{"id":1185377,"url":"https://alion.io/job/mediatek-co-packaged-optics-cpo-reliability-sr-staffprincipal-engineer","title":"Co-Packaged Optics (CPO) Reliability Sr. Staff/Principal Engineer","company":{"id":62191,"name":"MediaTek","domain":"mediatek.com","url":"https://alion.io/company/mediatek","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Career site","truth_index":{"grade":"A","score":85,"open_postings":368,"ghost_share":0.166,"stale_share":0,"repost_share":0,"time_to_fill_p50_days":112,"computed_at":"2026-10-25T05:49:26Z"}},"role":"Leadership","role_family":"Leadership","seniority":"lead","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["San Jose, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":149000,"max_usd":298000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":789},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"closed","first_seen_at":"2026-06-17T16:00:00Z","employer_posted_date":"2026-09-24","last_verified_at":"2026-10-01T19:15:20Z","board_verified":false,"closed_at":"2026-10-01T19:15:20Z","days_open":106,"trust":{"level":"ghost","repost_count":0,"flags":["stale","company_stale"],"days_open":105},"description":"We are seeking a high-caliber Co-Packaged Optics (CPO) Reliability Engineer to lead the reliability, qualification, and robustness assessment of next-generation co-packaged photonic and electronic systems. In this role, you will focus on the unique reliability challenges at the intersection of high-speed silicon switch ASICs and optical transport, driving qualification across the entire product Lifecycle.You will be responsible for defining accelerated testing methodologies, evaluating complex thermal/mechanical interfaces, and ensuring the seamless integration of optoelectronic components within advanced multi-die architectures.\nKey Responsibilities\nCPO Architecture Qualification: Architecture and execute comprehensive qualification plans at the module and system levels, ensuring strict compliance with GR-468 (Telcordia) and relevant JEDEC standards tailored for co-packaged environments.\nAdvanced Packaging Reliability: Characterize and model the Reliability Failure Modes of Silicon / Packaging specifically targeting high-density 2.5D / 3D packaging, Multi-Chip-Modules (MCM), and ultra-dense electrical/optical interfaces.\nComponent De-risking: Partner with design teams early in the NPI phase to establish Design for Reliability (DfR) and execute FMEA / DFMEA to mitigate risks associated with integrated Optical Engines, PIC (Photonic Integrated Circuits), and high-power III-V laser sources.\nReliability Lifetime Modeling: Develop physics-of-failure and Reliability lifetime Modeling frameworks to evaluate wear-out mechanisms such as thermo-mechanical fatigue, electromigration, and optical degradation under mission-critical data center use conditions.\nStatistical Analysis & FIT Tracking: Utilize statistical software like JMP to analyze parametric drift, accelerated life testing (ALT) data, and calculate product FIT (Failures in Time) and MTBF metrics.\nFailure Analysis & RMA: Own root-cause failure analysis (FA) for qualification failures and field returns (RMA), leveraging advanced analytical tools to identify material, process, or design marginalities.\nSupply Chain Collaboration: Work closely with external ecosystems, including OSAT partners, contract manufacturers (CM), and foundry suppliers, to standardize test methodologies and audit factory-level quality controls.","description_format":"text","description_chars":2304,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":null,"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","RF & Wireless Hardware","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-09-24T14:44:02Z"},{"event":"close","at":"2026-10-01T19:15:20Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 104 · green card filings: 55","filings_12m":104,"filings_prev_12m":56,"green_card_filings_12m":55,"median_offered_wage_usd":160739,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA 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