{"id":621851,"url":"https://alion.io/job/lumilens-wire-bond-manufacturing-engineer","title":"Wire Bond-Manufacturing Engineer","company":{"id":678172,"name":"Lumilens","domain":"lumilens.com","url":"https://alion.io/company/lumilens","size_band":"201-500","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Ashby","truth_index":{"grade":"A","score":89,"open_postings":149,"ghost_share":0.101,"stale_share":0,"repost_share":0,"time_to_fill_p50_days":118,"computed_at":"2026-11-01T06:10:25Z"}},"role":"Semiconductors","role_family":"Semiconductors","seniority":"middle","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Singapore"],"countries":["SG"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":30000,"max_usd":87000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":40},"experience_years_min":3,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"AS9100","optional":false},{"name":"CAPA","optional":false},{"name":"JMP","optional":false},{"name":"Mandiant capa","optional":false},{"name":"Minitab","optional":false},{"name":"Statistical Process Control","optional":false}],"status":"live","first_seen_at":"2026-07-28T10:00:40Z","employer_posted_date":"2026-07-28","last_verified_at":"2026-11-01T13:56:53Z","board_verified":true,"closed_at":null,"days_open":96,"trust":{"level":"ok","repost_count":0,"flags":["company_stale"],"days_open":95},"description":"About Lumilens\nAt Lumilens, we are building the critical photonics infrastructure powering tomorrow’s AI supercomputing. Our mission is to unlock a new era of computing that is faster, cooler, and massively more efficient. Join our world-class team as we redefine possibilities in photonic technology.\nJob Description\nWe are seeking a Wire Bond Manufacturing Engineer specializing in Process & Equipment to join our Manufacturing Engineering team within Semiconductor Assembly & Test. In this mid-to-senior level role, you will be responsible for developing, qualifying, optimizing, and sustaining wire bonding processes and equipment for semiconductor packaging operations. You will oversee process and equipment performance for ball bonding, wedge bonding, and ribbon bonding operations, ensuring high yield, reliability, and throughput, while driving continuous improvement and supporting new product introduction (NPI).\nKey Responsibilities\nProcess Engineering\nDevelop, characterize, qualify, and optimize wire bond processes (thermosonic ball bonding, wedge bonding, ribbon bonding) for gold, copper, and aluminum wire systems\n\nEstablish and maintain process specifications, bond recipes, work instructions, and control plans\n\nLead root cause analysis and corrective/preventive actions (CAPA) for wire bond process yield losses and defects\n\nSupport NPI by developing new wire bond process flows, including DOE-driven process windows\n\nPerform wire pull and ball shear testing; analyze results against specifications (MIL-STD-883, JEDEC)\n\nDrive process capability (Cpk) improvements and defect reduction through SPC and structured problem-solving\n\nEquipment Engineering\nOwn the uptime, throughput, and performance of wire bonding equipment (ASM, Kulicke & Soffa, Shinkawa, Hesse, etc.)\n\nTroubleshoot and resolve equipment-related issues and optimize bonder cycle time and UPH (units per hour)\n\nLead equipment qualification, installation, and buy-off (IQ/OQ/PQ) for new or upgraded wire bonders\n\nCollaborate with equipment vendors for technical escalations and upgrades\n\nPlan preventive maintenance and spare parts strategy\n\nQuality & Reliability\nPartner with Quality and Reliability teams on failure analysis for field and customer returns\n\nSupport qualification builds, reliability testing (temp cycle, HTOL, HAST), and customer PPAP/PSW submissions\n\nEnsure compliance with IPC/JEDEC standards and customer requirements\n\nCross-Functional Collaboration\nWork closely with Product/Design Engineering for bond pad layout and substrate design\n\nPartner with Process Integration, Test, and Quality to resolve yield and reliability issues\n\nSupport cost reduction initiatives and train operators/technicians on process and equipment\n\nDocumentation & Compliance\nMaintain process control documents, FMEAs, control plans, and traceability as per Lumilens quality management systems (ISO 9001 / IATF 16949 / AS9100)\n\nSupport internal and customer audits related to wire bond processes and equipment\n\nRequirements\nRequired:\nBachelor’s degree in Electrical, Mechanical, Materials Science, or related engineering\n\n3-7 years’ hands-on experience in wire bond process/equipment engineering within semiconductor assembly (OSAT/IDM)\n\nKnowledge of ball, wedge, and/or ribbon bonding processes and failure modes\n\nExperience with DOE, SPC, and root cause/CAPA methods\n\nFamiliarity with wire bond equipment platforms (ASM, Kulicke & Soffa, Shinkawa, Hesse, West Bond)\n\nUnderstanding of reliability tests and industry standards (JEDEC, MIL-STD-883)\n\nStrong analytical, troubleshooting, and cross-functional communication skills\n\nWillingness to support shift or production floor needs\n\nPreferred:\nExperience in high-volume power semiconductor, RF/microwave, automotive, or optoelectronics packaging\n\nExposure to copper wire bonding and associated process/reliability considerations\n\nExperience with fine-pitch wire bonding (\n\nSix Sigma Green/Black Belt certification\n\nFamiliarity with statistical software (Minitab, JMP), MES/data systems, and AOI/vision systems\n\nCleanroom manufacturing experience\n\nWhat We Offer\nCompetitive salary and benefits package\n\nThe opportunity to work on cutting-edge semiconductor packaging technology\n\nA collaborative, cross-functional engineering environment\n\nCareer growth within the manufacturing/process engineering track\n\nLumilens is an equal opportunity employer committed to diversity and 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