{"id":859840,"url":"https://alion.io/job/lockheed-martin-assembler-wire-bonder-2nd-shift","title":"Assembler - Wire Bonder - 2nd Shift","company":{"id":37086,"name":"Lockheed Martin","domain":"lockheedmartin.com","url":"https://alion.io/company/lockheedmartin","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"A","score":96,"open_postings":2425,"ghost_share":0.009,"stale_share":0,"repost_share":0.199,"time_to_fill_p50_days":33,"computed_at":"2026-11-01T06:10:25Z"}},"role":"Semiconductors","role_family":"Semiconductors","seniority":null,"employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Chelmsford, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":47100,"max":87500,"currency":"USD","period":"year","gross":null,"usd_annual":87500},"salary_estimate":null,"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"AS9100","optional":true}],"status":"live","first_seen_at":"2026-08-27T15:19:17Z","employer_posted_date":"2026-08-31","last_verified_at":"2026-11-01T04:38:10Z","board_verified":true,"closed_at":null,"days_open":65,"trust":{"level":"ok","repost_count":1,"flags":[],"days_open":65},"description":"Standard Job Description\nPerforms fabrication or modification tasks on hybrid microcircuits and sub-assemblies. Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques. Requires the capability to troubleshoot defective hybrids by visual or mechanical screening, wirebonds or chip placement. Electrically troubleshoots hybrid circuitry using an ohmmeter. Performs final assembly operations including attachment of feedthrough pins, soldering of coils, and mounting of substrates in special non-standard packages. Performs thick film screen, dry, and fire operations of various types.\nYou will be the Microelectronic Bonder for Lockheed Martin Missiles & Fire Control in Chelmsford, MA. Our team is responsible for fabricating and modifying hybrid microcircuits and sub-assemblies that support critical defense systems.\nWhat You Will Be Doing\nAs the Microelectronic Bonder, you will be responsible for executing high-precision wire-bonding and hybrid circuit fabrication tasks.\nYour responsibilities will include, but are not limited to:\nPerforms fabrication or modification tasks on hybrid microcircuits and sub-assemblies.\nPerforms fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques.\nRequires the capability to troubleshoot defective hybrids by visual or mechanical screening, wirebonds, or chip placement.\nWhy Join Us\nWe offer a purpose-driven environment where your expertise directly contributes to mission-critical technology. You’ll work alongside skilled professionals and have access to a comprehensive benefits package.\nFurther Information About This Opportunity\nThis position is in Chelmsford. Discover more about our Chelmsford, Massachusetts location.\nMUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a Secret clearance. A company-sponsored interim Secret clearance is required to start.\nBasic Qualifications\nAbility to work 10 hours under a microscope and utilize hand tools such as torque drivers, tweezers and other similar tools\nGood dexterity and eye/hand coordination\nExperience in wirebonding and/or ribbon bonding (0.001” and 0.0007” wire and various sizes of ribbon)\nExperience in microelectronics assembly (chip and wire assembly)\nAbility to read and work from detailed work instructions and drawings; computer skills are required to support retrieval of drawings and work instructions as well as other job activities\nAbility to work in a team environment; good interpersonal, team and communication skills\nAbility to obtain and maintain a Secret Security Clearance, which requires U.S. citizenship\nDesired Skills\nExperience in hybrid assembly in accordance with Mil STD 883\nExperience wirebonding or ribbon bonding to ceramic or duroid substrates\nExperience using Westbond and Metcal bonding machines and Unitech welder\nExperience in substrate and component attach, auto pick-and-place\nExperience operating auto or manual bonding equipment\nFamiliarity working in an ESD and FOD controlled environment\nExperience in mechanical assembly processes of small electronic devices\nExperience working on military products in ISO 9001 / AS9100 controlled environments\nPay Information\nFull-Time Salary Range: $47100.00 - $87500.00\nAt Lockheed Martin, we know mission success starts with taking care of our people. Our Total Rewards program is designed to attract top talent, support your well-being, and help you grow-both professionally and personally.\nThe salary range for this position is as listed on the requisition. Please note that the salary information listed is a general guideline only. Lockheed Martin considers factors such as (but not limited to) scope and responsibilities of the position, candidate's work experience, education/ training, key skills as well as market(work location) and business considerations when extending an offer.\nBenefits offered: Medical, Dental, Vision, Flexible work arrangements and schedules (e.g., 4x10), 401(k) match, Paid time off, Holidays, Parental Leave, EAP, Flexible Spending Accounts, Education Assistance, Life Insurance, Short-Term Disability, and Long-Term Disability.\nAnnual short-term and/or long-term incentive compensation programs may be offered depending on the position. Payments under these annual programs are not guaranteed and can vary from year to year and are tied to a range of performance metrics.\nFor (Washington state applicants only) Non-represented full-time employees: accrue at least 10 hours per month of Paid Time Off (PTO) to be used for incidental absences and other reasons; receive at least 90 hours for holidays. Represented full time employees accrue 6.67 hours of Vacation per month; accrue up to 52 hours of sick leave annually; receive at least 96 hours for holidays. PTO, Vacation, sick leave, and holiday hours are prorated based on start date during the calendar year.","description_format":"text","description_chars":5289,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":null,"security_clearance":true,"languages":[]},"benefits":["Education assistance","Flexible schedule","Life insurance","Parental leave"],"hiring_locations":[{"name":"United States","iso":"US","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Aerospace Manufacturing","Combat Aircraft","Missiles","Military Satellites"],"lifecycle":[{"event":"open","at":"2026-09-13T09:14:37Z"},{"event":"close","at":"2026-10-19T17:54:11Z"},{"event":"reopen","at":"2026-10-24T19:04:34Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 1","filings_12m":1,"filings_prev_12m":1,"green_card_filings_12m":0,"median_offered_wage_usd":182500,"route":null,"cap_exempt":false,"checked_at":"2026-10-29T16:27:21+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)"],"filings_for_role_12m":0}],"liveness":{"score":17,"band":"cold","label":"Long shot","p_open":1,"p_active":0.464,"p_room":0.36,"age_days":65,"expected_fill_days":33,"reasons":["conf:1","velocity","win:tail","crowd:brand"],"computed_at":"2026-11-01T06:10:25Z"},"pay":{"stated_usd_annual":87500,"is_top_pay":false},"html_url":"https://alion.io/job/lockheed-martin-assembler-wire-bonder-2nd-shift","json_url":"https://alion.io/job/lockheed-martin-assembler-wire-bonder-2nd-shift.json","meta":{"generated_at":"2026-11-01T08:20:03Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":13028,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-02T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":37086},"rest":"https://alion.io/mcp/rest/get_company?id=37086"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Flockheed-martin-assembler-wire-bonder-2nd-shift"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Flockheed-martin-assembler-wire-bonder-2nd-shift"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Flockheed-martin-assembler-wire-bonder-2nd-shift"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/lockheed-martin-assembler-wire-bonder-2nd-shift\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Flockheed-martin-assembler-wire-bonder-2nd-shift"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":859840}},{"tool":"search_jobs","arguments":{"company":"lockheedmartin.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":859840},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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