{"id":1443555,"url":"https://alion.io/job/micron-technology-director-advanced-packaging-technology-development","title":"Director, Advanced Packaging Technology Development","company":{"id":37,"name":"Micron Technology","domain":"micron.com","url":"https://alion.io/company/micron-technology","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":79,"open_postings":809,"ghost_share":0,"stale_share":0.845,"repost_share":0,"time_to_fill_p50_days":32,"computed_at":"2026-10-01T05:45:00Z"}},"role":"Hardware","role_family":"Hardware","seniority":"head","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Taichung, Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":69000,"max_usd":138000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":29},"experience_years_min":12,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Python","optional":false},{"name":"SQL","optional":false}],"status":"live","first_seen_at":"2026-09-29T05:42:22Z","employer_posted_date":"2026-09-29","last_verified_at":"2026-10-01T08:21:07Z","board_verified":true,"closed_at":null,"days_open":2,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":2},"description":"Our vision is to transform how the world uses information to enrich life for all.\nMicron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.\nAs a Director of Process Development in Advanced Packaging Technology Development (APTD) within Micron, you will provide strategic and technical leadership for the development and deployment of advanced packaging assembly processes enabling next-generation memory products. You will collaborate with internal and external stakeholders to define and execute technology development strategies aligned with organizational and business objectives. Your team will be responsible fordeveloping scalable, manufacturable, and cost-effective assembly processes that deliver industry-leading performance, quality, yield, and reliability.\nYou will drive innovation across advanced packaging technologies including 2.5D, 3DIC, hybrid bonding, wafer-level and panel-level packaging, advanced interconnect solutions, and emerging assembly platforms. You will lead process development from concept through technology qualification, productization, and high-volume manufacturing transfer while ensuring alignment with Technology Development business processes.\nIn this role, you will develop organizational capability through leadership coaching, talent development, succession planning, and strategic workforce planning. You will establishperformance metrics, drive continuous improvement initiatives, and provide organizational leadership in developing department strategies, technology roadmaps, and cross-functional execution plans.\nResponsibilities include, but are not limited to, the following:\nTechnology Strategy and Roadmap Development\nDevelop and communicate advanced packaging process technology strategies aligned with Micron's long-term product and technology roadmap.\n\nDefine process development roadmaps for next-generation packaging platforms.\n\nEvaluate emerging assembly technologies, materials, and equipment solutions to identifyfuture competitive advantages.\n\nUnderstand market, product, and technology trends and translate them into executable development strategies.\n\nInfluence organizational investment decisions through data-driven technical recommendations.\n\nProcess Technology Leadership\nEstablish strategic and long-term technical objectivesfor assembly process development organizations.\n\nDrive innovation in die attach, hybrid bonding, thermocompression bonding, molding, underfill, substrate assembly, singulation, and related packaging processes.\n\nLead development of scalable manufacturing solutions for advanced packaging technologies.\n\nChampion process architecture decisions balancingperformance, manufacturability, cost, reliability, and cycle time.\n\nDrive breakthrough solutions for challenging yield, reliability, and process integration problems.\n\nProduct Development and Manufacturing Readiness\nLead process development activities from concept through qualification and manufacturing transfer.\n\nEnsure development projects meet technology milestones, quality expectations, and business objectives.\n\nDrive manufacturability improvements through process optimization and design enablement.\n\nEnsure process capability, yield targets, cost objectives, and reliability requirements are achieved.\n\nEstablish development methodologies, best practices, and qualification strategies.\n\nCross-Functional Leadership\nRepresent APTD Process Development in company-wide technical and business initiatives.\n\nPartner with Process Integration, Design, Product Engineering, Reliability, Manufacturing, Procurement, Quality, and Supply Chain organizations.\n\nDevelop strategic partnerships with equipment and material suppliers.\n\nLead cross-functional teams in resolving complex technical and operational challenges.\n\nInfluence internal and external stakeholders without direct authority.\n\nOrganizational Leadership\nBuild and develop a high-performing technical organization.\n\nCreate a culture focused on innovation, collaboration, accountability, and continuous improvement.