{"id":3716735,"url":"https://alion.io/job/micron-technology-intern-advanced-packaging-td","title":"Intern - Advanced Packaging TD","company":{"id":37,"name":"Micron Technology","domain":"micron.com","url":"https://alion.io/company/micron-technology","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"A","score":88,"open_postings":679,"ghost_share":0,"stale_share":0.49,"repost_share":0.007,"time_to_fill_p50_days":49,"computed_at":"2026-11-07T05:47:08Z"}},"role":"Hardware","role_family":"Hardware","seniority":"intern","employment_type":"internship","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Boise, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Design of Experiments","optional":false},{"name":"JMP","optional":false}],"status":"live","first_seen_at":"2026-11-03T00:00:00Z","employer_posted_date":"2026-11-03","last_verified_at":"2026-11-08T00:32:27Z","board_verified":true,"closed_at":null,"days_open":5,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":5},"description":"Our vision is to transform how the world uses information to enrich life for all.\nMicron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.\nJoin Micron’s Advanced Packaging Technology Development (TD) team, where innovation and precision come together to develop next-generation interconnect technologies. The team develops solutions designed to improve semiconductor performance, reliability, and advanced packaging capabilities.\nAs an Advanced Package TD Process Intern, you will collaborate with experienced engineers to support development of technologies including hybrid bonding, micro bump technology, Through-Silicon Vias (TSV), and thermal management. You will gain hands-on experience in structured problem-solving, line monitoring, data analysis, experimental design, and project management while contributing to process optimization and yield improvement. You will also leverage AI and Code Assist to develop Agent-based solutions that support engineering analysis and process development activities.\nResponsibilities\nLead structured problem-solving activities using methodologies such as Kepner-Tregoe (KT) to address process and yield challenges.\nDefine, complete, and analyze Design of Experiments (DoE) for advanced packaging and interconnect process development.\nAnalyze process, line-monitoring, and yield data; develop new monitoring methods and critical metrics to support process optimization.\nPresent technical findings and collaborate with engineering teams across sites and functional areas.\nApply AI and Code Assist to develop Agent-based solutions that enhance data analysis, engineering workflows, or process monitoring.\nMinimum Qualifications\nCurrently enrolled in an accredited university pursuing a Master’s degree or PhD in a semiconductor-related field, with an expected graduation date no earlier than Fall 2027 and no later than Summer 2028.\nDemonstrated experience with data extraction, statistical analysis, and technical reporting using tools such as JMP or comparable analytics tools.\nDemonstrated ability to collaborate and communicate technical findings across multi-functional teams.\nAbility to prioritize multiple technical projects, adapt to changing responsibilities, and deliver results within project timelines and resource constraints.\nExperience Using AI, Code Assist, or Agent-based solutions for technical analysis, engineering workflows, or related applications.\nPreferred Qualifications\nExperience with semiconductor process technologies, including advanced packaging, back-end-of-line (BEOL), advanced interconnect, hybrid bonding, micro bump technology, or TSV.\nExperience with structured problem-solving or decision-making methodologies such as Kepner-Tregoe (KT).\nAcademic or research experience related to advanced packaging, interconnect technologies, or package thermal performance and thermal management.\nExperience designing experiments and performing statistical analysis using DoE, JMP, or comparable methods and tools.\nDemonstrated academic, research, or project experience related to advanced semiconductor packaging or interconnect development.\nAs a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays.For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.\nMicron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.\nTo learn about your right to work click here.\nTo learn more about Micron, please visitmicron.com/careers\nFor US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at  or 1-800-336-8918 (select option #3)\nMicron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.\nMicron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.\nAI alert : Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.\nFraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.","description_format":"text","description_chars":5634,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[]},"benefits":["Parental leave"],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Enterprise Storage Systems","Semiconductor Manufacturing","Memory & Storage Chips"],"lifecycle":[{"event":"open","at":"2026-11-04T01:02:18Z"}],"visa":[{"country":"US","licensed_sponsor":true,"adverts_offering_sponsorship_24m":0,"sanctioned_now":false,"evidence":"H-1B filings in 12 months: 535 · green card filings: 199","filings_12m":535,"filings_prev_12m":562,"green_card_filings_12m":199,"median_offered_wage_usd":127078,"route":null,"cap_exempt":false,"checked_at":"2026-11-07T07:57:00+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":216}],"liveness":{"score":99,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.993,"p_room":1,"age_days":4,"expected_fill_days":49,"reasons":["conf:1","urgency","velocity","win:early","comp:junior,brand"],"computed_at":"2026-11-07T05:47:08Z"},"pay":null,"html_url":"https://alion.io/job/micron-technology-intern-advanced-packaging-td","json_url":"https://alion.io/job/micron-technology-intern-advanced-packaging-td.json","meta":{"generated_at":"2026-11-08T01:44:24Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":3787,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-09T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":37},"rest":"https://alion.io/mcp/rest/get_company?id=37"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fmicron-technology-intern-advanced-packaging-td"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fmicron-technology-intern-advanced-packaging-td"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fmicron-technology-intern-advanced-packaging-td"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/micron-technology-intern-advanced-packaging-td\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fmicron-technology-intern-advanced-packaging-td"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3716735}},{"tool":"search_jobs","arguments":{"company":"micron.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3716735},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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