{"id":621766,"url":"https://alion.io/job/lumilens-seniorstaff-process-engineer-flip-chip","title":"Senior/Staff Process Engineer (Flip Chip)","company":{"id":678172,"name":"Lumilens","domain":"lumilens.com","url":"https://alion.io/company/lumilens","size_band":"201-500","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Ashby","truth_index":{"grade":"A","score":89,"open_postings":149,"ghost_share":0.101,"stale_share":0,"repost_share":0,"time_to_fill_p50_days":118,"computed_at":"2026-11-01T06:10:25Z"}},"role":"Semiconductors","role_family":"Semiconductors","seniority":"staff","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Singapore"],"countries":["SG"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":66000,"max_usd":135000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":29},"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"FMEA","optional":false},{"name":"JMP","optional":false},{"name":"Minitab","optional":false},{"name":"Statistical Process Control","optional":false}],"status":"live","first_seen_at":"2026-08-07T09:56:42Z","employer_posted_date":"2026-08-07","last_verified_at":"2026-11-01T13:56:53Z","board_verified":true,"closed_at":null,"days_open":86,"trust":{"level":"ok","repost_count":0,"flags":["company_stale"],"days_open":85},"description":"Core Responsibilities\nOwns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line. Process may include plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.\n\nDOE to characterize process window and margin. Optimize process integration with upstream processes (e.g. bump/FO) to increase yield and manufacturability.\n\nMaterial Characterization & Selection: Evaluate and qualify new manufacturing raw materials, including NCP, flux, underfill etc, as applicable.\n\nDesign and execute DOE plans to characterize thermal and mechanical stress. Lead reliability validations including Temperature Cycling Test (TCT), Unbiased Highly Accelerated Stress Test (HAST) and High-Temperature Storage (HTS).\n\nFailure Analysis & Debug: Own the root-cause diagnostics of structural failure modes unique to FC (e.g. flux void, residue, misalignment, die warpage, reflow anomaly, underfill void etc), and formulate improvement solutions.\n\nManage incoming material quality control, establish SPC control plans and monitor process variation to ensure long-term process stability.\n\nCompile process SOP, WI, process failure reports and engineering change documents; support NPI new product introduction and process verification.\n\nKey Requirements & Qualifications\nEducation: Bachelor or Master degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or an equivalent technical discipline.\n\nExperience: 5+ years of hands-on industry experience in flip chip assembly.\n\nTechnical Knowledge:\n\nDeep practical understanding of plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.\n\nComprehensive command of finite element simulation principles regarding warpage, thermal dissipation, and structural mechanical integrity.\n\nSolid working expertise with industry validation methodologies including FMEA, SPC controls, and structured 8D problem-solving tools.\n\nSoftware Tools: High proficiency with robust analytical platforms like JMP, Minitab.","description_format":"text","description_chars":2127,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Servers & Data Center Hardware","Optical Communications","Optics & Photonic 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