{"id":2778721,"url":"https://alion.io/job/nexperia-engineer-iii-diebond","title":"Engineer III (Diebond)","company":{"id":4240,"name":"Nexperia","domain":"nexperia.com","url":"https://alion.io/company/nexperia","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"A","score":85,"open_postings":10,"ghost_share":0,"stale_share":0.4,"repost_share":0,"time_to_fill_p50_days":65,"computed_at":"2026-10-19T05:45:15Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"middle","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Seremban, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":12000,"max_usd":27000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":4825},"experience_years_min":2,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-16T00:00:00Z","employer_posted_date":"2026-10-16","last_verified_at":"2026-10-19T01:02:55Z","board_verified":true,"closed_at":null,"days_open":3,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":3},"description":"About the Role\nAs a Development Die Bond Engineer, you will be responsible for developing, qualifying, and industrializing new die attach technologies, processes, materials, and equipment for semiconductor packaging applications. You will play a key role in bringing new products and advanced packaging solutions from concept to high-volume manufacturing.\nWorking closely with R&D, Product Development, Process Engineering, Quality, and Operations teams, you will drive innovation and ensure robust, scalable, and cost-effective die bond solutions that meet future technology requirements.\nWhat will you do\nDevelop and qualify new die bond processes, materials, and assembly technologies.\nLead process development activities for new semiconductor packages and products.\nDesign and execute experiments (DOE) to optimize process performance and reliability.\nEvaluate and introduce new die bonding equipment, tools, and process capabilities.\nSupport technology transfer from development to mass production.\nConduct process characterization, capability studies, and reliability assessments.\nPerform root cause analysis for development-related process challenges.\nCollaborate with suppliers and equipment vendors on emerging technologies and process solutions.\nGenerate technical documentation, process specifications, and qualification reports.\nWhat will you need\nBachelor's Degree in Electrical Engineering, Electronic Engineering, Mechatronics Engineering, Manufacturing Engineering, Materials Engineering, or a related field.\n2-5 years of experience in semiconductor assembly, die attach/die bond process engineering, or advanced manufacturing.\nFresh graduates with strong academic achievements and relevant industrial exposure may be considered for entry-level positions.\nTalent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.\nD&I Statement\nAs an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.\nIn addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. 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