{"id":2300585,"url":"https://alion.io/job/mobileye-ic-package-layout-engineer","title":"IC Package Layout Engineer","company":{"id":174,"name":"Mobileye","domain":"mobileye.com","url":"https://alion.io/company/mobileye","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Lever","truth_index":{"grade":"B","score":75,"open_postings":57,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":null,"computed_at":"2026-10-12T06:55:09Z"}},"role":"Hardware","role_family":"Hardware","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Jerusalem, Israel"],"countries":["IL"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":96000,"max_usd":227000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":1605},"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Cadence Allegro","optional":false},{"name":"CAM350","optional":true},{"name":"Mentor Xpedition","optional":true}],"status":"live","first_seen_at":"2026-10-08T18:52:01Z","employer_posted_date":"2026-10-08","last_verified_at":"2026-10-12T16:06:13Z","board_verified":true,"closed_at":null,"days_open":3,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":3},"description":"Mobileye develops purpose-built hardware and AI technologies that power advanced driver-assistance and autonomous-driving solutions. Our EyeQ™ SoCs and imaging radar technologies are designed to deliver scalable, automotive-grade performance and help enable safer mobility worldwide.\nJoin our advanced packaging team and take ownership of package-substrate layout for cutting-edge digital and RF products. You will collaborate with silicon, package, SI/PI, PCB, manufacturing, and OSAT teams to deliver high-quality, manufacturable package layouts that meet demanding automotive requirements\nWhat will your job look like:\nOwn IC package-substrate layout from feasibility through manufacturing release.\nPerform die placement, bump fan-out, ball-map planning, package-size estimation, and layer planning.\nSet up stack-ups, padstacks, design rules, and layout constraints.\nImplement high-density bump-to-ball routing for signal, power, and ground nets.\nRoute high-speed and RF interfaces according to defined SI/PI constraints.\nPerform DRC, connectivity, LVS/netlist, and DFM checks.\nGenerate artwork, fabrication drawings, reports, and release documentation.\nResolve layout-related queries from substrate manufacturers and OSATs.\nAll you need is:\nB.Sc. in Electrical Engineering or a related field, or equivalent practical experience.\n5+ years of hands-on IC package-substrate layout experience.\nStrong proficiency with Cadence Allegro Package Designer.\nExperience with flip-chip BGA, bump fan-out, ball-map optimization, and multilayer substrate routing.\nExperience working from schematics, netlists, design rules, and constraint documents.\nGood understanding of high-speed layout principles, including differential pairs, length matching, spacing, and return paths.\nGood understanding of power-delivery and power-integrity layout principles, including power and ground plane design, current-carrying requirements, and via-array implementation.\nExperience with DRC, connectivity verification, DFM, and manufacturing-data release.\nStrong attention to detail and the ability to independently own designs through release.\nNice to have:\nExperience with RF, SiP, multi-die, interposer, or 2.5D package layouts.\nExperience with DDR, PCIe, SerDes, MIPI, or UFS interfaces.\nExperience with Siemens Xpedition Package Designer or CAM350.\nExperience working directly with substrate manufacturers and OSATs.\nExperience with scripting for package-layout automation.","description_format":"text","description_chars":2451,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Autonomous Driving","Computer Vision","Automotive Components"],"lifecycle":[{"event":"open","at":"2026-10-11T21:06:23Z"}],"visa":[],"liveness":{"score":60,"band":"ok","label":"Likely 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