Principal/Staff Engineer, PCVD Film Deposition, TD

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

JobSummary

We areseekinga highly motivated engineer to join our Technology Development team focused on advanced thin film deposition processes for next-generation memory technologies. This role spans responsibilities from process development to technical leadership, depending on experience level(Principal/Staff).

Key Responsibilities

• Develop andoptimizeadvanced thin film deposition processes (ALD, LPCVD, PECVD, PVD) forcutting-edgedevice architectures

• Design and execute complex DOE experiments to improve process capability, uniformity, and reliability

• Perform in-depth root-cause analysis using advanced modeling and characterization techniques

• Collaborate with integration,other process areas,metrology, and equipment engineering teams to solve critical technical challenges

• Drive innovation in film deposition for improved performance, cost efficiency, and sustainability

• Utilize advanced data analytics and modeling to predict process behavior and accelerate development cycles

• Define technology roadmaps and lead strategic research initiatives. Generate intellectual property and influence future deposition technology directions

• Mentor junior engineers and lead multi-disciplinary technical projects

Requirements:

Education:

• Ph.D/Master’sin Chemical Engineering, Materials Science, Electrical Engineering, Physics, or relatedfield

Experience:

• Master with minimum 8yearsor PhD withminimum 5 years hands-on experience in advanced thin film deposition,characterizationor related semiconductor field

Skills:

Core Technical:

• Expertisein ALD, LPCVD, PECVD, and PVD for advanced nodes

• Strong understanding of film growth mechanisms, surface chemistry, and plasma physics

• Knowledge of thermodynamics, chemical kinetics, and reaction engineering

Analytical & Modeling:

• Proficiencyin DOE, SPC, and advanced statistical analysis

• SomeFamiliarity with TCAD or process simulation tools for film modeling

• Data analytics and machine learning for process optimization

Characterization:

• Hands-on experience with TEM, SEM, XPS, SIMS,XRD,AFM,ellipsometry, and other thin film metrology

Problem-Solving:

• Advanced root-cause analysis and failure mode identification

• Ability to develop predictive models for process behavior

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations,please contact [email protected]

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