{"id":621846,"url":"https://alion.io/job/lumilens-die-attach-manufacturing-engineer-process-equiment","title":"Die Attach Manufacturing Engineer- Process & Equiment","company":{"id":678172,"name":"Lumilens","domain":"lumilens.com","url":"https://alion.io/company/lumilens","size_band":"201-500","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Ashby","truth_index":{"grade":"A","score":89,"open_postings":149,"ghost_share":0.094,"stale_share":0,"repost_share":0,"time_to_fill_p50_days":118,"computed_at":"2026-10-28T05:59:10Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"middle","employment_type":"full_time","work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Singapore"],"countries":["SG"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":31000,"max_usd":57000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":288},"experience_years_min":3,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"CAPA","optional":false},{"name":"JMP","optional":false},{"name":"Mandiant capa","optional":false},{"name":"Minitab","optional":false},{"name":"Statistical Process Control","optional":false}],"status":"live","first_seen_at":"2026-07-28T10:35:35Z","employer_posted_date":"2026-07-28","last_verified_at":"2026-10-28T15:59:50Z","board_verified":true,"closed_at":null,"days_open":92,"trust":{"level":"ok","repost_count":0,"flags":["company_stale"],"days_open":91},"description":"About Lumilens\nAt Lumilens, we are building the critical photonics infrastructure powering tomorrow’s AI supercomputing. Our mission is to unlock a new era of computing that is faster, cooler, and massively more efficient. Join our world-class team as we redefine possibilities in photonic technology.\nJob Description\nWe are seeking a Die Attach Manufacturing Engineer - Process & Equipment (Silicon Photonics / PIC Packaging) to join our Manufacturing Engineering team within Photonic Packaging & Assembly. In this mid-to-senior level role, you will lead the development, qualification, optimization, and sustaining of die attach processes and equipment for Photonic Integrated Circuits (PICs), silicon photonics dies, and co-packaged optical/electronic modules. This position is responsible for achieving sub-micron placement accuracy and optical-grade attach quality through active/passive alignment die bonding, epoxy/adhesive dispense, eutectic/AuSn solder attach, and flip-chip bonding. You will ensure high optical coupling yield, mechanical/thermal reliability, and operational throughput, while supporting New Product Introduction (NPI) for emerging photonic packages and modules.\nKey Responsibilities\nProcess Engineering\nDevelop, characterize, qualify, and optimize die attach processes for PIC/silicon photonics dies, laser dies, and EIC-PIC hybrid assemblies, including active/passive alignment epoxy attach, AuSn/eutectic solder attach, and flip-chip bonding.\n\nEstablish and maintain process specifications, work instructions, control plans, and process windows (DOE-based) for sub-micron and low-single-digit-micron placement accuracy.\n\nLead root cause analysis and implement corrective/preventive actions (CAPA) for die attach-related yield loss and photonics-specific defects (e.g., optical misalignment, coupling loss, epoxy outgassing, die tilt, voids, bond-line thickness control).\n\nSupport NPI by developing die attach process flows for new photonic packages, transceiver modules, and hybrid/co-packaged integration platforms.\n\nMonitor SPC/process capability (Cpk) data on placement accuracy, bond-line thickness, and optical coupling efficiency. Drive process improvements to reduce variation and coupling loss.\n\nEvaluate and qualify optically-compatible die attach materials (low-outgassing/UV-cure epoxies, index-matched adhesives, AuSn solder) with Materials and Optical Design Engineering.\n\nPartner with Quality, Reliability, and Product/Optical Engineering on failure analysis and reliability testing (thermal cycling, humidity, optical power/coupling loss, hermeticity, shear/pull testing, X-ray/CSAM/SAT inspection).\n\nSupport development of active alignment processes with real-time optical feedback during die bonding.\n\nEquipment Engineering\nOwn equipment performance, uptime, and OEE for photonics die attach tools (high-precision active/passive alignment die bonders, sub-micron pick-and-place, epoxy dispense, AuSn/eutectic die bonders, UV-cure stations, fiber/waveguide alignment).\n\nLead equipment installation, qualification (IQ/OQ/PQ), and ramp-up for new/upgraded photonic die bonding and alignment tools, including vision systems and sub-micron motion stages.\n\nMaintain and execute preventive maintenance plans, troubleshoot high-precision optical/mechanical equipment (stage drift, calibration, repeatability), and minimize downtime.\n\nWork with specialized vendors (Besi, Palomar Technologies, Finetech, Set North America, PI/Physik Instrumente, or similar) for tool upgrades, retrofits, spare parts, and technical escalations.\n\nDrive automation, tooling, and fixture improvements for throughput and repeatability while maintaining alignment tolerances and protecting optical facets/lenses.\n\nSupport equipment capacity planning and capital equipment (CAPEX) proposals.\n\nCross-Functional Collaboration\nCollaborate with Design, Product, Quality, and Operations teams to align die attach process capability with product requirements.