\n\nEstablish succession plans and organizational capability roadmaps.\n\nMentor managers, technical leaders, and emerging talent.\n\nDrive employee engagement, inclusion, and leadership development initiatives.\n\nBusiness Impact and Execution\nEnsure critical deliverables, milestones, and business objectivesare achieved.\n\nGuideeffective utilizationof personnel, capital, and equipment resources.\n\nDrive productivity improvements, cycle-time reduction, and cost optimization initiatives.\n\nMake decisions that directly impactproduct competitiveness and organizational success.\n\nMonitor and communicate key performance indicators to senior leadership.\n\nContinuous Improvement and Growth\nApply Artificial Intelligence to promote adoptionof new technologies, data science methodologies, and advanced analytics.\n\nFoster a growth mindset within the organization.\n\nDrive continuous improvement in process development methodologies and execution efficiency.\n\nEncourage cross-functional learning and knowledge sharing.\n\nQualifications and Skills\nExperience\nMinimum 12years of semiconductor industry experience with at least 5years inadvanced packaging technology development.\n\nMinimum 5 years of leadership experience managing managers and/or large technical organizations.\n\nDemonstrated success developing and qualifying advanced packaging technologies from concept to manufacturing.\n\nExperience working with global teams and external technology partners.\n\nTechnical Expertise\nStrong knowledge in one or more of the following areas: 2.5D and 3D packaging technologies; hybrid bonding (D2W, W2W, C2W); HBM and heterogeneous integration; advanced assembly processes and materials; wafer-level packaging and fan-out technologies; reliability engineering and qualification methodologies; semiconductor manufacturing equipment and process control; yield improvement and failure analysis; and process characterization, DOE, and statistical methodologies.\n\nData and Analytical Skills\nExcellent data extraction, analytics, and visualization skills.\n\nExperience with JMP, Python, R, SQL, or equivalent analytical tools.\n\nStrong understanding of process capability, statistical process control, and experimental design.\n\nAbility to translate data into actionable technical and business decisions.\n\nLeadership Competencies\nProven ability to lead large and diverse organizations.\n\nStrong strategic thinking and technology vision.\n\nExcellent stakeholder management and influencing skills.\n\nAbility to navigate ambiguity and drive execution under tight timelines.\n\nOutstanding verbal, written, and executive presentation skills.\n\nStrong customer and product focus.\n\nDemonstrated ability to build effective partnerships across global organizations.\n\nEducation\nMS or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Chemistry, Computer Engineering, or a relatedtechnical field.\n\nRecommended Micron-Specific Scope\nThe following expectations may be retainedwhen the role is specifically scoped to Package 3DI Assembly and next-generation HBM enablement:\nOwn the Advancedassembly technology roadmap.\n\nLead supplier co-development strategy across key equipment and material partners.\n\nDrive technology transfer across Taiwan, Singapore, and Boise.\n\nAdvance AI enabled process optimization and intelligent manufacturing initiatives.\n\nLead capital strategy and development-equipment investment planning.\n\nEnsure scalable manufacturing readiness for HBM4E, HBM5, and next-generation 3D packaging platforms.\n\nAbout Micron Technology, Inc.\nWe are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.\nTo learn more, please visit micron.com/careers\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.\nTo request assistance with the application process and/or for reasonable accommodations,please contact at .\nMicron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.\nMicron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.\nAI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.\nFraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.","description_format":"text","description_chars":9643,"description_truncated":false,"requirements":{"experience_years_min":12,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Enterprise Storage Systems","Semiconductor Manufacturing","Memory & Storage Chips"],"lifecycle":[{"event":"open","at":"2026-09-29T05:42:22Z"}],"liveness":{"score":70,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.695,"p_room":1,"age_days":2,"expected_fill_days":32,"reasons":["conf:8","stale_co","urgency","velocity","win:early","comp:brand"],"computed_at":"2026-10-01T05:45:00Z"},"pay":null,"html_url":"https://alion.io/job/micron-technology-director-advanced-packaging-technology-development","json_url":"https://alion.io/job/micron-technology-director-advanced-packaging-technology-development.json","meta":{"generated_at":"2026-10-02T00:49:02Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","usage":{"tier":"crawler","counted_by":"address","units_charged":1,"used_today":839,"day_limit":5000,"remaining_today":4161,"minute_limit":60,"resets_at":"2026-10-03T00:00:00Z"}}}