{"id":621746,"url":"https://alion.io/job/lumilens-process-engineer-die-attach-wire-bond-active-alignment-overall-line","title":"Process Engineer (Die Attach / Wire Bond / Active Alignment / Overall Line)","company":{"id":678172,"name":"Lumilens","domain":"lumilens.com","url":"https://alion.io/company/lumilens","size_band":"201-500","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Ashby","truth_index":{"grade":"A","score":89,"open_postings":150,"ghost_share":0.1,"stale_share":0,"repost_share":0,"time_to_fill_p50_days":118,"computed_at":"2026-11-05T05:54:30Z"}},"role":"Semiconductors","role_family":"Semiconductors","seniority":"junior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Singapore"],"countries":["SG"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":2,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"FMEA","optional":false},{"name":"GD&T","optional":false},{"name":"JMP","optional":false},{"name":"Minitab","optional":false},{"name":"Statistical Process Control","optional":false}],"status":"live","first_seen_at":"2026-08-17T10:21:05Z","employer_posted_date":"2026-08-17","last_verified_at":"2026-11-06T05:55:01Z","board_verified":true,"closed_at":null,"days_open":80,"trust":{"level":"ok","repost_count":0,"flags":["company_stale"],"days_open":79},"description":"About Lumilens\nAt Lumilens, we are building the essential photonics infrastructure that will drive tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is ushering in a new era of computing that is faster, cooler, and dramatically more efficient. We’re a well-funded startup backed by Mayfield and led by veterans who have built and scaled some of the industry’s most transformative technologies.\nAbout the Role\nWe are seeking hands-on Process Engineers to support our volume manufacturing ramp-up at our Bulim facility. In this role, you will be responsible for process development, qualification, yield optimization, and continuous improvement across microelectronics packaging, optical module assembly, and high-precision automation lines.\nWe are hiring across multiple domain specializations:\nDie Attach (DB / Die Bond)\n\nWire Bond (WB)\n\nActive Alignment (AA / Optical Alignment)\n\nProcess Engineering - Overall / Integration\n\nKey Responsibilities\nProcess Setup & Optimization: Establish robust process windows, parameter recipes, and standard operating procedures (SOPs) for assigned production modules (DB, WB, AA, or End-to-End Line Integration).\n\nYield & Defect Reduction: Monitor line yield metrics, lead 8D root-cause failure analysis (FA), and implement corrective actions for recurring process/equipment defects.\n\nNPI to Mass Production: Partner with NPI and Equipment Engineering to qualify new tooling, materials (epoxies, substrates, bonding wire), and automation platforms for high-volume ramp.\n\nStatistical Process Control: Apply SPC, DOE, FMEA, and Cpk analysis to drive process stability, cycle time reduction, and cost-efficiency initiatives.\n\nCross-Functional Collaboration: Work closely with Manufacturing Operators, Quality Engineers, and Maintenance Technicians to resolve line stops and uphold quality standards.\n\nQualifications & Requirements\nEducation: Bachelor’s Degree or Diploma in Mechanical, Electrical/Electronic, Mechatronics, Materials Science, or Manufacturing Engineering.\n\nExperience: 2+ years of relevant process engineering experience in semiconductor packaging, microelectronics, surface-mount technology (SMT), or camera/optical module manufacturing.\n\nDomain Expertise (one or more of the following):\nDie Bond (DB): Experience with epoxy/eutectic dispense, high-precision pick-and-place, and flip-chip bonding.\n\nWire Bond (WB): Experience with ball/wedge wire bonders (gold/copper/aluminum wire) and bond pull/shear testing.\n\nActive Alignment (AA): Experience with multi-axis optical alignment, collimation, laser/lens positioning, and UV cure dispensing.\n\nOverall Process: Strong background in line balancing, end-to-end yield tracking, DOE, and cleanroom protocols.\n\nTechnical Skills: Proficiency in SPC tools (JMP, Minitab), GD&T, and structured problem-solving methodologies (8D, 5-Why, Fishbone).\n\nWork Arrangement: Willingness to work on-site at the Bulim plant and support operational needs during ramp-up phases.\n\nBenefits\nCompetitive salary and benefits\n\nOpportunities for career advancement\n\nWork with a world-class team solving cutting-edge challenges\n\nCollaborative and innovative work environment\n\nLumilens is committed to building a diverse and inclusive workplace. 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