{"id":3303501,"url":"https://alion.io/job/nexperia-mold-process-development-engineer","title":"Mold Process Development Engineer","company":{"id":4240,"name":"Nexperia","domain":"nexperia.com","url":"https://alion.io/company/nexperia","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"A","score":85,"open_postings":12,"ghost_share":0,"stale_share":0.417,"repost_share":0,"time_to_fill_p50_days":64,"computed_at":"2026-10-30T05:48:23Z"}},"role":"Biotech","role_family":"Biotech","seniority":"junior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Seremban, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":12500,"max_usd":32000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":183},"experience_years_min":1,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Design of Experiments","optional":false},{"name":"FMEA","optional":false},{"name":"Minitab","optional":false},{"name":"Statistical Process Control","optional":false}],"status":"live","first_seen_at":"2026-10-26T00:00:00Z","employer_posted_date":"2026-10-26","last_verified_at":"2026-10-29T23:09:50Z","board_verified":true,"closed_at":null,"days_open":4,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":4},"description":"About the Role\nAs a Mold Process Development Engineer, you will be responsible for driving the development, characterization, and industrialization of advanced molding technologies for semiconductor packages. You will play a critical role in enabling new package platforms, improving process robustness, and supporting Nexperia's technology roadmap through innovative process solutions and technical leadership. Working closely with cross-functional and global teams, you will contribute to delivering reliable, manufacturable, and cost-effective package solutions that meet customer and business requirements.\nWhat Will You Do?\nDevelop and characterize for new process technology. \nResponsible to ensure technical communication and information flow within the project team and guiding technical discussions on Molding topics. Experience with other EOL processes is advantageous. \nConduct competitor benchmarking and technology studies to input on Nexperia package roadmap. \nTechnical input for assembly process / equipment solutions for assigned new products or platform. \nUnderstand the process integration risk and come out with a risk mitigation plan. \nProvide technical solution starting from development to establish robust package manufacturability and reliability.\nProvide technical support on molding for both internal and external customer. \nDemonstrate technical leadership in subject matter and drive process challenges with cross site members.\nWhat Will You Need?\nQualifications & Experience\nBachelor's Degree in Engineering or a related technical discipline.\n1-2 years of experience in a manufacturing environment, preferably within the semiconductor industry.\nHands-on experience in molding backend assembly processes.\nExperience with wire-bonded and clip-bonded package technologies is preferred.\nExposure to other End-of-Line (EOL) assembly processes will be an added advantage.\nFamiliarity with process development methodologies, including Design of Experiments (DOE), Failure Mode and Effects Analysis (FMEA), and statistical analysis techniques.\nTechnical Competencies\nStrong knowledge of semiconductor assembly and molding processes.\nProficient in statistical analysis and quality improvement methodologies, including: DOE (Design of Experiments) SPC (Statistical Process Control) FMEA (Failure Mode and Effects Analysis) 8D Problem Solving Minitab or equivalent statistical software\nKnowledge of Six Sigma principles and process optimization techniques.\nStrong analytical and troubleshooting skills with a structured approach to problem-solving.\nAbility to identify process risks and develop effective mitigation strategies.\nSoft Skills\nExcellent communication skills with strong written and verbal proficiency in English.\nStrong interpersonal skills with the ability to collaborate effectively across diverse teams and functions.\nDemonstrated leadership potential with the ability to influence and drive technical discussions.\nHighly motivated, proactive, and customer-focused with a sense of urgency in resolving issues.\nStrong teamwork, stakeholder management, and relationship-building capabilities.\nAbility to thrive in a dynamic, fast-paced development environment while managing multiple priorities.\nTalent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.\nD&I Statement\nAs an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.\nIn addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. 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