{"id":1185559,"url":"https://alion.io/job/mediatek-engineerstaff-engineer-multi-dies-physical-verification-engineer","title":"Engineer/Staff Engineer – Multi-Dies Physical Verification Engineer","company":{"id":62191,"name":"MediaTek","domain":"mediatek.com","url":"https://alion.io/company/mediatek","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Career site","truth_index":{"grade":"B","score":83,"open_postings":353,"ghost_share":0.207,"stale_share":0,"repost_share":0,"time_to_fill_p50_days":85,"computed_at":"2026-10-03T05:45:00Z"}},"role":"Hardware","role_family":"Hardware","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Singapore"],"countries":["SG"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":66000,"max_usd":131000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":10},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-02-26T16:00:00Z","employer_posted_date":"2026-09-24","last_verified_at":"2026-10-04T03:09:11Z","board_verified":true,"closed_at":null,"days_open":219,"trust":{"level":"ok","repost_count":0,"flags":["company_stale"],"days_open":218},"description":"Join the MediaTek Chip Physical Verification team and help create technology for products that will delight and inspire millions of people every day. As a member of our team, you will define and enable physical sign-off flows and solutions for SoC and Multi-Dies (3D IC) design, ensuring first-time success in product tape-out. In this role, you will develop and implement technologies at advanced process nodes, contributing to the success of cutting-edge products.Job Responsibilities:\nResponsible for Multi-Dies Physical Verification Sign-off in area of (3D_Stack, 3D_PERC, 3D_ANT) for tape-out.\nCo-work with Package Design Team to resolve Multi-Dies integration issues.\nCo-work with ESD Team to run 3D_PERC flow.\nCoordinates with Chip PV Team on active dies related issues (DRC, LVS, ANT, ERC, ESD)\nProvide automation solutions to improve efficiency in tape-out flow.\nReport on Tapeout PV issues.\n#LI-WC1","description_format":"text","description_chars":908,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":null,"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","RF & Wireless Hardware","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-09-24T14:44:02Z"}],"visa":[],"liveness":{"score":17,"band":"cold","label":"Long shot","p_open":1,"p_active":0.593,"p_room":0.28,"age_days":218,"expected_fill_days":85,"reasons":["conf:6","velocity","win:tail","crowd:brand"],"computed_at":"2026-10-03T05:45:00Z"},"pay":null,"html_url":"https://alion.io/job/mediatek-engineerstaff-engineer-multi-dies-physical-verification-engineer","json_url":"https://alion.io/job/mediatek-engineerstaff-engineer-multi-dies-physical-verification-engineer.json","meta":{"generated_at":"2026-10-04T03:16:19Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","usage":{"tier":"crawler","counted_by":"address","units_charged":1,"used_today":4967,"day_limit":5000,"remaining_today":33,"minute_limit":60,"resets_at":"2026-10-05T00:00:00Z"}}}