{"id":1928244,"url":"https://alion.io/job/micron-technology-intern-engineer-hig-hbm-dtpco","title":"Intern - Engineer, HIG HBM DTPCO","company":{"id":37,"name":"Micron Technology","domain":"micron.com","url":"https://alion.io/company/micron-technology","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"A","score":86,"open_postings":724,"ghost_share":0,"stale_share":0.541,"repost_share":0.006,"time_to_fill_p50_days":49,"computed_at":"2026-10-30T05:48:23Z"}},"role":"Hardware","role_family":"Hardware","seniority":"intern","employment_type":"internship","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Richardson, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":3,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"AI Agents","optional":false},{"name":"C++","optional":false},{"name":"Python","optional":false},{"name":"Verilog","optional":false},{"name":"Claude Code","optional":true}],"status":"live","first_seen_at":"2026-10-05T20:57:07Z","employer_posted_date":"2026-10-05","last_verified_at":"2026-10-30T17:44:24Z","board_verified":true,"closed_at":null,"days_open":25,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":25},"description":"Our vision is to transform how the world uses information to enrich life for all.\nMicron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.\nMicron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Within the HBM organization, this role is part of a highly collaborative team focused on advancing next-generation High Bandwidth Memory (HBM) solutions through deep characterization, modeling, and root-cause analysis. The team partners closely with Design Technology Co-Optimization (DTPCO), Product Engineering, Packaging, Test, Reliability, and Technology Development organizations to drive product innovation and quality.\nThis role is critical to achieving DTPCO objectives by developing a first-principles understanding of HBM cube limitations and validating hypotheses through silicon data and supporting models. The position focuses on custom bench-level characterization of HBM devices under thermal, mechanical, and electrical stress conditions to improve product performance, yield, reliability, and adaptability across future HBM generations.\nResponsibilities\nDesign, build, debug, and complete custom bench-level test setups, fixtures, and measurement flows using laboratory equipment including power supplies, SMUs, oscilloscopes, thermal systems, handlers, sockets, and probe cards.\nPerform thermal, mechanical, and electrical characterization of HBM cubes under hot/cold, transient, and forced-temperature conditions, including power-temperature correlation, warpage analysis, stress characterization, timing margin evaluation, and failure-onset analysis.\nDevelop and maintain Python-, Verilog-, and C/C++-based test programs, stress patterns, workloads, and observability features to accelerate root-cause investigations and improve characterization efficiency.\nAnalyze MBIST signatures and multifaceted electrical, thermal, and mechanical datasets to identify root causes related to design, process, package, assembly, or test interactions, and recommend corrective actions.\nLeverage AI, Agentic AI, and Generative AI tools to improve engineering workflows, data analysis, test development efficiency, and problem-solving effectiveness.\nMinimum Qualifications\nBachelor's degree in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related technical field.\n3+ years of experience in semiconductor characterization, failure analysis, product engineering, test engineering, or a related field.\nHands-on experience with laboratory equipment such as oscilloscopes, SMUs, power supplies, thermal systems, probe stations, or automated test hardware.\nProgramming experience in Python and at least one additional language such as C/C++ or Verilog.\nExperience analyzing complex datasets and driving root-cause investigations using statistical and engineering methods.\nPreferred Qualifications\nMaster's or PhD degree in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related field.\nExperience with DRAM, HBM, memory subsystems, advanced semiconductor packaging, or silicon characterization.\nKnowledge of thermal, mechanical stress, reliability, yield improvement, DOE methodologies, and power-performance correlation techniques.\nExperience working with MBIST analysis, parametric characterization, failure signatures, and semiconductor test methodologies.\nProficiency using AI-enabled tools, Agentic AI, Generative AI, or AI-assisted coding platforms (e.g., Claude Code, Code Assist) to improve engineering productivity, data analysis, and workflow automation.\nAs a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays.For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.\nMicron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.\nTo learn about your right to work click here.\nTo learn more about Micron, please visitmicron.com/careers\nFor US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at  or 1-800-336-8918 (select option #3)\nMicron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.\nMicron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.\nAI alert : Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.\nFraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.","description_format":"text","description_chars":6212,"description_truncated":false,"requirements":{"experience_years_min":3,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":["Parental leave"],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Enterprise Storage Systems","Semiconductor Manufacturing","Memory & Storage Chips"],"lifecycle":[{"event":"open","at":"2026-10-05T20:57:07Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 535 · green card filings: 199","filings_12m":535,"filings_prev_12m":562,"green_card_filings_12m":199,"median_offered_wage_usd":127078,"route":null,"cap_exempt":false,"checked_at":"2026-10-29T16:27:21+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":216}],"liveness":{"score":62,"band":"ok","label":"Likely open","p_open":1,"p_active":0.694,"p_room":0.9,"age_days":24,"expected_fill_days":49,"reasons":["conf:1","stale_co","urgency","velocity","win:mid","comp:junior,brand"],"computed_at":"2026-10-30T05:48:23Z"},"pay":null,"html_url":"https://alion.io/job/micron-technology-intern-engineer-hig-hbm-dtpco","json_url":"https://alion.io/job/micron-technology-intern-engineer-hig-hbm-dtpco.json","meta":{"generated_at":"2026-10-30T21:41:39Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":12243,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-31T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":37},"rest":"https://alion.io/mcp/rest/get_company?id=37"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fmicron-technology-intern-engineer-hig-hbm-dtpco"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fmicron-technology-intern-engineer-hig-hbm-dtpco"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fmicron-technology-intern-engineer-hig-hbm-dtpco"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/micron-technology-intern-engineer-hig-hbm-dtpco\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fmicron-technology-intern-engineer-hig-hbm-dtpco"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":1928244}},{"tool":"search_jobs","arguments":{"company":"micron.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":1928244},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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