\n\nProvide technical training and guidance to manufacturing technicians and operators.\n\nSupport process/equipment documentation for internal and customer audits.\n\nTrack and report KPIs: yield, Cpk, equipment uptime, scrap rate, and cycle time.\n\nEngage in cost reduction, lean manufacturing, and Six Sigma/continuous improvement initiatives.\n\nRequirements\nRequired\nBachelor’s degree in Electrical, Mechanical, Materials, Optical/Photonics Engineering, or related field (Master's preferred for senior roles)\n\n3-7 years of hands-on experience in silicon photonics/PIC industry, focusing on die attach process/equipment engineering for optical or opto-electronic packaging\n\nDirect experience with silicon photonics dies and/or III-V laser dies including wafer/die handling, dicing, facet protection, and optically sensitive die placement\n\nWorking knowledge of die attach materials/methods for photonics (low-outgassing/optical-grade epoxies, UV-cure adhesives, AuSn/eutectic solder attach, flip-chip bonding) and failure modes (coupling loss, epoxy haze, bond-line drift, facet damage)\n\nExperience with high-precision die/fiber attach equipment (Besi, Palomar Technologies, Finetech, Set North America, PI/Physik Instrumente, or equivalent)\n\nFamiliarity with DOE, SPC, Cpk analysis, and structured problem-solving (8D, 5-Why, Fishbone) for optical coupling yield and alignment accuracy\n\nUnderstanding of photonic packaging architectures (transceiver modules, co-packaged optics/CPO, hybrid/heterogeneous integration) and their die attach/alignment needs\n\nStrong analytical, troubleshooting, and data-driven decision-making skills at sub-micron/micron-level tolerances\n\nAbility to read/interpret optical/mechanical engineering drawings, specs, and manuals\n\nPreferred\nExperience in high-volume silicon photonics, optical transceiver, or PIC foundry/packaging house\n\nExposure to active alignment and optical feedback-based die bonding (real-time power monitoring)\n\nExperience with hermetic packaging, TECs, and laser die attach for telecom/datacom optics\n\nSix Sigma Green/Black Belt certification\n\nExperience with statistical software (Minitab, JMP) and MES/data systems\n\nFamiliarity with automation/robotics for sub-micron precision assembly\n\nCleanroom manufacturing experience\n\nSkills & Competencies\nStrong problem-solving and root cause analysis mindset\n\nHands-on, equipment-floor-ready with willingness to work on production lines\n\nEffective cross-functional communication and documentation skills\n\nProject management to drive NPI timelines and equipment installs\n\nComfortable in a fast-paced, metrics-driven manufacturing environment\n\nAbility to work flexible shifts or support production as needed\n\nPhysical/Work Environment\nCleanroom/manufacturing floor environment; gowning may be required\n\nAbility to stand for extended periods and work near production equipment\n\nOccasional travel to supplier/equipment vendor sites for tool evaluation/training\n\nWhat We Offer\nCompetitive salary and benefits package\n\nWork on cutting-edge photonics packaging technology\n\nCollaborative, cross-functional engineering environment\n\nCareer growth within process/manufacturing engineering\n\nLumilens is an equal opportunity employer committed to diversity and inclusion.","description_format":"text","description_chars":7216,"description_truncated":false,"requirements":{"experience_years_min":3,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[{"name":"Singapore","iso":"SG","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Servers & Data Center Hardware","Optical Communications","Optics & Photonic Components"],"lifecycle":[{"event":"open","at":"2026-09-10T18:47:58Z"}],"visa":[],"liveness":{"score":51,"band":"ok","label":"Likely open","p_open":1,"p_active":0.849,"p_room":0.6,"age_days":91,"expected_fill_days":118,"reasons":["conf:3","velocity","win:late","crowd:brand"],"computed_at":"2026-10-28T05:59:10Z"},"pay":null,"html_url":"https://alion.io/job/lumilens-die-attach-manufacturing-engineer-process-equiment","json_url":"https://alion.io/job/lumilens-die-attach-manufacturing-engineer-process-equiment.json","meta":{"generated_at":"2026-10-28T18:57:20Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":25884,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-29T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":678172},"rest":"https://alion.io/mcp/rest/get_company?id=678172"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Flumilens-die-attach-manufacturing-engineer-process-equiment"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Flumilens-die-attach-manufacturing-engineer-process-equiment"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Flumilens-die-attach-manufacturing-engineer-process-equiment"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/lumilens-die-attach-manufacturing-engineer-process-equiment\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Flumilens-die-attach-manufacturing-engineer-process-equiment"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":621846}},{"tool":"search_jobs","arguments":{"company":"lumilens.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":621846},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. Docs: https://alion.io/developers"}}