{"id":4197143,"url":"https://alion.io/job/microsoft-senior-package-design-engineer","title":"Senior Package Design Engineer","company":{"id":18,"name":"Microsoft","domain":"microsoft.com","url":"https://alion.io/company/microsoft","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"B","score":84,"open_postings":521,"ghost_share":0.01,"stale_share":0.568,"repost_share":0.05,"time_to_fill_p50_days":30,"computed_at":"2026-11-12T10:38:37Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Austin, United States","Hillsboro, United States","Mountain View, United States","Raleigh, United States","Washington, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":119800,"max":234700,"currency":"USD","period":"year","gross":null,"usd_annual":234700},"salary_estimate":null,"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Azure","optional":false},{"name":"Cadence Allegro","optional":false},{"name":"OneDrive","optional":false}],"status":"live","first_seen_at":"2026-11-09T16:44:08Z","employer_posted_date":"2026-11-12","last_verified_at":"2026-11-12T20:44:24Z","board_verified":true,"closed_at":null,"days_open":3,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":3},"description":"OverviewMicrosoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for engineers to help achieve that mission.\nThe Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state-of-the-art computer chips, notably the Azure Cobalt. Our solutions provide sustainable strategic advantages to Microsoft and enable our customers to achieve more.\nAs Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Silicon Manufacturing and Product Engineering (SMPE) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.\nWe are looking for a Senior Package Design Engineer to join the team.\n#SCHIE #CSME #SMPE\nResponsibilities\nTheSenior Package Design Engineer will be responsible for providing expertise, insight, and support to the Silicon development team through the entire life cycle of the product. In this role, you will be responsible for the design and implementation of new custom Silicon devices, in particular substrate, interposer, and bridge design. In addition, you will work with product architects, package technologists, and systems platform team on co-design and optimization of the silicon devices, through the whole product life cycle.\nSpecific responsibilities to include:\nOwn 2.5D/3D package designs (substrate, interposer and bridge) for Azure datacenter silicon from definition to tapeout.\nDevelop package architecture and floorplans for chiplet-based designs using advanced packaging technologies such as CoWoS and HBM integration.\nDrive package and PCB co-design: define BGA ballout and bump plans and optimize floorplans with SI/PI, silicon PD/RTL, PCB, DFT and ATE teams to meet system-level specs.\nDo package layout and routing in industry-standard EDA tools (e.g., Cadence APD/Allegro), and develop scripts and automation to improve design efficiency.\nRun package design signoff (DRC, LVS, LEC and DFM) and drive closure of all issues before tapeout.\nDefine and maintain package design requirements and specs, and keep design data, versions and documentation complete and traceable.\nWork with silicon and platform architects, board designers, and thermal, power and performance engineers to balance trade-offs and close on design decisions.\nWork with package technologists on the evaluation and recommendation of new packaging technology, device/package qualification and supplier assessment\nWork with external partners (OSATs, substrate and interposer suppliers, design-service partners) on design rules, design reviews and tapeout deliverables.\nHelp design test vehicles that validate new package technologies and design rules.\nIdentify design risks in new technologies and tool flows early, propose mitigations, and report status and issues to program leadership.\nManage die-to-interposer-to-substrate connectivity and netlists across multi-die designs, and keep them in sync through design changes (ECOs).\nDesign the package power delivery network (planes, layer stack-up, decoupling capacitor placement) with PI engineers to meet power integrity targets.\nGenerate and deliver package design data and extracted models to SI/PI, thermal and board teams for system-level analysis, and drive design iterations from the results.\nEvaluate and improve package design flows and methods, review designs, and mentor engineers.\nQualifications\nRequired Qualifications:\nDoctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience OR equivalent experience.\nOther Requirements\nAbility to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.\nThis role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.\nPreferred Qualifications:\nDoctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience.\nMaster’s Degree in Engineering or Hard Science areas related to Semiconductor Packaging\nSpecific experience with Advanced Semiconductor Package technologies (e.g. BGA/2.5D/3D)\nMaster’s Degree with 15 years of experience in semiconductor package product development\n10+ years hands-on experience in Semiconductor Package design, development, manufacturing, supplier management or quality management\nSpecific experience with Advanced Semiconductor Package technologies (e.g. BGA/2.5D/3D)\nFoundation in advanced packaging technologies, manufacturing and supplier management\nProficient in IC package or PCB board layout CAD tools Cadence Allegro*\nWorking knowledge in high-speed signaling, layout, electrical, mechanical and thermal co-designs.\nWorking knowledge in 2D and 3D simulation tools for full package layout extractions for power and signals analysis\nExperience with OSAT, Supplier & Foundry technologies.\nExperience in physical failure analysis\nExperience in subcontract supplier management.\nSilicon Engineering IC4 - The typical base pay range for this role across the U.S. is USD $119,800 - $234,700 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $160,200 - $261,000 per year.\nCertain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:\nhttps://careers.microsoft.com/us/en/us-corporate-pay\nThis position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.\nMicrosoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.","description_format":"text","description_chars":9160,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":true},"security_clearance":true,"languages":[]},"benefits":[],"hiring_locations":[{"name":"United States","iso":"US","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Cloud Platforms (IaaS & PaaS)","Office & Productivity Software","Gaming Consoles","Developer Tools"],"lifecycle":[{"event":"open","at":"2026-11-12T20:44:24Z"}],"visa":[{"country":"US","licensed_sponsor":true,"adverts_offering_sponsorship_24m":0,"sanctioned_now":false,"evidence":"H-1B filings in 12 months: 6,957 · green card filings: 2,767","filings_12m":6957,"filings_prev_12m":10319,"green_card_filings_12m":2767,"median_offered_wage_usd":167541,"route":null,"cap_exempt":false,"checked_at":"2026-11-12T07:36:15+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":86,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.86,"p_room":1,"age_days":3,"expected_fill_days":30,"reasons":["conf:3","win:early","comp:brand"],"computed_at":"2026-11-12T23:49:37Z"},"pay":{"stated_usd_annual":234700,"is_top_pay":true},"html_url":"https://alion.io/job/microsoft-senior-package-design-engineer","json_url":"https://alion.io/job/microsoft-senior-package-design-engineer.json","meta":{"generated_at":"2026-11-12T23:49:37Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":50303,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-13T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.1,"usd":0.01,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":18},"rest":"https://alion.io/mcp/rest/get_company?id=18"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fmicrosoft-senior-package-design-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"free","price":{"credits":0,"usd":0},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fmicrosoft-senior-package-design-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.1,"usd":0.01},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fmicrosoft-senior-package-design-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/microsoft-senior-package-design-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fmicrosoft-senior-package-design-engineer"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":4197143}},{"tool":"search_jobs","arguments":{"company":"microsoft.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":4197143},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. Docs: https://alion.io/developers"}}