{"id":645538,"url":"https://alion.io/job/lyte-assembly-and-mechanical-lead","title":"Assembly and Mechanical Lead","company":{"id":30000,"name":"Lyte","domain":"lyte.ai","url":"https://alion.io/company/lyte","size_band":"501-1000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Rippling","truth_index":{"grade":"A","score":95,"open_postings":37,"ghost_share":0,"stale_share":0,"repost_share":0,"time_to_fill_p50_days":175,"computed_at":"2026-10-22T06:10:10Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"lead","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":140000,"max_usd":283000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":1829},"experience_years_min":3,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-01-04T00:26:11Z","employer_posted_date":"2026-01-04","last_verified_at":"2026-10-22T18:19:47Z","board_verified":true,"closed_at":null,"days_open":291,"trust":{"level":"ok","repost_count":0,"flags":[],"days_open":291},"description":"About Lyte\nLyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai\nIf you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!\nAbout the role\nWe are seeking an experienced process lead engineer in the field of optical device packaging and assembly with a degree in Mechanical Engineering, Physics or a related field. \nWhat you'll do\nLead optical engine and system module assembly with automation and tooling designs to increase UPH & yield and reduce cost with both customized hardware and software development based on SPC and drive Cp, Cpk improvement.\nSupport the device packaging RnD and NPI with mechanical design, drawing and thermal modelling.\nSupport device testing automation and data analysis automation/scripts or software development and implementation. \nWork with RnD to understand the device specs, particularly mechanical control outline, and assembly requirements and negotiate between the incoming device MCO, mechanical design, and assembly process based on design improvement and/or experimental data from designed DOEs. \nWork with OSATs to support NPI and volume production contract manufacture with technical SOW drafting. \nAct as the technical project manager for owned projects.\nProvide DFM, DFR, and DFT inputs for HQ RnD teams for device packaging and assembly. \nKeep proper documentation, and initiate ECN and PCN when needed. \nDevelop and track packaging and assembly component specifications as well as inventory.\nAudit/regularly visit our contract Manufacturers and suppliers then provide reports.\nWrite technical reports and present results to internal and external stakeholders.\nBuild and grow the Operation Process Team worldwide.\nRequired Qualifications\nHave a mechanical engineer degree with relevant experience on optical module and/or Lider assembly. \nMinimal requirement is a Master or Ph.D. degree with 3 years of relevant experience. \nExperience or knowledge of optical sensors. optical device packaging process, or optical module assembly process. \nExperience with assembly process integration for process flow design and continue process improvement.\nExpertise mechanical drawings using SolidWork, mechanical simulation, and thermal simulation.\nProject management capability/experience is a must.\nExperience working with foundries, OSATs, assembly houses, PCBA fab, and contract manufacturers in process development and yield improvement is important.\nThe ability to work independently and take ownership of projects as well as collaboratively in cross-functional teams is a must.\nA fast learner is a must.\nGood work ethics is a must\nCapable of keeping company confidential information and IP is a must. \nPreferred Qualifications\nKnowledge or work experience with PCBA is highly desirable.\nFormer experience of microelectronic and optical devices packaging is desired.\nUnderstanding Silicon Photonics is a plus.\nExperience with FMEA, failure analysis, and 8D report is highly desired.\nSupplier quality management experience is a plus.\nKnowledge of Lidar and relevant technologies is a plus.\nFormer experience of writing technical SoW is a plus.\nFamiliar with ECN, PCN, and documentation is highly desirable.\nBenefits (subject to location and local regulations)\nCompetitive salary and equity \nComprehensive medical, dental, and vision coverage \n401(k) retirement plan \nFlexible vacation and time-off policy \nCollaborative, fast-paced, and inclusive work environment \nOpportunity to work on cutting-edge technologies with a highly cross-functional team","description_format":"text","description_chars":3837,"description_truncated":false,"requirements":{"experience_years_min":3,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"phd","optional":false},"security_clearance":false,"languages":[]},"benefits":["Equity","Retirement 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