCable cartridge solutions\nInter-rack DC link high-power connectivity\n\nCollaborate with SL, EE, SI, ME, Thermal, and System teams (and Manufacturing) to ensure robust (and scalable) interconnect architecture integration.\nHigh-Speed Interconnect Technology\nSupport high-speed interconnection technologies, including (400G / 800G) interconnect solutions and future high-bandwidth AI infrastructure connectivity solutions.\nEvaluate and drive implementation readiness for emerging technologies such as PCIe Gen6/Gen7, UALink,NVLink, high-speed optical interconnects, and next-generation GPU cluster connectivity solutions.\nDrive technology readiness assessment and solution feasibility studies according to industry technology trends.\nDevelop strategic supplier technology roadmaps aligned with future AI infrastructure interconnect technologies and deployment requirements.\nNPI & Engineering Support\nLead and drive interconnect implementation activities throughout all NPI phases from concept development through EVT/DVT/PVT and sustaining.\nOwn cable and connector component’s part list management, and interconnect technical documentation.\nConduct NUDD analysis, engineering trade-off studies, risk analysis, and design reviews for Interconnect solutions.\nLead sample verification, prototype bring-up, debugging, issue resolution and second source introduction during development phases.\nSupplier Development & Component Qualification\nLead and develop strategic suppliers include technical engagement, capability assessment, and manufacturing readiness reviews.\nDefine and execute qualification plans and reliability requirements for cable and connector components.\nAssess technical impact of PCN/PCR changes and define mitigation actions.\nMaintain interconnect qualification records, databases, and lifecycle documentation.\nDrive cost optimization, AVL strategy, and supply continuity planning.\nRequired Qualifications\nBachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.\n5+ years of experience in server, networking, storage, HPC, AI infrastructure, or high-speed interconnect engineering\nStrong knowledge of:High-speed cable and connector architectures\nSignal and power interconnect systems\nQualification and reliability validation methods\nRack-level and cluster-level interconnect solutions\n\nExperience working with ODM/OEM, EMS, and component suppliers.\nStrong cross-functional communication, technical problem-solving, and project execution skills.\nPreferred Qualifications\nExperience supporting AI server, GPU server, HPC, networking, or data center platforms.\nFamiliarity with high-speed interconnect technologies (400G/800G, optical interconnect, UALink, NVLink, PCIe Gen6/Gen7, and next-generation AI fabric connectivity).\nExperience in NPI lifecycle management and supplier qualification processes.\nUnderstanding of signal integrity, power delivery, and thermal considerations in AI infrastructure systems.\nExperience supporting and bring-up supplier’s manufacturing and development sites is a plus.","description_format":"text","description_chars":3520,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Servers & Data Center Hardware","Smartphones","Laptops"],"lifecycle":[{"event":"open","at":"2026-10-16T07:32:18Z"}],"visa":[],"liveness":{"score":79,"band":"hot","label":"Hiring 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