{"id":2746578,"url":"https://alion.io/job/microsoft-seniorprincipal-optical-packaging-engineer","title":"Senior/Principal Optical Packaging Engineer","company":{"id":18,"name":"Microsoft","domain":"microsoft.com","url":"https://alion.io/company/microsoft","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"B","score":75,"open_postings":157,"ghost_share":0,"stale_share":0.987,"repost_share":0,"time_to_fill_p50_days":28,"computed_at":"2026-10-17T05:46:00Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"lead","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Cambridge, United Kingdom"],"countries":["GB"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":74700,"max":122600,"currency":"GBP","period":"year","gross":null,"usd_annual":163566},"salary_estimate":null,"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Azure","optional":false}],"status":"live","first_seen_at":"2026-09-17T08:51:11Z","employer_posted_date":"2026-09-17","last_verified_at":"2026-10-17T12:36:26Z","board_verified":true,"closed_at":null,"days_open":30,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":30},"description":"OverviewAt Microsoft Research, we are shaping the next generation of AI infrastructure through long-horizon programmes spanning devices, systems, software and hardware.\nAs a Principal Optical Packaging Engineer, you will own the package architecture and assembly strategy for emerging optical interconnect and co-packaged optics technologies as they move from research prototypes toward deployable infrastructure. You will join a multidisciplinary team working at the intersection of optics, electronics, photonics, packaging, networking, and AI system design. Working across research, Azure engineering, product teams, suppliers, and external partners, you will translate system-level optical, electrical, thermal, and mechanical requirements into package architectures, component specifications, assembly and process requirements, test vehicles, and qualification strategies, while working through trade-offs and risk management across optics, electronics, packaging, thermal, mechanical, networking, manufacturing, and reliability. You will bring experience across advanced semiconductor packaging and optical integration, work at the interface between research and productisation, and be able to problem solve around real-world constraints such as yield, assembly, cost, and reliability. In this role you will work hands-on with emerging technologies, collaborating with researchers, internal product teams, and Tier-1 partners to translate research into deployable systems.\nMicrosoft’s mission is to empower every person and every organisation on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realise our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.\nResponsibilities\nShape next-generation optical and advanced packaging technologies for AI infrastructure and high-performance computing.\nWork at the intersection of optics, photonics, semiconductor packaging, silicon, networking, and AI system design.\nInfluence package architectures integrating photonic devices, electronic ICs, ASICs/chiplets, interposers, optical interfaces, and thermal solutions.\nCollaborate across research, engineering, sourcing, manufacturing, and product teams, as well as with industry partners.\nHelp move technologies across the complete lifecycle, from architecture and prototype development through supplier qualification and production readiness.\nTranslate advanced research and packaging innovation into scalable technologies with real-world product impact.\nQualifications\nRequired/Minimum Qualifications\nBachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Optical Engineering, Physics, or a related technical field, or equivalent practical experience.\n5+ years of industry experience in advanced semiconductor packaging, optical/photonics packaging, heterogeneous integration, electronic packaging, or related hardware technologies.\nExperience in advanced packaging and assembly, in one or more of the following areas: 2.5D/3D integration, interposers/RDL, fine-pitch interconnects, die attach/bonding, underfill, moulding, adhesives, and thermal management.\nExperience integrating optical/photonics devices with electronic ICs and package structures, with an understanding of several of the following: optical coupling and alignment, electrical interconnects, thermal/mechanical behaviour, package reliability, and manufacturability.\nHands-on experience in one or more stages of the package development and productisation lifecycle, including process characterisation, design validation, reliability qualification, failure analysis, DFM, and manufacturing readiness.\nExperience working with one or more types of external manufacturing or technology partner, such as foundries, OSATs, optical component/module suppliers, equipment suppliers, or material suppliers, including activities such as technical assessments or manufacturing-readiness reviews.\nAdditional or Preferred Qualifications (The following experience would be beneficial, but candidates are not expected to meet every criterion)\nMaster’s degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Optical Engineering, Physics, or a related technical discipline.\nExperience with co-packaged optics (CPO), optical I/O, silicon photonics, optical engines, lasers, or high-speed optical interconnects.\nExperience with advanced packaging technologies such as CoWoS, SoIC, EMIB, fan-out packaging, chiplet integration, wafer-level packaging, or interposer-based heterogeneous integration.\nExperience with fibre attach, active/passive optical alignment, optical coupling, lens integration, alignment tolerance analysis, or optical link-budget evaluation.\nKnowledge of package thermal-mechanical behaviour and reliability, including stress, warpage, thermal expansion, heat dissipation, adhesion, delamination, and related failure mechanisms.\nExperience developing technologies for AI infrastructure, high-performance computing, high-speed networking, datacentre systems, or other high-bandwidth applications.\nResearch Sciences IC4 - The typical base pay range for this role across United Kingdom is £ 74,700.00 - £ 122,600.00 per year. Certain roles may be eligible for benefits and other compensation.\nFind additional benefits and pay information here:\nhttps://careers.microsoft.com/v2/global/en/corporate-pay/united-kingdom-corporate-pay.html\nResearch Sciences IC5 - The typical base pay range for this role across United Kingdom is £ 93,500.00 - £ 161,800.00 per year. Certain roles may be eligible for benefits and other compensation.\nFind additional benefits and pay information here:\nhttps://careers.microsoft.com/v2/global/en/corporate-pay/united-kingdom-corporate-pay.html\nThis position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.\nMicrosoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. 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