{"id":2472774,"url":"https://alion.io/job/mediatek-sr-staffprincipal-advanced-packaging-architect","title":"Sr. Staff/Principal Advanced Packaging Architect","company":{"id":62191,"name":"MediaTek","domain":"mediatek.com","url":"https://alion.io/company/mediatek","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Career site","truth_index":{"grade":"A","score":85,"open_postings":368,"ghost_share":0.16,"stale_share":0,"repost_share":0,"time_to_fill_p50_days":112,"computed_at":"2026-10-24T06:02:35Z"}},"role":"Hardware","role_family":"Hardware","seniority":"lead","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["San Jose, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":146000,"max_usd":277000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":609},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-13T16:00:00Z","employer_posted_date":"2026-10-13","last_verified_at":"2026-10-24T14:31:48Z","board_verified":true,"closed_at":null,"days_open":10,"trust":{"level":"ok","repost_count":0,"flags":["company_stale"],"days_open":10},"description":"About the team:MediaTek’s Data Center team is at the forefront of innovation, driving the development of cutting-edge technologies that power the world's most advanced data centers. 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If you are passionate about innovation and have the expertise to drive strategic technology development, we would love to hear from you.\nResponsibilities:\nLead research and development of package architecture for AI accelerators and data center products.\nResponsible for defining reference packaging architecture and methodology for high-power, high-bandwidth multi-chiplet systems, with emphasis on concept development, STCO modeling, and technology selection.\ncollaborative leader with a strong technical background in semiconductor packaging, metrology, and characterization, who will develop and maintain strong, strategic partnerships with internal engineering teams across packaging, reliability, test, technology integration, and product development, and build collaborative relationships with external partners to ensure alignment of technology and product roadmaps.\nProvide technical leadership and maintain a deep understanding of industry trends and advancements in semiconductor packaging and characterization.\nLead architecture definition of advanced packaging solutions such as 2.5D/3D, CPO, IVR, and HSIO. 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