{"id":2256133,"url":"https://alion.io/job/microchip-engineer-i-process-grinding-and-lamination","title":"Engineer I Process_Grinding and Lamination","company":{"id":44188,"name":"Microchip Technology","domain":"microchip.com","url":"https://alion.io/company/microchip","size_band":"201-500","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":null},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"junior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Philippines"],"countries":["PH"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":9000,"max_usd":22000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":4417},"experience_years_min":3,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Microsoft Office","optional":false}],"status":"live","first_seen_at":"2026-10-06T00:00:00Z","employer_posted_date":"2026-10-06","last_verified_at":"2026-10-12T00:56:51Z","board_verified":true,"closed_at":null,"days_open":6,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":6},"description":"Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc.\nPeople come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognizedLeadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.\nOur company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.\nVisit our careers page to see what exciting opportunities and company perks await!\nJob Description:\nThe Engineer I-Process - Backgrind is responsible for the development, characterization, qualification, and industrialization of wafer thinning technologies supporting advanced semiconductor packaging platforms including WLCSP, BGA, MDQFN, Fan-Out, and other wafer-level packaging technologies. The role focuses on developing robust backgrinding, wafer thinning, stress management, and wafer handling processes that enable high-yield, reliable, and manufacturable products.\nThe position serves as the technical lead for Backgrind process development activities, driving technology innovation, new product introduction (NPI), process optimization, and manufacturing readiness while collaborating with Product Development, R&D, Equipment Engineering, Operations, Quality, and external suppliers.\nJob Responsibilities:\nLead the development and qualification of wafer backgrinding and thinning processes for new technology platforms and products.\nEstablish process architecture, process windows, and technology roadmaps for wafer thinning applications.\nDrive innovation initiatives to enable thinner wafers, improved wafer integrity, and advanced package requirements.\nEvaluate and implement new grinding technologies, materials, consumables, and equipment solutions.\nDevelop best practices and standards for wafer thinning and handling operations\nDefine process architecture, process flow, and critical process parameters to meet design, reliability, and manufacturability requirements.\nLead process characterization activities to establish robust operating windows and process margins.\nEvaluate emerging technologies, materials, and equipment to enhance technical capabilities and competitive advantage.\nDrive innovation initiatives to improve metallization performance, process capability, throughput, and cost effectiveness.\nLead process transfer from development to pilot and high-volume manufacturing.\nGenerate process specifications, control plans, operating procedures, and qualification reports.\nEnsure developed processes meet manufacturability, reliability, and cost targets.\nSupport manufacturing teams during technology ramp and early production phases.\nDrive process stabilization and continuous improvement following production release.\nServe as Subject Matter Expert (SME) for:Wafer and Panel Backgrinding\nTop mold grinding\nCoarse and Fine Grinding\nWafer Thinning Technologies\nTemporary Wafer Mounting Systems\nGrinding Wheel Technologies\nWafer or Panel Handling and Transport\nWafer or Panel Warpage Management\nThin Wafer Processing\nTape Lamination, Detaping and Cure Processes\n\nRequirements/Qualifications:\nBachelor's Degree in Electronics Engineering, Chemical Engineering, Materials Science Engineering, Mechanical Engineering, Semiconductor Engineering, Physics, Related Engineering disciplines\nMinimum 3 years of semiconductor manufacturing experience with direct experience in Backgrinding and Tape Lamination process\nEngineering tools: Design of Experiment (DOE), Minitab or JMP, Statistical Process Control (SPC), FMEA, GRR and Six Sigma tools\nFamiliarity with process characterization, recipe creation, and equipment or process troubleshooting\nStrong analytical and problem-solving skills; ability to interpret SPC charts and process data.\nGood communication skills and ability to work in a team-oriented environment.\nKnowledge of safety protocols and cleanroom practices.\nStrong experience with Fan-in and Fan-Out or advanced packaging tools is highly preferred\nProficiency in MS Office and maintenance management systems.\nStrong analytical and problem-solving skills\nLeadership and mentoring capability\nGood communication and teamwork skills\nHigh attention to detail and sense of accountability\nTravel Time:\n0% - 25%To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. 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