Semiconductor Process Development Engineer

岗位职责 / Responsibilities

1. Conduct literature research and Design of Experiments (DoE) to support the development of SiC semiconductor die attach processes (e.g., sintering, soldering, embedding);

2. Perform process development for power module-to-heatsink interconnection and evaluate new material& processes, including literature review, DoE design, and technical discussions with suppliers and partners.

Operate advanced packaging manufacturing equipment, including:

- Die bonding / pick & place systems

- Printing systems (e.g. paste, solder, sinter materials)

- Sintering equipment

- CNC machining and laser processing tools

3. Perform failure analysis and quality inspection using tools such as:

- CSAM (C-Scan Acoustic Microscopy)

- Optical microscopy and other characterization tools

- Generate structured technical reports and documentation

4. Support cleanroom setup, including equipment installation, qualification, and commissioning;

5. Investigate and develop new materials, processes, and technologies, and contribute to process roadmaps for next-generation power modules and other semiconductor application fileds;

6. Coordinate with external partners and suppliers, organize technical meetings, and prepare meeting minutes and progress reports.

任职要求 / Requirements

1. Master’s degree or higher in Materials Science, Chemical Engineering, Semiconductor Engineering, MEMS/Microelectronics, Power Electronics, or related fields;

2. 3-5 years of relevant industry or research experience in semiconductor processing or advanced packaging, strong semiconductor knowledge and background;

3. Strong self-motivation and a results-driven mindset; with strong curiosity and a passion for learning; demonstrates a proactive, ownership mindset with disciplined use of R&D resources and a strong ambition to deliver high-impact results and contribute to shaping the future of the industry;

4. Hands-on experience with manufacturing/prototyping equipment in semiconductor industry or semiconductor packaging is highly preferred, cleanroom working experience is a plus;

5. Experience in mechanical design, including: Engineering drawings Tolerance analysis Fixture/jig design Module/package design is a plus;

6. Fluent English is required as the working language;

7. Experience using AI agents/tools to increase working efficiency is a plus.