{"id":1500844,"url":"https://alion.io/job/nexperia-sr-wirebond-process-development-engineer","title":"Sr Wirebond Process Development Engineer","company":{"id":4240,"name":"Nexperia","domain":"nexperia.com","url":"https://alion.io/company/nexperia","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"A","score":88,"open_postings":11,"ghost_share":0,"stale_share":0.273,"repost_share":0,"time_to_fill_p50_days":67,"computed_at":"2026-10-01T05:45:00Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Seremban, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":15000,"max_usd":34000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":3947},"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-09-30T03:55:26Z","employer_posted_date":"2026-09-30","last_verified_at":"2026-10-01T15:39:34Z","board_verified":true,"closed_at":null,"days_open":1,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":1},"description":"As a Sr Process Development Engineer (WB), you will develop and optimize semiconductor assembly processes to meet project Functional Requirement Specifications (FRS), ensuring robust manufacturability, reliability, and high-quality output for new products and platforms.\nWhat You Will Do\nDevelop and characterize new semiconductor process technologies, applying structured engineering methods such as DOE, SPC, FMEA, and Six Sigma\nDrive end-to-end process development from concept to stable, high-yield manufacturing solutions\nProvide technical input for assembly processes and equipment solutions for new products and platforms\nLead technical discussions and troubleshooting on wire bond and related FOL processes across project teams and sites\nApply wafer metallization knowledge to optimize process performance and stability\nConduct benchmarking and technology studies to support package roadmap and continuous improvement initiatives\nUse statistical analysis tools (e.g. Minitab/Statistica) to analyze process performance and drive data-based decisions\nProvide technical support for wire bond-related issues for both internal and external customers\nDemonstrate technical leadership in cross-site problem solving and process improvement activities\nCommunicate effectively across teams, ensuring clear technical alignment and fast response to manufacturing challenges\nWhat You Will Need\nBachelor’s degree in engineering or an equivalent related field of study\nAt least 5 years of experience in semiconductor or manufacturing environment\nHands-on experience in FOL processes (wafer dicing, die bond, plasma, wire bond, AOI)\nStrong knowledge of wire bond packaging technologies\nExperience applying Six Sigma methodologies and statistical tools (DOE, SPC, FMEA, 8D, Minitab/Statistica)\nStrong analytical, problem-solving, and data interpretation skills\nGood communication skills in fluent English\nStrong teamwork, interpersonal skills, and ability to work across functions and sites\nStrong ownership, responsiveness, and ability to handle customer or production issues effectively\nTalent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.\nD&I Statement\nAs an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.\nIn addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.","description_format":"text","description_chars":3032,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"Advanced (C1)","optional":false}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Semiconductor Manufacturing","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-09-30T03:55:26Z"}],"liveness":{"score":90,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.903,"p_room":1,"age_days":1,"expected_fill_days":67,"reasons":["conf:25","velocity","win:early","comp:brand"],"computed_at":"2026-10-01T05:45:00Z"},"pay":null,"html_url":"https://alion.io/job/nexperia-sr-wirebond-process-development-engineer","json_url":"https://alion.io/job/nexperia-sr-wirebond-process-development-engineer.json","meta":{"generated_at":"2026-10-02T01:14:39Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","usage":{"tier":"crawler","counted_by":"address","units_charged":1,"used_today":1424,"day_limit":5000,"remaining_today":3576,"minute_limit":60,"resets_at":"2026-10-03T00:00:00Z"}}}