PCBA Technology Qualification and Reliability Engineer

Job Description:

1. Technology Roadmap roll out for PCBA. PCBA assembly process study and development for new assembly technology and connector / IC packages.

2. Early new PCBA technology study. Exploring new chemical materials.

3. Reliability test planning for new PCBA projects.

4. Lead PCBA process qualification and reliability validation for NPI projects, and work closely with cross function teams and customers to make sure of successful project launch.

5. Customer process and reliability requirements interpretation and deployment.

6. Conduct failure analysis for PCBA process and reliability test issues. Use lab equipment for quality inspection and test, conduct cross section and dye and pry test, etc.

7. DFX analysis in each NPI phase; DFX rules consolidation.

8. New PCBA manufacturing site assembly technology assessment, qualification, enablement.

9. Work with cross function teams for continuous improvement of process, quality and efficiency, etc.

Requirements:

1. >10years of experience on end-to-end PCBA assembly process control and development: SMT,

wave, press-fit, backend assembly and rework processes, etc.

2. >5year of experience on Server (or other high complexity and reliability products) manufacturing engineering preferred.

3. Strong know-how on failure analysis techniques and reliability methodologies (thermal cycling, Shock & Vibration, …)

4. Familiar with tooling designs include but not limit to stencil, reflow & wave carrier, routing, press fit and assembly fixture, etc.

5. DFX know-how and hands on experiences for new product introduction.

6. Good command of English in writing, speaking, reading and listening, good teamwork and communication.

7. Good skills in project management and supplier audit;

8. Located in Taipei, frequent travels are expected.

9. Be able to work independently under high pressure and tight schedule.